Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2002
06/18/2002US6406923 Etching, blasting; for semiconductors
06/18/2002US6406836 Method of stripping photoresist using re-coating material
06/18/2002US6406834 Projecting image onto target; masking; radiation
06/18/2002US6406831 Chemically amplified resist compositions
06/18/2002US6406830 Bis(sulfonium methyl)ketone bisperfluoroalkanesulfonate acid generator with triphenylsulfonium or diphenyliodonium salts, and a resin having a unit unstable to an acid, such as 2-alkyl-2-adamantyl (meth)acrylate; resolution
06/18/2002US6406829 Blend of alkali-soluble resin, onium salt and ethyleneurea compound
06/18/2002US6406828 N-heterocycle polymers
06/18/2002US6406827 Comprising alkali-soluble resin, quinonediazide ester, 4,4'-bis(diethylamino)benzophenone; high sensitivity and definition and improved focal depth
06/18/2002US6406799 Aluminum, or ceramic containing the same; fluoride overcoating
06/18/2002US6406795 Multilayer
06/18/2002US6406794 Film-forming composition
06/18/2002US6406778 Multi-thickness, multi-layer green sheet lamination and method thereof
06/18/2002US6406759 Remote exposure of workpieces using a recirculated plasma
06/18/2002US6406746 Microcapsulating conductive metal particles with polymerized monomers
06/18/2002US6406743 Integrated circuits
06/18/2002US6406641 Liquid etch endpoint detection and process metrology
06/18/2002US6406640 Plasma etching method
06/18/2002US6406638 Method of forming vertical, hollow needles within a semiconductor substrate, and needles formed thereby
06/18/2002US6406637 Thin film-planar structure and method for producing the same
06/18/2002US6406636 Methods for wafer to wafer bonding using microstructures
06/18/2002US6406622 Apparatus for filtering a fluid
06/18/2002US6406609 Semiconductor wafers, dielectric layers and copper
06/18/2002US6406589 Plasma etching in vacuum chamber using sulfur hexafluoride
06/18/2002US6406555 Homogeneous solution by mixing through a filter, ammonium hydroxide, to remove residue from a semiconductor wafer which reduces evaporation and avoids the risk of exposure to hazardous chemicals
06/18/2002US6406553 Method to reduce contaminants from semiconductor wafers
06/18/2002US6406551 Method for treating a substrate with heat sensitive agents
06/18/2002US6406545 Semiconductor workpiece processing apparatus and method
06/18/2002US6406543 Infra-red transparent thermal reactor cover member
06/18/2002US6406541 Method and apparatus for adhering and centering particles to the tacky areas on a surface containing an array of tacky and non-tacky areas
06/18/2002US6406363 Unsupported chemical mechanical polishing belt
06/18/2002US6406359 Apparatus for transferring semiconductor substrates using an input module
06/18/2002US6406358 Method and apparatus for cleaning a surface of a microelectronic substrate
06/18/2002US6406357 Grinding method, semiconductor device and method of manufacturing semiconductor device
06/18/2002US6406246 Device handler
06/18/2002US6406245 Processing system and device manufacturing method using the same
06/18/2002US6406179 Sensor for measuring a substrate temperature
06/18/2002US6405740 Accurate positioning of a wafer
06/18/2002US6405739 Spin chuck capable of providing simultaneous dual-sided processing
06/18/2002US6405659 Monolithic stage
06/18/2002US6405610 Wafer inspection apparatus
06/18/2002US6405452 Method and apparatus for drying wafers after wet bench
06/18/2002US6405436 Method of producing cooling fan attached type heat sink
06/18/2002US6405429 Microbeam assembly and associated method for integrated circuit interconnection to substrates
06/18/2002US6405423 Method for producing vacuum processing chambers
06/18/2002US6405399 Method and system of cleaning a wafer after chemical mechanical polishing or plasma processing
06/18/2002CA2328693A1 Laser alignment tool for aligning a source and wafer in an evaporator
06/18/2002CA2060563C Process for mounting miniature electronic components with weld connection tabs on a flexible substrate
06/14/2002CA2365027A1 Method for purifying semiconductor gases
06/13/2002WO2002047448A2 Attaching devices using polymers
06/13/2002WO2002047209A1 Contact structure and production method thereof and probe contact assembly using same
06/13/2002WO2002047173A2 Quantum well infrared photodetector
06/13/2002WO2002047172A1 A high frequency interconnect system using micromachined plugs and sockets
