Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2002
06/06/2002US20020068383 Chip size package semiconductor device and method of forming the same
06/06/2002US20020068382 Method for mounting flip chip on circuit board through reliable electrical connections at low contact resistance
06/06/2002US20020068381 Ultra-fine contact alignment
06/06/2002US20020068380 Semiconductor device and manufacturing method thereof
06/06/2002US20020068379 Adhesive composition for use in packaging applications
06/06/2002US20020068378 Metal foil laminated ic package
06/06/2002US20020068377 Method of forming a film of a semiconductor device
06/06/2002US20020068376 Method for fabricating contact hole
06/06/2002US20020068375 Structure of a semiconductor module and method of manufacturing the same
06/06/2002US20020068374 The GaN compound semiconductor layer to which the P type impurity is doped is irradiated with electromagnetic radiation of a predetermined wavelength to selectively agitate hydrogen bonds to dissociate H, and activate impurity
06/06/2002US20020068372 Thin-film semiconductor device
06/06/2002US20020068371 Temperature measuring method and apparatus in semiconductor processing apparatus, and semiconductor processing method and apparatus
06/06/2002US20020068369 Intermediate structures in porous substrates in which electrical and optical microdevices are fabricated and intermediate structures formed by the same
06/06/2002US20020068242 Exposing a resist layer of a polymer material that has at least one saturated alicycle substitited with fluorine atoms to vacuum ultraviolet rays for patterning into a predetermined shape
06/06/2002US20020068238 Positive-working photoresist composition
06/06/2002US20020068230 Irradiating with ion beam, determining a correlation between time for ion-beam irradiation and amount of frequency changes, measuring and adjusting to a target value
06/06/2002US20020068228 Irradiating opaque or semi-transmission film on a transparent substrate with an ion source to reduce stress
06/06/2002US20020068201 Providing expitaxially compatible sacrificial template, depositing single crystal aluminum, gallium indium nitride material on template to form composite sacrificial template/nitride article, parting
06/06/2002US20020068188 Method for depositing metal and metal oxide films and patterned films
06/06/2002US20020068181 Ether-like compound including a siliconethoxy, silicondiethoxy, or silicontriethoxy species attached to a naphthalene or anthracene chromophore via an oxygen linkage
06/06/2002US20020068178 Formed by varying temperature within reaction chamber while layer of material is formed
06/06/2002US20020068132 Method and apparatus for smoothing thin conductive films by gas cluster ion beam
06/06/2002US20020068129 MOCVD of SBT using toluene-based solvent system for precursor delivery
06/06/2002US20020068005 Metal composite powder which is obtained by reducing the oixdes of metal with hydrogen, is mixed with a protecting liquid in an inert atmosphere before mixing with the binder, then injection molding and forming the composite
06/06/2002US20020067985 Work piece wand and method for processing work pieces using a work piece handling wand
06/06/2002US20020067982 Pickup apparatus for semiconductor chips
06/06/2002US20020067981 Wafer transport system
06/06/2002US20020067918 Heat-treating methods and systems
06/06/2002US20020067917 Vaporizer and apparatus for vaporizing and supplying
06/06/2002US20020067651 Charge pump for negative differential resistance transistor
06/06/2002US20020067642 Semiconductor memory
06/06/2002US20020067641 Usage of word voltage assistance in twin MONOS cell during program and erase
06/06/2002US20020067639 Row decoder of a NOR-type flash memory device
06/06/2002US20020067637 Semiconductor memory
06/06/2002US20020067636 Static semiconductor memory device
06/06/2002US20020067633 Semiconductor integrated circuit
06/06/2002US20020067585 Electrostatic wafer chucks and charged-particle-beam exposure apparatus comprising same
06/06/2002US20020067583 Circuit arrangement
06/06/2002US20020067581 Magnetoresistive device and/or multi-magnetoresistive device
06/06/2002US20020067550 Illumination apparatus and projection exposure apparatus
06/06/2002US20020067490 Pattern inspecting apparatus, pattern inspecting method, aligner, and method of manufacturing electronic device
06/06/2002US20020067478 Method of and apparatus for article inspection including speckle reduction
06/06/2002US20020067477 Patten inspection apparatus, and exposure apparatus control system using same
06/06/2002US20020067473 Reference plate, exposure apparatus, device manufacturing system, device manufacturing method, semiconductor manufacturing factory, and exposure apparatus maintenance method
06/06/2002US20020067459 Method for manufacturing display panel
