Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2002
06/04/2002US6398868 Substrate coating apparatus
06/04/2002US6398855 Method for depositing copper or a copper alloy
06/04/2002US6398846 Gas purifier equipped with dual temperature detector which signals onset of exothermic reaction when high concentrations of impurities are present, inhibits formation of eutectic and shuts down column before breach of vessel
06/04/2002US6398827 Stable aqueous spherical moniliform colloidal silica bonded with metal oxide; monoplanar; iron oxide or inorganic salt accelerator; alumina disks; silica surfaces; semiconductorwafers
06/04/2002US6398823 Dynamic break for non-contact wafer holder
06/04/2002US6398631 Method and apparatus to place wafers into and out of machine
06/04/2002US6398626 Polishing apparatus
06/04/2002US6398624 Method of flattening a surface of a semiconductor film
06/04/2002US6398623 Processing method of device and processing method of slider
06/04/2002US6398621 Carrier head with a substrate sensor
06/04/2002US6398476 Automatic storage unit and automatic storing method
06/04/2002US6398475 Container
06/04/2002US6398430 Semiconductor device fabrication system
06/04/2002US6398373 Pneumatic control system and method for shaping deformable mirrors in lithographic projection systems
06/04/2002US6398099 Apparatus for manufacturing plug and method of manufacturing the same
06/04/2002US6398098 Wire bonding head involving minimized tip skid
06/04/2002US6398033 Wafer container with retractable handle
06/04/2002US6398032 SMIF pod including independently supported wafer cassette
06/04/2002US6397990 Materials transport system having inductive power transfer
06/04/2002US6397883 Equipment skid
06/04/2002US6397775 Deposited film forming system and process
06/04/2002US6397465 Connection of electrical contacts utilizing a combination laser and fiber optic push connect system
06/04/2002US6397460 Electrical connector
06/04/2002CA2364053A1 Polishing slurry for the chemical-mechanical polishing of metal and dielectric structures
06/04/2002CA2036241C Thin film electrical component
05/2002
05/30/2002WO2002043455A1 Method of manufacturing ceramic multi-layer substrate, and unbaked composite laminated body
05/30/2002WO2002043207A1 Electrically pumped polycrystalline zno laser and method for making same
05/30/2002WO2002043159A2 Doped semiconductor nanocrystals
05/30/2002WO2002043158A1 Dual bit multi-level ballistic monos memory, and manufacturing method, programming, and operation process for the memory
05/30/2002WO2002043157A1 Semiconductor device and its manufacturing method
05/30/2002WO2002043156A2 Hemt and communication system using the same
05/30/2002WO2002043155A2 Bipolar transistor with lattice matched base layer
05/30/2002WO2002043153A1 Method for manufacturing semiconductor wafer
05/30/2002WO2002043152A2 Poly fuse rom
05/30/2002WO2002043151A1 Semiconductor device and method for fabricating the same
05/30/2002WO2002043150A1 Pad protective circuit
05/30/2002WO2002043149A1 Semiconductor device
05/30/2002WO2002043147A1 Integrated circuit configuration that is protected against analysis, and method for producing the configuration
05/30/2002WO2002043145A1 Integrated passive devices with reduced parasitic substrate capacitance
05/30/2002WO2002043141A1 Method for hermetic sealing of electronic parts
05/30/2002WO2002043140A2 Imaging layer as hard mask for organic low-k materials
05/30/2002WO2002043139A2 Two mask via pattern to improve pattern definition
05/30/2002WO2002043138A1 Method and device for alignment
05/30/2002WO2002043137A2 Bump formation method and bump forming apparatus to semiconductor wafer
05/30/2002WO2002043135A1 Semiconductor device and its manufacturing method
05/30/2002WO2002043133A1 Alignment method for chip mounter
05/30/2002WO2002043132A1 Method for fabricating a self-aligned emitter in a bipolar transistor
05/30/2002WO2002043131A1 Tantalum oxide film, use thereof, and method and composition for forming the same
05/30/2002WO2002043129A2 Method for determinating an endpoint during cmp of a semiconductor wafer
05/30/2002WO2002043128A1 Polishing device and method of manufacturing semiconductor device
05/30/2002WO2002043127A1 Method of forming a semiconductor structure
05/30/2002WO2002043125A2 Ald method to improve surface coverage
