Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2002
06/13/2002US20020070825 Wiring structure for transmission line
06/13/2002US20020070759 Semiconductor integrated circuit device including circuit block having hierarchical structure and method of designing the same
06/13/2002US20020070749 Insulating film evaluation method and apparatus therefor
06/13/2002US20020070746 Method and apparatus for testing semiconductor devices
06/13/2002US20020070745 Cooling system for burn-in unit
06/13/2002US20020070744 Automatic scan pad assignment utilizing I/O pad architecture
06/13/2002US20020070742 Universal wafer carrier for wafer level die burn-in
06/13/2002US20020070738 Semiconductor device inspecting apparatus
06/13/2002US20020070731 Apparatus and method for analyzing capacitance of insulator
06/13/2002US20020070675 Method for non-contact stress evaluation of wafer gate dielectric reliability
06/13/2002US20020070672 Electron beam ion source with integral low-temperature vaporizer
06/13/2002US20020070464 Method for forming a protective package for electronic circuits
06/13/2002US20020070462 Ball grid array type semiconductor package having a flexible substrate
06/13/2002US20020070461 Semiconductor device and manufacturing method thereof
06/13/2002US20020070459 Method and apparatus for manufacturing semiconductor device, and semiconductor device manufactured by the method
06/13/2002US20020070457 Metal contact structure in semiconductor device and method for forming the same
06/13/2002US20020070456 Semiconductor device having interconnection implemented by refractory metal nitride layer and refractory metal silicide layer and process of fabrication thereof
06/13/2002US20020070455 Semiconductor device and method for manufacturing same
06/13/2002US20020070454 SOI substrate, element substrate, semiconductor device, electro-optical apparatus, electronic equipment, method of manufacturing the SOI substrate, method of manufacturing the element substrate, and method of manufacturing the electro-optical apparatus
06/13/2002US20020070453 Semiconductor device and method of producing thereof
06/13/2002US20020070452 Formation of micro rough polysurface for low sheet resistance salicided sub-quarter micron polylines
06/13/2002US20020070446 Semiconductor device and method for the production thereof
06/13/2002US20020070443 Microelectronic package having an integrated heat sink and build-up layers
06/13/2002US20020070441 Chip array with two-sided cooling
06/13/2002US20020070440 Semiconductor device manufacturing method having a step of applying a copper foil on a substrate as a part of a wiring connecting an electrode pad to a mounting terminal
06/13/2002US20020070438 Multi-chip stack and method of fabrication utilizing self-aligning electrical contact array
06/13/2002US20020070435 Incorrect-placement preventing directional IC tray for carrying IC packages
06/13/2002US20020070434 Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication
06/13/2002US20020070430 Semiconductor device having shallow trench isolation structure and method for manufacturing the same
06/13/2002US20020070429 Scribe line planarization layer
06/13/2002US20020070427 Silicon wafer
06/13/2002US20020070424 Semiconductor device
06/13/2002US20020070423 Thin-film electronic component and motherboard
06/13/2002US20020070422 Isolation region forming methods
06/13/2002US20020070421 Embedded gettering layer in shallow trench isolation structure
06/13/2002US20020070420 Integrated circuits having adjacent P-type doped regions having shallow trench isolation structures without liner layers therein therebetween and methods of forming same
06/13/2002US20020070419 Method of forming buried conductor patterns by surface transformation of empty spaces in solid state materials
06/13/2002US20020070418 High voltage vertical conduction superjunction semiconductor device
06/13/2002US20020070414 Semiconductor component and process for its fabrication
06/13/2002US20020070413 Semiconductor device having improved short channel resistance
06/13/2002US20020070412 Integrated semiconductor device having a lateral power element
06/13/2002US20020070411 Method of processing a high voltage p++/n-well junction and a device manufactured by the method
06/13/2002US20020070410 Bipolar transistors with independent impurity profile on the same chip
06/13/2002US20020070407 Non-volatile semiconductor device
06/13/2002US20020070406 Nonvolatile memory and manufacturing method thereof
06/13/2002US20020070405 Nonvolatile semiconductor memory device and method for fabricating the same
06/13/2002US20020070404 Capacitor electrodes arrangement
06/13/2002US20020070403 Structure and method for creating vertical capacitor and anti-fuse in dram process employing vertical array device cell complex
06/13/2002US20020070402 Semiconductor device having capacitor element in peripheral circuit and method of manufacturing the same