06/13/2002WO2002047171A1 High voltage vertical conduction superjunction semiconductor device
06/13/2002WO2002047170A1 Semiconductor device
06/13/2002WO2002047168A2 Cmos inverter circuits utilizing strained silicon surface channel mosfets
06/13/2002WO2002047167A1 Semiconductor device
06/13/2002WO2002047166A2 Esd protection devices
06/13/2002WO2002047165A2 Method and apparatus for considering diagonal wiring in placement
06/13/2002WO2002047162A2 Microelectronic package having an integrated heat sink and build-up layers
06/13/2002WO2002047161A2 Barrier against overflow for fixing adhesive of a semiconductor chip
06/13/2002WO2002047160A2 Method for producing high-speed vertical npn bipolar transistors and complementary mos transistors on a chip
06/13/2002WO2002047159A2 Dram with vertical transistor and trench capacitor memory cells and method of fabrication
06/13/2002WO2002047158A2 Ionized metal plasma deposition process having enhanced via sidewall coverage
06/13/2002WO2002047157A2 Negative ion implant mask formation for self-aligned, sublithographic resolution patterning for single-sided verticle device formation
06/13/2002WO2002047156A1 Method for producing a thin film comprising introduction of gaseous species
06/13/2002WO2002047155A1 Holder
06/13/2002WO2002047154A1 Seal member, and substrate storage container using the seal member
06/13/2002WO2002047153A1 Semiconductor processing system and method for transferring workpiece
06/13/2002WO2002047152A1 Device, container, and method for transferring substrate
06/13/2002WO2002047151A2 Method for making a semiconductor chip using an integrated rigidity layer
06/13/2002WO2002047150A2 Method for adjusting rapid thermal processing (rtp) recipe setpoints based on wafer electrical test (wet) parameters
06/13/2002WO2002047148A2 Electrically isolated via in a multilayer ceramic package
06/13/2002WO2002047147A1 Method for producing a positively doped semiconductor with large forbidden band
06/13/2002WO2002047146A2 DAMASCENE NiSi METAL GATE HIGH-K TRANSISTOR
06/13/2002WO2002047145A1 Method of forming nickel silicide using a one-step rapid thermal anneal process and backend processing
06/13/2002WO2002047144A2 Patterned buried insulator
06/13/2002WO2002047143A1 Heat-treating methods and systems
06/13/2002WO2002047142A1 Method and apparatus for treating article to be treated
06/13/2002WO2002047141A1 Polishing progress monitoring method and device thereof, polishing device, semiconductor device production method, and semiconductor device
06/13/2002WO2002047140A1 Wafer polisher
06/13/2002WO2002047139A2 Methode of forming a copper film on a substrate
06/13/2002WO2002047138A1 Method for doping semiconductor layer, method for producing thin film semiconductor element and thin film semiconductor element
06/13/2002WO2002047137A1 Semiconductor thin film forming method, production methods for semiconductor device and electrooptical device, devices used for these methods, and semiconductor device and electrooptical device
06/13/2002WO2002047136A2 A method for producing soi wafers by delamination
06/13/2002WO2002047135A1 Electron beam exposure system and electron lens
06/13/2002WO2002047134A1 Stencil mask and manufacturing method thereof
06/13/2002WO2002047131A1 Electron beam exposure system, irradiating position detecting method, and electron detector
06/13/2002WO2002047130A1 Observation device and its manufacturing method, exposure device, and method for manufacturing micro device
06/13/2002WO2002047129A1 Ceramic substrate for semiconductor manufacturing and inspecting devices, and method of manufacturing the ceramic substrate
06/13/2002WO2002047127A2 Pyroelectric device on a monocrystalline semiconductor substrate
06/13/2002WO2002047126A1 Electrostatic clamping
06/13/2002WO2002047125A1 Device and method for treating substrates
06/13/2002WO2002047124A1 Resist nozzle calibration tool and method therefor
06/13/2002WO2002047123A1 Heat-treating methods and systems
06/13/2002WO2002047121A2 Funtionalized patterned surfaces
06/13/2002WO2002047120A2 Cooling gas delivery system for a rotatable semiconductor substrate support assembly
06/13/2002WO2002047118A2 Wafer carrier with stacking adaptor plate
06/13/2002WO2002047116A2 Structure and method for forming a body contact for vertical transistor cells
06/13/2002WO2002047115A2 Self teaching robot
06/13/2002WO2002047113A2 Layers in substrate wafers