| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 06/20/2002 | US20020074543 Strain-engineered, self-assembled, semiconductor quantum dot lattices |
| 06/20/2002 | US20020074541 Magnetic tunnel junctions using nanoparticle monolayers and applications therefor |
| 06/20/2002 | US20020074540 Contact structure in semiconductor integrated circuit and method for forming the same |
| 06/20/2002 | US20020074529 Method for dynamic manipulation of a position of a module in an optical system |
| 06/20/2002 | US20020074524 Magnetically shielded electromagnetic lens assemblies for charged-particle-beam microlithography systems |
| 06/20/2002 | US20020074521 Method and system for icosaborane implantation |
| 06/20/2002 | US20020074519 Electron beam treatment device |
| 06/20/2002 | US20020074518 Method for measuring step difference in a semiconductor device and apparatus for performing the same |
| 06/20/2002 | US20020074516 Positioning stage with stationary and movable magnet tracks |
| 06/20/2002 | US20020074510 Curved I-core |
| 06/20/2002 | US20020074509 Contaminant collector trap for ion implanter |
| 06/20/2002 | US20020074506 Multiple numerical aperture electron beam projection lithography system |
| 06/20/2002 | US20020074496 Tem sample slicing process |
| 06/20/2002 | US20020074385 Laminated structure |
| 06/20/2002 | US20020074324 Heat treatment apparatus and controller for heat treatment apparatus and control method for heat treatment apparatus |
| 06/20/2002 | US20020074319 Laser-trimmable digital resistor |
| 06/20/2002 | US20020074314 Metal-assisted chemical etch to produce porous group III-V materials |
| 06/20/2002 | US20020074313 Carbon-doped hard mask and method of passivating structures during semiconductor device fabrication |
| 06/20/2002 | US20020074312 High density plasma post-etch treatment for a dielectric etch process |
| 06/20/2002 | US20020074311 Methods of endpoint detection for wafer planarization |
| 06/20/2002 | US20020074309 Integrated low k dielectrics and etch stops |
| 06/20/2002 | US20020074289 Purifying ammonia, nitrogen, helium, and argon via molecular sieves |
| 06/20/2002 | US20020074242 Via removal of oxidized metal from the seed layers prior to metallization; electronics; integrated circuits |
| 06/20/2002 | US20020074239 A method for the production of a porous layer |
| 06/20/2002 | US20020074238 For planarizing metal surfaces having low aspect ratio recesses or trenches as well as raised regions; fluid exchange rate changes with elevation |
| 06/20/2002 | US20020074234 Immersing the wafer, under bias, in a plating solution at forward current density of 10-30 mA/cm2 and a duration of 2-60 seconds followed by reverse current and bulk fill plating |
| 06/20/2002 | US20020074233 Altering the structure of each deposited copper layer by annealing |
| 06/20/2002 | US20020074231 Bottom-up fill of recesses increasing the rotation speed of a substrate and contacting with a soluble copper salt and electrolyte until a desired thickness is achieved |
| 06/20/2002 | US20020074230 Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence |
| 06/20/2002 | US20020074190 Material delivery system for clean room-like environments |
| 06/20/2002 | US20020074163 Mounting structure of a semiconductor device, and a process for mounting a semiconductor device on a mounting substrate |
| 06/20/2002 | US20020074147 Bump chip lead frame and package |
| 06/20/2002 | US20020074146 Semiconductor device, methods of production of the same, and method of mounting a component |
| 06/20/2002 | US20020074115 Temperature compensation apparatus for thermally loaded bodies of low thermal conductivity |
| 06/20/2002 | US20020074081 Microelectronic packaging methods and components |
| 06/20/2002 | US20020074025 Installation for processing wafers |
| 06/20/2002 | US20020074023 Apparatus for cleaning and drying substrates |
| 06/20/2002 | US20020074020 A spin drying treatment is applied to the wafer when the wafer is supported and rotated at high speed while an inert gas(nitrogen) for preventing oxidation is supplied (larger in outer edge than at the center)to the face of wafer |
| 06/20/2002 | US20020073925 Apparatus and method for exposing a substrate to plasma radicals |
| 06/20/2002 | US20020073924 Gas introduction system for a reactor |
| 06/20/2002 | US20020073923 Top end of the exhaust pipe is split into two vents, one of which is used for discharging exhaust gas for forming silicon dioxide and silicon nitride films and other, which is used to discharge hydrogen fluoride for pipe cleaning |
| 06/20/2002 | US20020073922 Can provide high temperature deposition, heating and efficient cleaning, for forming dielectric films having thickness uniformity, good gap fill capability, high density and low moisture |
| 06/20/2002 | US20020073917 Using a group III element and ammonia for nitriding in presence of hydrogen as carrier gas, improved crystallinity by controlling a flow rate ratio between starting material gas and carrier gas |
| 06/20/2002 | US20020073576 Liquid processing apparatus and method |
| 06/20/2002 | US20020073575 Handler system for cutting a semiconductor package device |
| 06/20/2002 | US20020073495 Brush pressure control system for chemical and mechanical treatment of semiconductor surfaces |
| 06/20/2002 | DE10157458A1 Automatische Abtastanschlussfeldzuweisung unter Verwendung einer I/O-Anschlussfeldarchitektur Automatic Abtastanschlussfeldzuweisung using an I / O port array architecture |
