Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2002
06/25/2002US6410348 Interface texturing for light-emitting device
06/25/2002US6410346 Method of forming ferroelastic lead germanate thin films
06/25/2002US6410345 Method for manufacturing a ferroelectric memory device
06/25/2002US6410344 Active matrix with transistor and diffusion regions; strontium bismuth tantalate and lead zirconium titanate thin film capacitors; connecting capacitors to a diffusion region
06/25/2002US6410343 C-axis oriented lead germanate film and deposition method
06/25/2002US6410262 Secretion factors for gram-positive microorganisms genes encoding them and methods of using it
06/25/2002US6410211 Semiconductor; masking substrate with photoresist; patterning; exposure; development
06/25/2002US6410209 Forming photoresist relief image
06/25/2002US6410207 Using alkali developer
06/25/2002US6410204 Containing acid generator
06/25/2002US6410192 Forming pattern
06/25/2002US6410172 Articles coated with aluminum nitride by chemical vapor deposition
06/25/2002US6410162 Zinc oxide films containing P-type dopant and process for preparing same
06/25/2002US6410151 Composition for film formation, method of film formation, and insulating film
06/25/2002US6410150 Composition for film formation, method of film formation, and insulating film
06/25/2002US6410149 Silane-based nanoporous silica thin films and precursors for making same
06/25/2002US6410106 Method of forming an intermetal dielectric layer
06/25/2002US6410102 Plasma process method
06/25/2002US6410090 Method and apparatus for forming insitu boron doped polycrystalline and amorphous silicon films
06/25/2002US6410080 Continually dropping fluid while moving both delivery unit and surface being coated; maintaining constant contact angle
06/25/2002US6409932 Method and apparatus for increased workpiece throughput
06/25/2002US6409930 Lamination of circuit sub-elements while assuring registration
06/25/2002US6409918 Apparatus for supplying ozonated ultrapure water
06/25/2002US6409904 Method and apparatus for depositing and controlling the texture of a thin film
06/25/2002US6409896 Method and apparatus for semiconductor wafer process monitoring
06/25/2002US6409879 System for controlling transistor spacer width
06/25/2002US6409878 Automatic decapsulation system utilizing an acid resistant, high heat endurance and flexible sheet coupled to a rubber gasket and a method of use
06/25/2002US6409877 Apparatus and method for plasma etching
06/25/2002US6409876 Apparatus for etching a workpiece
06/25/2002US6409866 Process for mounting semiconductor device
06/25/2002US6409859 Method of making a laminated adhesive lid, as for an Electronic device
06/25/2002US6409855 Method for making wallboard or backerboard sheets including aerated concrete
06/25/2002US6409842 Method for treating surfaces of substrates and apparatus
06/25/2002US6409838 Solvent exchange; cylinder presses cover against heating plate; annular groove; vacuum adsorption vapor supply solution; evacuation mechanism; monitoring interior pressure; semiconductors
06/25/2002US6409837 Processing system and method for chemical vapor deposition of a metal layer using a liquid precursor
06/25/2002US6409833 Insulating-containing ring-shaped heat shields and support members for Czochralski pullers
06/25/2002US6409831 Apparatus for fabricating single crystal
06/25/2002US6409829 Manufacture of dielectrically isolated integrated circuits
06/25/2002US6409827 Low defect density silicon and a process for producing low defect density silicon wherein V/G0 is controlled by controlling heat transfer at the melt/solid interface
06/25/2002US6409826 Low defect density, self-interstitial dominated silicon
06/25/2002US6409781 Polishing slurries for copper and associated materials
06/25/2002US6409780 Solid material with water and inorganic particles in a slurry
06/25/2002US6409583 Apparatus for polishing wafers
06/25/2002US6409582 Polishing apparatus
06/25/2002US6409576 Polishing apparatus
06/25/2002US6409503 Heat treatment method and heat treatment apparatus
06/25/2002US6409463 Apparatuses and methods for adjusting a substrate centering system
06/25/2002US6409453 End effector for wafer handler in processing system
06/25/2002US6409448 Ergonomic load port
