| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/23/2002 | US6423565 Apparatus and processes for the massproduction of photovotaic modules |
| 07/23/2002 | US6423562 Exposing n-type contact layer of gallium nitride-based compound semiconductor to oxygen plasma to form oxygen-doped surface layer in surface of contact layer, forming electrode metal on oxygen-doped layer |
| 07/23/2002 | US6423561 Method for fabricating semiconductor device |
| 07/23/2002 | US6423560 Method of making an optoelectronic device using multiple etch stop layers |
| 07/23/2002 | US6423559 Integrated circuit and fabricating method and evaluating method of integrated circuit |
| 07/23/2002 | US6423558 Method for fabricating integrated circuit (IC) dies with multi-layered interconnect structures |
| 07/23/2002 | US6423557 ADC based in-situ destructive analysis selection and methodology therefor |
| 07/23/2002 | US6423556 Method for evaluating impurity concentrations in heat treatment furnaces |
| 07/23/2002 | US6423555 System for determining overlay error |
| 07/23/2002 | US6423554 Forming hydrogen barrier layer on top of metal interconnection electrically connecting transistor to capacitor in memory cell to protect capacitor from hydrogen damage |
| 07/23/2002 | US6423480 Remover composition |
| 07/23/2002 | US6423475 Sidewall formation for sidewall patterning of sub 100 nm structures |
| 07/23/2002 | US6423474 Patterning and etching photoresist; annealing |
| 07/23/2002 | US6423463 Novolac, polyvinyl lower alkyl ether, polyphenol derivative, and naphthoquinonediazide; positive tones, printed circuits |
| 07/23/2002 | US6423457 In-situ process for monitoring lateral photoresist etching |
| 07/23/2002 | US6423433 Method of forming Cu-Ca-O thin films on Cu surfaces in a chemical solution and semiconductor device thereby |
| 07/23/2002 | US6423405 Light energy is irradiated onto the surface of the high polymer material in a desired area; improving wettability |
| 07/23/2002 | US6423400 Electrostatic chucks formed by lamination of aluminum nitride with high melting metals and an adhesive layer, for coating silicon wafers; corrosion resistance |
| 07/23/2002 | US6423384 HDP-CVD deposition of low dielectric constant amorphous carbon film |
| 07/23/2002 | US6423383 Converting reactive carbon compounds into a gas plasma by resonance using microwaves and magnetic fields, then coating amorphous carbon films on substrates |
| 07/23/2002 | US6423377 Coating a polyether solution on a substrate and exposing to heating; low dielectric constant; stability |
| 07/23/2002 | US6423367 Adhesives; coatings; encapsulation |
| 07/23/2002 | US6423284 Fluorine abatement using steam injection in oxidation treatment of semiconductor manufacturing effluent gases |
| 07/23/2002 | US6423278 Plasma dry scrubber |
| 07/23/2002 | US6423271 Multilayer lamination device, exterior support, fluid pumps |
| 07/23/2002 | US6423242 Etching silicon dioxide film formed on silicon nitride film on a substrate with a perlfuorobutene gas, high frequency electric field applied between first and second electrodes |
| 07/23/2002 | US6423201 Method of improving the adhesion of copper |
| 07/23/2002 | US6423200 Depositing a copper seed layer over dielectric layer and into etched features of dielectric layer having a barrier layer; treating copper seed layer to remove oxidized layer from over copper seed layer; electroplating copper fill layer |
| 07/23/2002 | US6423192 Sputtering apparatus and film forming method |
| 07/23/2002 | US6423178 Apparatus for plasma process |
| 07/23/2002 | US6423177 Apparatus for performing plasma process on particles |
| 07/23/2002 | US6423175 Apparatus and method for reducing particle contamination in an etcher |
| 07/23/2002 | US6423174 Forming cavities in semiconductor substrates; placing silicone coated membrane sheet over cavity before lamination, conforming to the contour of the cavity to prevent collapse of or damage to cavity shelves during lamination |
| 07/23/2002 | US6423149 Apparatus and method for gradient cleaning of semiconductor wafers |
| 07/23/2002 | US6423148 Polishing solution |
| 07/23/2002 | US6423147 Method of cleaning a wafer |
| 07/23/2002 | US6423146 Method for cleaning a semiconductor substrate |
| 07/23/2002 | US6423139 Chemical liquid treatment apparatus |
| 07/23/2002 | US6423125 Polishing composition |
| 07/23/2002 | US6423102 Rigid support; elastic member |