06/06/2002US20020067197 Phase adjustor for semiconductor integrated circuit
06/06/2002US20020067188 Method and apparatus for reduction of noise sensitivity in dynamic logic circuits
06/06/2002US20020067183 Methods of engaging electrically conductive pads on a semiconductor substrate
06/06/2002US20020067181 Probe card assembly and kit, and methods of making same
06/06/2002US20020067179 Probe card for testing an LSI operating on two power source voltages
06/06/2002US20020067177 Parameter monitoring apparatus for high voltage chamber in semiconductor wafer processing system
06/06/2002US20020066966 Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages
06/06/2002US20020066965 Semiconductor chip having pads with plural junctions for different assembly methods
06/06/2002US20020066964 Semiconductor device
06/06/2002US20020066963 Ball-less clip bonding
06/06/2002US20020066960 Method of forming vias in silicon carbide and resulting devices and circuits
06/06/2002US20020066959 Passivation scheme for bumped wafers
06/06/2002US20020066958 Dual damascene and method of making the same
06/06/2002US20020066954 Super low profile package with high efficiency of heat dissipation
06/06/2002US20020066952 Semiconductor device having an interconnecting post formed on an interposer within a sealing resin
06/06/2002US20020066950 Flip chip in leaded molded package with two dies
06/06/2002US20020066949 BGA package and method of manufacturing the same
06/06/2002US20020066947 Multimedia chip package
06/06/2002US20020066946 Tape carrier package
06/06/2002US20020066944 Packaged semiconductor and process for manufacturing the same
06/06/2002US20020066942 Electronic component and utilization of a guard structure contained therein
06/06/2002US20020066941 Semiconductor device and method of manufacturing the same capable of reducing deterioration of low dielectric constant film
06/06/2002US20020066940 Freeform substrates and devices
06/06/2002US20020066939 Sidewalls as semiconductor etch stop and diffusion barrier
06/06/2002US20020066935 Mis transistor and method of fabricating the same
06/06/2002US20020066934 Eeprom with high channel hot carrier injection efficiency
06/06/2002US20020066933 Negative differential resistance field effect transistor (NDR-FET) & circuits using the same
06/06/2002US20020066932 Semiconductor structure having an interconnect and method of producing the semiconductor structure
06/06/2002US20020066931 Thin film transistor and method of manufacturing the same
06/06/2002US20020066930 Field MOS transistor and semiconductor integrated circuit including the same
06/06/2002US20020066928 Semiconductor device and manufacturing method thereof
06/06/2002US20020066927 Semiconductor device and method of manufacturing the same
06/06/2002US20020066925 Structure and method for forming a body contact for vertical transistor cells
06/06/2002US20020066924 High voltage power MOSFET having low on-resistance
06/06/2002US20020066921 Storage capacitor and associated contact-making structure and a method for fabricating the storage capacitor and the contact-making structure
06/06/2002US20020066920 Methods of forming dielectric materials, methods of forming capacitors, and capacitor constructions
06/06/2002US20020066919 BEOL decoupling capacitor
06/06/2002US20020066918 Method of manufacturing storage electrode in semiconductor device
06/06/2002US20020066917 DRAM with vertical transistor and trench capaitor memory cells and method of fabrication
06/06/2002US20020066916 Forming electronic structures having dual dielectric thicknesses and the structure so formed
06/06/2002US20020066915 Method of producing a ferroelectric memory and a memory device
06/06/2002US20020066914 Ferroelectric memory and manufacturing method thereof
06/06/2002US20020066913 MOSFET with both elevated source-drain and metal gate and fabricating method
06/06/2002US20020066912 Semiconductor device
06/06/2002US20020066909 Heterojunction bipolar transistor and method of producing the same
06/06/2002US20020066908 Aluminum gallium nitride/gallium nitride high electron mobility transistors having a gate contact on a gallium nitride based cap segment and methods of fabricating same
06/06/2002US20020066906 IGBT with PN insulation and production method
06/06/2002US20020066903 Adhesion and/or encapsulation of silicon carbide-based semiconductor devices on ceramic substrates
06/06/2002US20020066902 6599784 withdrawn after electronic O.G. published
06/06/2002US20020066899 Silicon wafer with embedded optoelectronic material for monolithic OEIC
06/06/2002US20020066884 Etching gas for silicon etch back
06/06/2002US20020066872 Ion implantation system and ion implantation method
06/06/2002US20020066870 Mask for electron beam projection lithography and method of fabricating the same
06/06/2002US20020066806 Nozzle and adjust module
06/06/2002US20020066776 Method for forming end-face electrode