06/25/2002US6409434 Device for manipulation of objects on a pneumatic surface
06/25/2002US6409241 Apparatus for gripping ceramic substrates
06/25/2002US6409073 Method for transfering solder to a device and/or testing the device
06/25/2002US6408863 Seal configuration for use with a motor drive assembly in a microelectronic work piece processing system
06/25/2002US6408786 Semiconductor processing equipment having tiled ceramic liner
06/25/2002US6408537 Substrate cooling system
06/25/2002US6408535 Ozone conversion in semiconductor manufacturing
06/25/2002US6408511 Method of creating an enhanced BGA attachment in a low-temperature co-fired ceramic (LTCC) substrate
06/25/2002US6408510 Method for making chip scale packages
06/25/2002US6408508 Method for making flexible trace surface circuit board
06/25/2002US6408500 Method of retrofitting a probe station
06/25/2002CA2245759C Rf diode and method of manufacturing same
06/25/2002CA2220605C Ion source block filament with labyrinth conductive path
06/25/2002CA2181076C Method and apparatus for in situ removal of contaminants from ion beam neutralization and implantation apparatuses
06/21/2002CA2364995A1 Substrate loading apparatus
06/21/2002CA2360057A1 Method for reproducibly forming a predetermined quantum dot structure and device produced using same
06/20/2002WO2002049409A1 Magazine, tray component feeding device, and component mounting device
06/20/2002WO2002049395A2 Rapid thermal processing lamp and method for manufacturing the same
06/20/2002WO2002049200A1 Electrostatic device for holding an electronic component wafer
06/20/2002WO2002049121A1 Multi-wavelength luminous element
06/20/2002WO2002049118A2 Trench schottky barrier rectifier and method of making the same
06/20/2002WO2002049116A2 Vertical junction field effect semiconductor diodes
06/20/2002WO2002049115A1 Method of fabricating a self-aligned bipolar junction transistor in silicon carbide and resulting devices
06/20/2002WO2002049114A2 High withstand voltage semiconductor device
06/20/2002WO2002049113A1 Non-volatile semiconductor memory cell and method for producing the same
06/20/2002WO2002049112A1 Semiconductor device and its manufacturing method
06/20/2002WO2002049110A1 Shielded inductor
06/20/2002WO2002049109A1 Stacked die package
06/20/2002WO2002049108A1 Semiconductor device package and lead frame with die overhanging lead frame pad
06/20/2002WO2002049107A2 Method for stacking semiconductor die within an implanted medical device
06/20/2002WO2002049103A2 Microelectronic package having bumpless laminated interconnection layer
06/20/2002WO2002049100A2 Method of forming vertical transistor gate for trench capacitor dram cell
06/20/2002WO2002049099A1 Robot for carrying substrate
06/20/2002WO2002049098A1 Processing method and processing apparatus
06/20/2002WO2002049097A1 Wafer holder
06/20/2002WO2002049096A1 Tilting fluid cutout device
06/20/2002WO2002049095A1 Wafer carrier
06/20/2002WO2002049094A1 Method and apparatus for mounting a chip
06/20/2002WO2002049093A1 A smart label web and a method for its manufacture
06/20/2002WO2002049092A1 Method for the manufacture of a semiconductor device with a field-effect transistor
06/20/2002WO2002049091A1 Anneal wafer manufacturing method and anneal wafer
06/20/2002WO2002049090A2 Method for polishing dielectric layers using fixed abrasive pads
06/20/2002WO2002049089A1 Method of etching porous insulating film, dual damascene process, and semiconductor device
06/20/2002WO2002049088A1 Sheet type plasma processing device, method of assembling and disassembling electrode for plasma processing device, and exclusive jig for the method
06/20/2002WO2002049087A1 Oscillating shower transfer type substrate treatment device
06/20/2002WO2002049086A1 Transfer type substrate treating device
06/20/2002WO2002049085A1 Apparatus for cleaning the edges of wafers
06/20/2002WO2002049082A2 Process of shaping a semiconductor substrate and/or a lithographic mask
06/20/2002WO2002049080A2 Method and apparatus for inspecting a substrate
06/20/2002WO2002049079A2 System for preventing improper insertion of foup door into foup
06/20/2002WO2002049078A2 Method for cleaning post-etch residues from a substrate
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