| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/18/2002 | US20020093111 Semiconductor memory device |
| 07/18/2002 | US20020093110 Reticle and method of fabricating semiconductor device |
| 07/18/2002 | US20020093108 Flip chip packaged semiconductor device having double stud bumps and method of forming same |
| 07/18/2002 | US20020093105 Semiconductor device having a contact window and fabrication method thereof |
| 07/18/2002 | US20020093104 Conductive adhesive interconnection with insulating polymer carrier |
| 07/18/2002 | US20020093103 Interconnection alloy for integrated circuits |
| 07/18/2002 | US20020093101 Method of metallization using a nickel-vanadium layer |
| 07/18/2002 | US20020093100 Method for forming conductors in semiconductor devices |
| 07/18/2002 | US20020093099 Contact plug |
| 07/18/2002 | US20020093098 Semiconductor device and method of formation |
| 07/18/2002 | US20020093097 Semiconductor device |
| 07/18/2002 | US20020093096 Semiconductor device, manufacturing method and apparatus for the same |
| 07/18/2002 | US20020093090 Method to form a corrugated structure for enhanced capacitance |
| 07/18/2002 | US20020093089 Compliant mounting interface for electronic devices |
| 07/18/2002 | US20020093086 Semiconductor wafer backside grinding apparatus and method |
| 07/18/2002 | US20020093085 Semiconductor device and fabrication process therefor |
| 07/18/2002 | US20020093084 Semiconductor device protecting a semiconductor chip mounted over a substrate with a molding formed by an injection molding method |
| 07/18/2002 | US20020093082 Semiconductor device and manufacturing method of that |
| 07/18/2002 | US20020093080 Process carrier for flexible substrates |
| 07/18/2002 | US20020093078 Optical device packages having improved conductor efficiency, optical coupling and thermal transfer |
| 07/18/2002 | US20020093077 Positive-type photosensitive polyimide precursor and composition comprising the same |
| 07/18/2002 | US20020093076 Semiconductor device and method for producing the same by dicing |
| 07/18/2002 | US20020093074 Antifuses and methods for forming the same |
| 07/18/2002 | US20020093073 Semiconductor device having two-layered charge storage electrode |
| 07/18/2002 | US20020093072 Method and article for filling apertures in a high performance electronic substrate |
| 07/18/2002 | US20020093071 Semiconductor tiling structure and method of formation |
| 07/18/2002 | US20020093069 Organic anti-reflective coating polymer, anti-reflective coating composition and methods of preparation thereof |
| 07/18/2002 | US20020093066 Method for forming a gate of a high integration semiconductor device |
| 07/18/2002 | US20020093065 Semiconductor device and method of manufacturing the same |
| 07/18/2002 | US20020093064 Semiconductor device and method of fabricating the same |
| 07/18/2002 | US20020093063 Method and composite for decreasing charge leakage |
| 07/18/2002 | US20020093061 Semiconductor thin film and its manufacturing method and semiconductor device and its manufacturing method |
| 07/18/2002 | US20020093060 Low stress semiconductor devices with thermal oxide isolation |
| 07/18/2002 | US20020093059 Protective circuit for a semiconductor device |
| 07/18/2002 | US20020093057 Conductor reservoir volume for integrated circuit interconnects |
| 07/18/2002 | US20020093055 Epitaxial base substrate and epitaxial substrate |
| 07/18/2002 | US20020093054 Front stage process of a fully depleted silicon-on-insulator device and a structure thereof |
| 07/18/2002 | US20020093053 Self-aligned double-gate MOSFET by selective epitaxy and silicon wafer bonding techniques |
| 07/18/2002 | US20020093052 Semiconductor device |
| 07/18/2002 | US20020093051 Semiconductor device and process for same |
| 07/18/2002 | US20020093048 Devices and methods for addressing optical edge effects in connection with etched trenches |
| 07/18/2002 | US20020093047 Composite member, its separation method, and preparation method of semiconductor substrate by utilization thereof |
| 07/18/2002 | US20020093046 Semiconductor device and its production process |
| 07/18/2002 | US20020093045 P-channel dynamic flash memory cells with ultrathin tunnel oxides |
| 07/18/2002 | US20020093044 Split gate field effect transistor (FET) device employing dielectric barrier layer and method for fabrication thereof |
| 07/18/2002 | US20020093043 6596601 withdrawn after electronic O.G. published |
| 07/18/2002 | US20020093042 Integrated circuit devices that utilize doped Poly-Si1-xGex conductive plugs as interconnects and methods of fabricating the same |
| 07/18/2002 | US20020093041 Semiconductor device having trench isolation structure and method of forming same |
| 07/18/2002 | US20020093040 Semiconductor device and method of manufacturing the same |
| 07/18/2002 | US20020093039 Optimized reachthrough implant for simultaneously forming an MOS capacitor |
