Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2002
06/19/2002EP1214731A1 Improved ladder boat for supporting wafers
06/19/2002EP1214718A1 Extreme ultraviolet soft x-ray projection lithographic method system and lithography elements
06/19/2002EP1214715A1 1 transistor cell for eeprom application
06/19/2002EP1214635A1 A system and method for a digital mass flow controller
06/19/2002EP1214562A1 Spatial averaging technique for ellipsometry and reflectometry
06/19/2002EP1214557A1 Thermocapillary dryer
06/19/2002EP1214555A1 Supercritical fluid drying system
06/19/2002EP1214459A1 Pulsed plasma processing method and apparatus
06/19/2002EP1214248A1 System and method for transferring components between packing media
06/19/2002EP1214190A2 Silicon carbide epitaxial layers grown on substrates offcut towards 1100
06/19/2002EP1214175A1 Unsupported polishing belt for chemical mechanical polishing
06/19/2002EP1214174A1 Windowless belt and method for in-situ wafer monitoring
06/19/2002EP1060504B1 Device for the thermal treatment of substrates
06/19/2002EP0973963B1 Low defect density silicon
06/19/2002EP0972287B1 High-efficiency miniature magnetic integrated circuit structures
06/19/2002CN2496133Y IC inserting appliance that pressing force can be controlled accurately
06/19/2002CN1354891A Universal tool interface and/or workpiece transfer apparatus for SMIF and open pod applications
06/19/2002CN1354890A Method for producing portable electronic device with integrated circuit protected by photosensitive resin
06/19/2002CN1354889A Method for expanding trenches by anisotropic wet etch
06/19/2002CN1354888A Process for underfilling controlling flip-chip connecting (C4) integrated circuit package with underfill material that is heated to partial gel state
06/19/2002CN1354887A Method for producing semiconductor memory component
06/19/2002CN1354833A Use of conveying beams for transmitting electromagnetic energy to power devices for die testing
06/19/2002CN1354832A Method and apparatus for analysis of material composition
06/19/2002CN1354807A CVD method of integrated Ta and TaN films from tantalum halide precursors
06/19/2002CN1354568A Instrument for communication system and semiconductor integrated circuit device
06/19/2002CN1354527A Cutting method of subgroup III nitride semi-conductor light-emitting component
06/19/2002CN1354526A Light-emitting element wafer-covering package method and its structure
06/19/2002CN1354524A Package structure for integrated circuit
06/19/2002CN1354523A Semiconductor storage device and its making method
06/19/2002CN1354522A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
06/19/2002CN1354521A Semiconductor device and manufacturing mehtod thereof
06/19/2002CN1354520A 半导体集成电路 The semiconductor integrated circuit
06/19/2002CN1354519A Method for raising breakdown voltage in magnetic tunnel junction
06/19/2002CN1354511A Semiconductor package whose package sealant possesses shoulder portion and mould for packaging said semiconductor package
06/19/2002CN1354509A Film spherical grid array type semiconductor package structure and its making method
06/19/2002CN1354507A Semiconductor package with structure capable of preventing sealant from overflowing and its making method
06/19/2002CN1354506A Production method of element with insulating layer having silicon capable of completely consuming and its structure
06/19/2002CN1354505A Compensating metal oxide semiconductor device structure and manufacturing method thereof
06/19/2002CN1354504A Bimetal mosaic structure opening manufacture method
06/19/2002CN1354502A Wafer-covered solder pad on package base board of integrated circuit
06/19/2002CN1354501A Double wafer structure without wafer holder
06/19/2002CN1354500A Manufacturing method of thin spherical grid array integrated circuit package
06/19/2002CN1354499A Integrated circuit package unit partioning method
06/19/2002CN1354498A Gamma-ray radiation method for improving imaging quality of CMOS digital image sensor
06/19/2002CN1354497A Method for forming barrier layer and its formed structure
06/19/2002CN1354496A Method for increasing sticking property of dielectric material of semiconductor
06/19/2002CN1354495A Semiconductor film and producing method and equipment, and method for producing single crystal film
06/19/2002CN1354494A Photoetching making method capable of reducing kindred effect
06/19/2002CN1354395A Regulating device and method of position deviation optical detecting device