06/13/2002US20020070401 Semiconductor storage device and method of fabricating thereof
06/13/2002US20020070399 Thin film capacitor for temperature compensation
06/13/2002US20020070398 Semiconductor memory device using double layered capping pattern and semiconductor memory device formed thereby
06/13/2002US20020070397 Contact structure for a ferroelectric memory device
06/13/2002US20020070396 Ferroelectric memory having electromagnetic wave shield structure
06/13/2002US20020070395 Insulating gate type semiconductor device
06/13/2002US20020070392 Electronic device, semiconductor device, and electrode forming method
06/13/2002US20020070390 Superlattice fabrication for InAs/GaSb/AISb semiconductor structures
06/13/2002US20020070385 Light-emitting device and method of fabricating the same
06/13/2002US20020070383 Group III nitride compound semiconductor device and method for producing the same
06/13/2002US20020070382 Semiconductor device, and manufacturing method thereof
06/13/2002US20020070381 Semiconductor device having thin film transistor for supplying current to driven element
06/13/2002US20020070380 Semiconductor device and manufacturing method thereof
06/13/2002US20020070375 Stress tunable tantalum and tantalum nitride films
06/13/2002US20020070371 Methods of implementing a single shaft, dual cradle vacuum slot valve
06/13/2002US20020070356 Electron beam proximity exposure apparatus and mask unit therefor
06/13/2002US20020070354 Manufacturing method of mask for electron beam proximity exposure and mask
06/13/2002US20020070353 EUV, XUV, and X-Ray wavelength sources created from laser plasma produced from liquid metal solutions
06/13/2002US20020070347 Faraday system for ion implanters
06/13/2002US20020070346 Split magnetic lens for controlling a charged particle beam
06/13/2002US20020070345 Evacuation use sample chamber and circuit pattern forming apparatus using the same
06/13/2002US20020070340 Apparatus for inspection of semiconductor wafers and masks using a low energy electron microscope with two illuminating beams
06/13/2002US20020070302 Apparatus for removing wafer ring tape
06/13/2002US20020070291 Method and apparatus for separating sample
06/13/2002US20020070204 Method for making holes in a substrate
06/13/2002US20020070194 Process for treating solid surface and substrate surface
06/13/2002US20020070144 Test tray insert of test handler
06/13/2002US20020070130 Peroxide preservation
06/13/2002US20020070126 Polishing method, polishing apparatus, plating method, and plating apparatus
06/13/2002US20020070106 Interference layer system
06/13/2002US20020070095 Semiconductor manfacturing method and semiconductor manfacturing apparatus
06/13/2002US20020070048 Adhesives and adhesive films
06/13/2002US20020069972 Method and apparatus for epoxy loc die attachment
06/13/2002US20020069971 Plasma processing apparatus and plasma processing method
06/13/2002US20020069969 Method and apparatus for restricting process fluid flow within a showerhead assembly
06/13/2002US20020069968 Suspended gas distribution manifold for plasma chamber
06/13/2002US20020069967 Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies
06/13/2002US20020069952 Semiconductor chip pickup device and pickup method
06/13/2002US20020069933 Foup opener
06/13/2002US20020069899 Spinning a wafer to dry; passing wafer under a isopropyl alcohol vapor source for reducing adhered moisture from a wafer
06/13/2002US20020069895 For substrate cleansing, etching
06/13/2002US20020069827 Allows the quality of milk supplied by each animal to be accurately monitored and also allows the health of the udders of the milked animals to be monitored
06/13/2002US20020069820 Heater with detachable ceramic top plate
06/13/2002US20020069817 Semiconductors
06/13/2002US20020069816 Exposing crystallographic planes in a face of silicon substrate; and growing hexagonal gallium nitride on crystallographic planes that are exposed
06/13/2002US20020069610 Installation docking pedestal for pre-facilitation of wafer fabrication equipment
06/13/2002US20020069593 For use in semiconductor device fabrication
06/13/2002US20020069591 Transporting a backing layer to successive manufacturing stations, supplying a fluid phase polymer onto transported backing layer, shaping fluid phase polymer into surface layer having measured thickness, and curing polymer to solidify
06/13/2002US20020069530 Apparatus for producing high efficiency heat sinks
06/13/2002US20020069523 Mounting structure of integrated circuit device having high effect of buffering stress and high reliability of connection by solder and method of mounting the same
06/13/2002DE19928563C2 MOS-Transistor und Verfahren zu dessen Herstellung MOS transistor and method of producing the
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