Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2002
06/13/2002DE19900805C2 Verfahren und Vorrichtung zur Erzeugung von Reinstwasser Method and apparatus for production of ultrapure water
06/13/2002DE10160960A1 Semiconducting component has fourth semiconducting region of lower impurity concentration than first region, enclosing first region, arranged between second and third regions
06/13/2002DE10154942A1 Slide used for simultaneously removing material from both sides of semiconductor wafers between rotating plates comprises base body surface, surface of recess for receiving wafer, and surface of further recesses
06/13/2002DE10146825A1 Programmierbare Impedanzsteuerschaltung Programmable impedance control circuit
06/13/2002DE10139322A1 Vorrichtung und Verfahren zum Drahtbonden Apparatus and method for wire bonding
06/13/2002DE10134561A1 Hochfrequenz-Leistungsverstärker High frequency power amplifier
06/13/2002DE10061199A1 Verfahren zur Herstellung von schnellen vertikalen npn-Bipolartransistoren und komplementären MOS-Transistoren auf einem Chip A process for producing fast vertical npn bipolar transistors and complementary MOS transistors on a chip
06/13/2002DE10061191A1 Schichten in Substratscheiben Layers in substrate wafers
06/13/2002DE10060439A1 Contact metallization used in production of semiconductors contains copper distributed in partial volume
06/13/2002DE10059836A1 Structuring dielectric layer used in semiconductor industry comprises preparing substrate consisting of dielectric layer and mask, and etching dielectric layer
06/13/2002DE10059498A1 Substrat mit einer halbleitenden Schicht, elektronisches Bauelement mit diesem Substrat, elektronische Schaltung mit mindestens einem solchen elektronischen Bauelement, druckbare Zusammensetzung sowie Verfahren zur Herstellung eines Substrats Substrate having a semiconductive layer, an electronic component with said substrate, electronic circuit with at least one such electronic device printable composition and process for the preparation of a substrate
06/13/2002DE10059386A1 Verfahren und Vorrichtung zur dosierten Abgabe kleiner Flüssigkeitsvolumenströme Method and device for metered delivery of low volumetric flows of liquid
06/13/2002DE10059345A1 Semiconducting substrate holder for chemical-mechanical polishing has base body, protruding guide ring attached to base body, protruding step, sealing film on main surface and step
06/13/2002DE10059182A1 Schaltungsanordnung zum zerstörungsfreien, selbstnormierenden Auslesen von MRAM-Speicherzellen Circuit arrangement for non-destructive, selbstnormierenden reading MRAM memory cells
06/13/2002DE10059181A1 Integrated magnetoresistive semiconductor memory has integrated connecting conductors located in any one of metallization planes and polysilicon connection plane
06/13/2002DE10059143A1 Oberflächenbehandlungs- und Deckschichtverfahren zur Herstellung einer Kupfergrenzfläche in einem Halbleiterbauteil Surface treatment and overcoat process for preparing a copper interface in a semiconductor device
06/13/2002DE10058804A1 Chipmodul sowie Chipkartenmodul zur Herstellung einer Chipkarte Chip module and the smart card module for producing a chip card
06/13/2002DE10058047A1 Integrierter Speicher mit einer Anordnung von nicht-flüchtigen Speicherzellen und Verfahren zur Herstellung und zum Betrieb des integrierten Speichers Integrated memory with an arrangement of non-volatile memory cells and methods of manufacturing and operating the integrated memory
06/13/2002DE10056872C1 Implantation parameter monitoring method for semiconductor device manufacture, involves reusing substrate implanted with ions, by implanting another set of ions for monitoring implantation parameters
06/13/2002DE10056866A1 Verfahren zur Bildung einer Ätzstoppschicht während der Herstellung eines Halbleiterbauteils A process for forming an etch stop layer during the manufacture of a semiconductor device
06/13/2002DE10049008A1 Semiconducting layer system has local modification of band edge profile by introduction of complementary doping material to form potential well for complementary charge carriers
06/13/2002DE10032795C2 Herstellungsverfahren für ein Halbleiterbauelement mit einem Graben Manufacturing method for a semiconductor device having a trench
06/13/2002DE10031603C2 Verfahren zur Herstellung mindestens einer Halbleiterscheibe durch Ätzen A process for producing at least one semiconductor wafer by etching,
06/13/2002CA2364933A1 Novel high temperature underfilling material with low exotherm during use
06/12/2002EP1213772A2 Photovoltaic apparatus and mass-producing apparatus for mass-producing spherical semiconductor particles
06/12/2002EP1213769A2 Thin film transistor and method for manufacturing the same
06/12/2002EP1213767A2 Nitride compound semiconductor element
06/12/2002EP1213766A2 High breakdown voltage semiconductor device and process for fabricating the same
06/12/2002EP1213763A2 Semiconductor device and method of manufacturing the same
06/12/2002EP1213762A1 Electrical device isolation structure
06/12/2002EP1213761A1 Trench-capacitor vertical transistor DRAM cell
06/12/2002EP1213760A2 Selective substrate implant process for decoupling analog and digital grounds
06/12/2002EP1213759A1 Method for forming a porous silicon dioxide film
06/12/2002EP1213758A1 A method of forming interconnections in semiconductor devices
06/12/2002EP1213757A2 Integrated circuits having and adjacent p-type doped regions having shallow trench isolation structures without liner layers therein therebetween and methods of forming same
06/12/2002EP1213756A2 Fabrication process of semiconductor package and semiconductor package
06/12/2002EP1213755A2 Fabrication process of semiconductor package and semiconductor package
06/12/2002EP1213754A2 Fabrication process of semiconductor package and semiconductor package