06/19/2002CN1354392A 化学放大型正光刻胶组合物 Chemical amplification type positive resist composition
06/19/2002CN1354379A Liquid crystal display plate, liquid crystal device and manufacturing method, substrate connector
06/19/2002CN1354334A Flow-guiding type dual-hole vacuum valve
06/19/2002CN1354287A Open pipe tellurium cadmium mercury epitaxial material heat treatment method
06/19/2002CN1354285A Electrochemical corrosion of high-tin solder ridge
06/19/2002CN1354127A Sulphuric acid recovery device
06/19/2002CN1086514C Compound semiconductor device having reduced resistance
06/19/2002CN1086513C Method for making insulated gate field effect transistor
06/19/2002CN1086512C Charged-beam exposure mask and charged-beam exposure method
06/19/2002CN1086511C III-V semiconductor structure and method of manufacture
06/19/2002CN1086319C System and method of ammonia purification for semicondcutor manufacture
06/18/2002USRE37749 Electrodeposition apparatus with virtual anode
06/18/2002US6408425 Method of designing circuit with field effect transistor and method of determining parameters of model used in such designing method
06/18/2002US6408260 Laser lithography quality alarm system
06/18/2002US6408220 Semiconductor processing techniques
06/18/2002US6408219 FAB yield enhancement system
06/18/2002US6407958 Semiconductor integrated circuit device with split hierarchical power supply structure
06/18/2002US6407796 Tape carrier package and display device using the same
06/18/2002US6407780 Thin-film transistor substrate using aluminum to form low-resistance interconnection and liquid crystal display device using the same
06/18/2002US6407617 Bias circuit and method of fabricating semiconductor device
06/18/2002US6407611 System and method for providing automatic compensation of IC design parameters that vary as a result of natural process variation
06/18/2002US6407602 Post-silicon methods for adjusting the rise/fall times of clock edges
06/18/2002US6407573 Device for evaluating characteristic of insulated gate transistor
06/18/2002US6407558 Method of determining the doping concentration across a surface of a semiconductor material
06/18/2002US6407464 Semiconductor device
06/18/2002US6407463 Semiconductor memory device having gate electrode, drain-drain contact, and drain-gate contact layers
06/18/2002US6407461 Injection molded integrated circuit chip assembly
06/18/2002US6407459 Chip scale package
06/18/2002US6407457 Contact-bumpless chip contacting method and an electronic circuit produced by said method
06/18/2002US6407456 Multi-chip device utilizing a flip chip and wire bond assembly
06/18/2002US6407455 Local interconnect using spacer-masked contact etch
06/18/2002US6407454 Inter-metal dielectric layer
06/18/2002US6407453 Semiconductor device and method of manufacturing the same
06/18/2002US6407452 Integrated circuitry and method of restricting diffusion from one material to another
06/18/2002US6407451 Micromachined chip scale package
06/18/2002US6407449 Pin layout of semiconductor integrated circuits including dual band amplifier and receiving mixer
06/18/2002US6407447 Tape carrier package
06/18/2002US6407443 Nanoscale patterning for the formation of extensive wires
06/18/2002US6407442 Semiconductor device, and operating device, signal converter, and signal processing system using the same semiconductor device
06/18/2002US6407441 Integrated circuit and method of using porous silicon to achieve component isolation in radio frequency applications
06/18/2002US6407436 Semiconductor device with abrupt source/drain extensions with controllable gate electrode overlap
06/18/2002US6407435 Because the layers reduce the effects of crystalline structures within individual layers, the overall tunneling current is reduced.
06/18/2002US6407433 Preventing gate oxide damage by post poly definition implantation while gate mask is on
06/18/2002US6407432 Semiconductor device
06/18/2002US6407431 Semiconductor device and fabrication method thereof
06/18/2002US6407430 Electro-optical device and semiconductor circuit
06/18/2002US6407429 Semiconductor device having silicon on insulator and fabricating method therefor
06/18/2002US6407428 Field effect transistor with a buried and confined metal plate to control short channel effects
06/18/2002US6407423 Staggered-edge capacitor electrode
06/18/2002US6407422 Oxygen diffusion blocking semiconductor capacitor
06/18/2002US6407421 DRAM having a guard ring and process of fabricating the same