05/30/2002WO2002043124A2 Method for making a substrate in particular for optics, electronics or optoelectronics and resulting substrate
05/30/2002WO2002043121A2 Bright field image reversal for contact hole patterning
05/30/2002WO2002043119A2 An ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device, a method for fabricating the same, and an electronic device containing the same
05/30/2002WO2002043118A2 Wafer-level transfer of membranes in semiconductor processing
05/30/2002WO2002043117A2 Trench gate fermi-threshold field effect transistors and methods of fabricating the same
05/30/2002WO2002043116A2 Etching of high aspect ratio features in a substrate
05/30/2002WO2002043115A2 Surface preparation prior to deposition
05/30/2002WO2002043114A2 Plasma enhanced pulsed layer deposition
05/30/2002WO2002043112A2 Method for making a substrate
05/30/2002WO2002043111A2 Method for forming and filling isolation trenches
05/30/2002WO2002043109A2 Method for producing a planar field effect transistor and a planar field effect transistor
05/30/2002WO2002043104A2 Hybrid scanning system and methods for ion implantation
05/30/2002WO2002043103A2 Extraction and deceleration of low energy beam with low beam divergence
05/30/2002WO2002043102A1 Electron-beam generating apparatus and electron-beam exposure apparatus
05/30/2002WO2002043071A1 A ferroelectric memory circuit and method for its fabrication
05/30/2002WO2002043067A2 Integrated memory with an arrangement of non-volatile memory cells and method for the production and operation of an integrated memory
05/30/2002WO2002042996A1 Chip module and chip card module for producing a chip card
05/30/2002WO2002042847A1 Process and mask projection system for laser crystallization processing of semiconductor film regions on a substrate
05/30/2002WO2002042845A2 Photoacid generators and photoresists comprising same
05/30/2002WO2002042785A1 Control by excitation and display of a substance with modifiable absorbed wavelength
05/30/2002WO2002042754A2 Measurement of surface defects
05/30/2002WO2002042389A1 Wafer machining adhesive tape, and its manufacturing method and using method
05/30/2002WO2002042241A1 Aluminum nitride sintered body, method for producing aluminum nitride sintered body, ceramic substrate and method for producing ceramic substrate
05/30/2002WO2002042033A1 Semiconductor wafer, polishing apparatus and method
05/30/2002WO2002042013A1 An in situ module for particle removal from solid-state surfaces
05/30/2002WO2002027753A3 System and method for delivering cooling gas from atmospheric pressure to a high vacuum through a rotating seal in a batch ion implanter
05/30/2002WO2002017380A3 Selective flux deposition
05/30/2002WO2002008831A3 Reticle storage and retrieval system
05/30/2002WO2002008500A3 In situ regrowth and purification of crystalline thin films
05/30/2002WO2002007203A3 Plasma rie polymer removal
05/30/2002WO2002007194A8 Cleaning gas for semiconductor production equipment
05/30/2002WO2002005333A3 Dual post centrifugal wafer clip for spin rinse dry unit
05/30/2002WO2002005322A3 Automatic slit/gate valve
05/30/2002WO2002003466A3 Mos transistor integration
05/30/2002WO2002003459A3 High-speed low-power semiconductor memory architecture
05/30/2002WO2002002279A3 Grooved polishing pads and methods of use
05/30/2002WO2001099159A3 Reduction of black silicon in deep trench etch
05/30/2002WO2001098838A3 Method of forming optical images, mask for use in this method, method of manufacturing a device using this method, and apparatus for carrying out this method
05/30/2002WO2001098563A3 Orientation independent oxidation of silicon
05/30/2002WO2001097266A8 Method of manufacturing thin-film semiconductor device
05/30/2002WO2001097256A3 A method of and apparatus for monitoring a ball forming process
05/30/2002WO2001095377A3 Methods for forming and integrated circuit structures containing enhanced-surface-area conductive layers
05/30/2002WO2001095352A3 Apparatus and method for accelerating electrons in a plasma reactor
05/30/2002WO2001092428A3 Heterostructure with rear-face donor doping
05/30/2002WO2001091188A3 Semiconductor structures for hemt
05/30/2002WO2001089284A3 Trench capacitor with insulation collar stack, and method of forming thereof
05/30/2002WO2001088992A3 Semiconductor power component
05/30/2002WO2001086709A3 Simplified method to produce nanoporous silicon-based films