| 06/20/2002 | DE10144245A1 Semiconductor memory device e.g. high integrated DRAM, includes isolator connected bitline of one block and precharger connected to complementary bitline, are synchronously controlled by control signal |
| 06/20/2002 | DE10139786A1 Verfahren und Vorrichtung zum Formen eines Deckbandes für einen Bandförderer A method and apparatus for forming a shroud for a belt conveyor |
| 06/20/2002 | DE10134948A1 Mop for clean rooms comprises a mop head consisting of a fabric with loops of filled or hollow threads, an electrically conductive frame and an electrically conductive handle |
| 06/20/2002 | DE10125362A1 Method for mounting an electronic component e.g. microchip on carrier e.g. printed circuit board, involves making simultaneous contact between component's contacts and those of the printed circuit board. |
| 06/20/2002 | DE10064143A1 Reflexionsminderungsbeschichtung für Ultraviolettlicht bei großen Einfallswinkeln Antireflection coating for ultraviolet light at large angles of incidence |
| 06/20/2002 | DE10062786A1 System zur Dämpfung von Schwingungen A system for damping vibrations |
| 06/20/2002 | DE10053965A1 Verfahren zur Verhinderung unerwünschter Programmierungen in einer MRAM-Anordnung A method of preventing unwanted programming in an MRAM array |
| 06/20/2002 | DE10043315C1 Projektionsbelichtungsanlage Projection exposure apparatus |
| 06/20/2002 | CA2428673A1 Vertical junction field effect semiconductor diodes |
| 06/20/2002 | CA2425541A1 Method of fabricating a self-aligned bipolar junction transistor in silicon carbide and resulting devices |
| 06/20/2002 | CA2365593A1 Polishing slurry for the chemical-mechanical polishing of silica films |
| 06/19/2002 | EP1215938A1 Ceramic heater |
| 06/19/2002 | EP1215861A2 Switchable, resistive termination circuit |
| 06/19/2002 | EP1215805A2 Linear motor and exposure apparatus using the same |
| 06/19/2002 | EP1215734A2 Surge protective semiconductor device and method of manufacturing the same |
| 06/19/2002 | EP1215733A2 Lateral polysilicon pin diode and method for so fabricating |
| 06/19/2002 | EP1215732A2 Nonvolatile semiconductor memory device and manufacturing method thereof |
| 06/19/2002 | EP1215731A2 Offset-gate-type semiconductor device |
| 06/19/2002 | EP1215730A1 SiC WAFER, SiC SEMICONDUCTOR DEVICE AND PRODUCTION METHOD OF SiC WAFER |
| 06/19/2002 | EP1215727A2 Semiconductor structure for processing and storing of information |
| 06/19/2002 | EP1215726A2 Interconnection method and structure |
| 06/19/2002 | EP1215725A2 Assembly apted to support electric devices and contactless transponder |
| 06/19/2002 | EP1215724A1 Wire bonded semiconductor device with low capacitance coupling |
| 06/19/2002 | EP1215722A2 Protecting adhesive film for a semiconductor wafer |
| 06/19/2002 | EP1215721A2 Process for multistep processing of a thin and brittle Wafer |
| 06/19/2002 | EP1215719A2 Semiconductor device manufacturing method having a step of applying a copper foil on a substrate as a part of a wiring connecting an electrode pad to a mounting terminal |
| 06/19/2002 | EP1215718A2 Novel high temperature underfilling material with low exotherm during use |
| 06/19/2002 | EP1215717A1 Magnetron plasma processing apparatus |
| 06/19/2002 | EP1215716A1 Supporting means |
| 06/19/2002 | EP1215715A2 Substrate processing unit |
| 06/19/2002 | EP1215710A2 Method and apparatus for vacuum processing, semiconductor device manufacturing method and semiconductor device |
| 06/19/2002 | EP1215709A2 Vacuum processing method |
| 06/19/2002 | EP1215706A2 Electron beam treatment device |
| 06/19/2002 | EP1215682A2 Initializing an integrated circuit using compressed data from a remote fusebox |
| 06/19/2002 | EP1215681A2 Program and erase methods in twin MONOS cell memories |
| 06/19/2002 | EP1215680A2 Fast program to program verify method |
| 06/19/2002 | EP1215512A2 Anti-reflection coating for ultraviolet light at large angles of incidence |
| 06/19/2002 | EP1215310A1 p-TYPE SINGLE CRYSTAL ZINC OXIDE HAVING LOW RESISTIVITY AND METHOD FOR PREPARATION THEREOF |
| 06/19/2002 | EP1215308A2 A method for fabricating a III-V nitride film and an apparatus for fabricating the same |
| 06/19/2002 | EP1215307A2 Unibody crucible |
| 06/19/2002 | EP1215205A1 Tuned multifunctional linker molecules for electronic charge transport through organic-inorganic composite structures and use thereof |
| 06/19/2002 | EP1215011A1 Arrangement and method for mounting a backing film to a polish head |
| 06/19/2002 | EP1214965A2 Method for purifying gases |
| 06/19/2002 | EP1214742A1 Semiconductive chip having a bond pad located on an active device |
| 06/19/2002 | EP1214740A1 Protective layer for a semiconductor device |
| 06/19/2002 | EP1214739A2 Copper deposit process |
| 06/19/2002 | EP1214738A1 Method to fabricate a mosfet |
| 06/19/2002 | EP1214737A2 A method of producing a schottky varicap diode |
| 06/19/2002 | EP1214736A1 Method of manufacturing a transistor |
| 06/19/2002 | EP1214735A1 Method of producing relaxed silicon germanium layers |
| 06/19/2002 | EP1214734A2 Holder for a substrate cassette and device provided with such a holder |
| 06/19/2002 | EP1214733A1 Device for loading and unloading substrates |
| 06/19/2002 | EP1214732A1 Semiconductor processing equipment having radiant heated ceramic liner |