| 07/18/2002 | US20020093036 Integrated circuit power and ground routing |
| 07/18/2002 | US20020093035 Semiconductor memory device having multilayered storage node contact plug and method for fabricating the same |
| 07/18/2002 | US20020093031 Heterojunction bipolar transistor |
| 07/18/2002 | US20020093030 T-RAM array having a planar cell structure and method for fabricating the same |
| 07/18/2002 | US20020093029 Apparatus and method for forming a battery in an intergrated circuit |
| 07/18/2002 | US20020093028 Semiconductor device and a process for manufacturing the same |
| 07/18/2002 | US20020093027 High aperture LCD with insulating color filters overlapping bus lines on active substrate |
| 07/18/2002 | US20020093026 Image sensor of a quad flat package |
| 07/18/2002 | US20020093025 Laminated micromirror package |
| 07/18/2002 | US20020093022 Semiconductor device formed by cascade-connecting a plurality of diodes |
| 07/18/2002 | US20020093021 Thin-film transistor display devices |
| 07/18/2002 | US20020093019 Electro-optical device, method for making the same, and electronic apparatus |
| 07/18/2002 | US20020093018 Semiconductor device and mehod for fabricating the same |
| 07/18/2002 | US20020093017 Metal induced self-aligned crystallization of Si layer for TFT |
| 07/18/2002 | US20020093016 Thin film transistor array substrate for liquid crystal display and a method for fabricating the same |
| 07/18/2002 | US20020093014 Semiconductor chip, semiconductor device, and process for producing a semiconductor device |
| 07/18/2002 | US20020093012 Method for manufacturing semiconductor device and ultrathin semiconductor device |
| 07/18/2002 | US20020093002 Chemical mechanical polishing slurry |
| 07/18/2002 | US20020092993 Scaling method for a digital photolithography system |
| 07/18/2002 | US20020092986 Method and an apparatus of an inspection system using an electron beam |
| 07/18/2002 | US20020092985 Focused ion beam machining method and focused ion beam machining apparatus |
| 07/18/2002 | US20020092968 Optical barrier |
| 07/18/2002 | US20020092964 Wafer edge exposure apparatus, and wafer edge exposure method |
| 07/18/2002 | US20020092917 Adjustable nozzle for wafer bevel cleaning |
| 07/18/2002 | US20020092895 Formation of a solder joint having a transient liquid phase by annealing and quenching |
| 07/18/2002 | US20020092894 One-step bumping/bonding method for forming semiconductor packages |
| 07/18/2002 | US20020092893 Lead penetrating clamping system |
| 07/18/2002 | US20020092886 Method and apparatus for balling and assembling ball grid array and chip scale array packages |
| 07/18/2002 | US20020092843 Variable surface hot plate for improved bake uniformity of substrates |
| 07/18/2002 | US20020092839 Method of making an integrated circuit |
| 07/18/2002 | US20020092836 Method and apparatus for marking an identification mark on a wafer |
| 07/18/2002 | US20020092827 Abrasive-free metal CMP in passivation domain |
| 07/18/2002 | US20020092826 Low ceiling temperature process for a plasma reactor with heated source of a polymer-hardening precursor material |
| 07/18/2002 | US20020092822 Methods of fabricating microelectromechanical and microfluidic devices |
| 07/18/2002 | US20020092815 Semiconductor wafer boat having stackable independently replaceable boat parts and vertical heat-treating apparatus comprising the same |
| 07/18/2002 | US20020092794 Container for electric device |
| 07/18/2002 | US20020092772 Barrier layer for electroplating processes |
| 07/18/2002 | US20020092771 Electroplating methods including maintaining a determined electroplating voltage and related systems |
| 07/18/2002 | US20020092764 Method of forming a conductive layer and an electroplating apparatus thereof |
| 07/18/2002 | US20020092763 Method for forming a barrier layer for use in a copper interconnect |
| 07/18/2002 | US20020092676 Compliant layer for encapsulated cloumns |
| 07/18/2002 | US20020092674 Surface-mounting substrate and structure comprising substrate and part mounted on the substrate |
| 07/18/2002 | US20020092673 Tungsten encapsulated copper interconnections using electroplating |
| 07/18/2002 | US20020092660 Strip supported anodized heat sink |
| 07/18/2002 | US20020092622 Die bonder |
| 07/18/2002 | US20020092618 Parallel-plate electrode plasma reactor having an inductive antenna coupling power through a parallel plate electrode |
| 07/18/2002 | US20020092616 Apparatus for plasma treatment using capillary electrode discharge plasma shower |
| 07/18/2002 | US20020092615 Substrate processing apparatus and substrate processing method |
| 07/18/2002 | US20020092614 Wet chemical process tank with improved fluid circulation |
| 07/18/2002 | US20020092610 Supporting substrate to be bonded with semiconductor bare chip and method of thermocompression-bonding the same |