06/12/2002EP1213753A1 Ceramic substrate, ceramic heater, electrostatic chuck and wafer prober for use in semiconductor producing and inspecting devices
06/12/2002EP1213752A2 Process for automatically monitoring the manufacture of integrated circuits depending on the number of process steps performed, associated units and associated program
06/12/2002EP1213751A2 Semiconductor module with an interconnection structure
06/12/2002EP1213750A2 Semiconductor device and method of manufacturing the same
06/12/2002EP1213749A1 Plasma processing apparatus and method of plasma processing
06/12/2002EP1213748A2 Semiconductor substrate and method for fabricating the same
06/12/2002EP1213747A1 Device and method for gripping and transporting wafers
06/12/2002EP1213746A2 Single wafer type substrate cleaning method and apparatus
06/12/2002EP1213745A1 Method of producing a ferroelectric memory and memory device
06/12/2002EP1213744A2 Ion implantation systems and methods
06/12/2002EP1213729A1 Inductor element
06/12/2002EP1213618A1 Method and apparatus for detecting aberrations in an optical system
06/12/2002EP1213617A1 Process and device for in-situ decontamination of an EUV exposure apparatus
06/12/2002EP1213369A2 Method and apparatus for etching ruthenium films
06/12/2002EP1213269A1 Fluororesin-coated quartz glass jig and method for producing the same
06/12/2002EP1213260A2 Process for manufacturing micromechanical and microoptomechanical structures with pre-applied patterning
06/12/2002EP1213259A2 Process for manufacturing micromechanical and microoptomechanical structures with single crystal silicon exposure step
06/12/2002EP1213126A2 Method and mold for producing thermoplastic resin container
06/12/2002EP1212798A2 Pre-metal dielectric rapid thermal processing for sub-micron technology
06/12/2002EP1212794A2 Method for producing an integrated circuit having at least one metalicized surface
06/12/2002EP1212793A1 Method for producing a copper connection
06/12/2002EP1212792A1 A self-aligned method for forming deep trenches in shallow trenches for isolation of semiconductor devices
06/12/2002EP1212791A1 Method and structure for manufacturing improved yield semiconductor packaged devices
06/12/2002EP1212790A1 Process for improving the thickness uniformity of a thin oxide layer in semiconductor wafer fabrication
06/12/2002EP1212789A1 Polishing mixture and process for reducing incorporation of copper into silicon wafers
06/12/2002EP1212788A1 Improved fill material for dual damascene processes
06/12/2002EP1212787A2 A cleaving process to fabricate multilayered substrates using low implantation doses
06/12/2002EP1212786A1 Layer structure for bipolar transistors and method for the production thereof
06/12/2002EP1212784A1 Methods for producing uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors using sequential lateral solidification
06/12/2002EP1212783A1 Systems and methods using sequential lateral solidification for producing single or polycrystalline silicon thin films at low temperatures
06/12/2002EP1212782A2 Integrated circuit arrangement with at least a capacitor and a method for the production of the said
06/12/2002EP1212775A1 Inductively coupled ring-plasma source apparatus for processing gases and materials and method thereof
06/12/2002EP1212726A1 Chip card module and chip card encompassing said module as well as a method for producing the chip card module
06/12/2002EP1212665A1 System and method of operation of a digital mass flow controller
06/12/2002EP1212580A2 Method and apparatus for performing optical measurements of layers and surface properties
06/12/2002EP1212476A1 Titanium containing dielectric films and methods of forming same
06/12/2002EP1212475A1 Protective gas shield apparatus
06/12/2002EP1212170A1 Method and system for chemical mechanical polishing with a cylindrical polishing pad
06/12/2002EP1212152A1 Methods for cleaning microelectronic substrates using ultradilute cleaning liquids
06/12/2002EP1212151A1 Process and apparatus for treating a workpiece such as a semiconductor wafer
06/12/2002EP1212150A1 Lactam compositions for cleaning organic and plasma etched residues for semiconductor devices
06/12/2002EP1076835A4 Broadband diffractive diffuser and associated methods
06/12/2002EP1038056B1 A method of growing a buffer layer using molecular beam epitaxy
06/12/2002EP1021829B1 Cmos processing employing removable sidewall spacers for independently optimized n- and p-channel transistor performance
06/12/2002EP0968549B1 Initiation connector for airbag systems
06/12/2002EP0956584B1 Process and device for drying of substrates
06/12/2002EP0920659B1 Semiconductor circuit secure against outside accesses
06/12/2002EP0917596B1 Method of manufacturing a semiconductor device and a device for applying such a method
06/12/2002EP0829561B1 Process for producing silicon single crystal
06/12/2002EP0753101B1 Engine components including ceramic-metal composites
06/12/2002EP0739535B1 Tuning system with dc-dc converter
06/12/2002EP0673311B1 C-axis perovskite thin films grown on silicon dioxide
06/12/2002EP0585445B1 Sputtering apparatus with a magnet array having a geometry for a specified target erosion profile
06/12/2002CN1353864A Method for suppressing narrow width effects in CMOS Technology
06/12/2002CN1353863A Super-self-aligned trench-gate DMOS with reduced on-resistance
06/12/2002CN1353862A Collector-up RF power transistor
06/12/2002CN1353861A Low temp sacrifical oxide formation
06/12/2002CN1353859A Apparatus for improving plasmia distribution and performance in inductively coupled plasma
06/12/2002CN1353461A Single-electron transistor and its preparing process
06/12/2002CN1353458A Semiconductor device without chip carrier and its preparing process
06/12/2002CN1353456A Input/output element assembling method and semi-conductor equipment
06/12/2002CN1353455A Technology for making opening on bimetal inlaid structure