| 07/23/2002 | US6422930 Apparatus for removing deposited film |
| 07/23/2002 | US6422928 Abrasive machine |
| 07/23/2002 | US6422923 Apparatus and methods for substantial planarization of solder bumps |
| 07/23/2002 | US6422922 Workpiece holder for polishing, apparatus for polishing workpiece and method for polishing workpiece |
| 07/23/2002 | US6422921 Heat activated detachable polishing pad |
| 07/23/2002 | US6422919 Apparatus and methods for substantial planarization of solder bumps |
| 07/23/2002 | US6422918 Chemical-mechanical polishing of photoresist layer |
| 07/23/2002 | US6422823 Mini-environment control system and method |
| 07/23/2002 | US6422798 Process and arrangement for continuous treatment of objects |
| 07/23/2002 | US6422489 Locking apparatus for a nozzle exchange apparatus |
| 07/23/2002 | US6422452 Method and apparatus for lining up micro-balls |
| 07/23/2002 | US6422448 Ultrasonic horn for a bonding apparatus |
| 07/23/2002 | US6422247 Pipes, vacuum pumps; evacuation |
| 07/23/2002 | US6422227 Dicing apparatus, kerf inspecting method and kerf inspecting system |
| 07/23/2002 | US6422172 Plasma processing apparatus and plasma processing method |
| 07/23/2002 | US6421973 Wallboard sheet including aerated concrete core |
| 07/23/2002 | CA2255370C Process of supplying moisture at small flow rate |
| 07/18/2002 | WO2002056468A2 Method and system for efficient and accurate filtering and interpolation |
| 07/18/2002 | WO2002056449A1 Local supply generator for a digital cmos integrated circuit having an analog signal processing circuitry |
| 07/18/2002 | WO2002056393A1 Compound semiconductor element based on group iii element nitride |
| 07/18/2002 | WO2002056388A2 Sensor semiconductor package, provided with an insert, and method for making same |
| 07/18/2002 | WO2002056384A1 Semiconductor device and method for fabricating the same |
| 07/18/2002 | WO2002056383A1 Semiconductor storage device and its manufacturing method |
| 07/18/2002 | WO2002056382A1 Semiconductor device and method for fabricating the same |
| 07/18/2002 | WO2002056381A1 Semiconductor device and production method therefor |
| 07/18/2002 | WO2002056380A1 A method of manufacturing an active matrix substrate |
| 07/18/2002 | WO2002056376A2 Method of integrating a heat spreader and a semiconductor, and package formed thereby |
| 07/18/2002 | WO2002056375A1 Molding of protective caps |
| 07/18/2002 | WO2002056374A1 Molds for wafer scale molding of protective caps |
| 07/18/2002 | WO2002056373A1 Molding assembly for wafer scale molding of protective caps |
| 07/18/2002 | WO2002056372A1 Use of infrared radiation in molding of protective caps |
| 07/18/2002 | WO2002056371A1 Method for mounting a semiconductor component in a housing |
| 07/18/2002 | WO2002056370A1 Integrated circuit and method for making same |
| 07/18/2002 | WO2002056369A2 Method for the production of trench capacitors for integrated semiconductor memories |
| 07/18/2002 | WO2002056368A1 High-frequency power amplifier and radio communication device |
| 07/18/2002 | WO2002056367A1 Wafer scale molding of protective caps |
| 07/18/2002 | WO2002056366A1 Use of protective caps as masks at a wafer scale |
| 07/18/2002 | WO2002056365A2 Method for subdividing wafers into chips |
| 07/18/2002 | WO2002056364A2 Conductor reservoir volume for integrated circuit interconnects |
| 07/18/2002 | WO2002056363A1 Insulating structures of buried layers with buried trenches and method for making same |
| 07/18/2002 | WO2002056361A1 Light emitting semiconductor package |
| 07/18/2002 | WO2002056359A1 Capping layer for improved silicide formation in narrow semiconductor structures |
| 07/18/2002 | WO2002056358A2 Sidewalls as semiconductor etch stop and diffusion barrier |
| 07/18/2002 | WO2002056357A1 Sheet-fed treating device |
| 07/18/2002 | WO2002056356A1 Polishing method, polishing device, and semiconductor device producing method |
| 07/18/2002 | WO2002056355A1 Method and device for laser annealing |
| 07/18/2002 | WO2002056354A1 Method for forming a pattern and a semiconductor device |
| 07/18/2002 | WO2002056353A1 Treating device and treating method |
| 07/18/2002 | WO2002056352A1 Bonding apparatus, and bonding method |
| 07/18/2002 | WO2002056351A2 Polishing of semiconductor substrates |
| 07/18/2002 | WO2002056350A2 Apparatus and methods for manipulating semiconductor wafers |
| 07/18/2002 | WO2002056349A2 Chamber for uniform substrate heating |
| 07/18/2002 | WO2002056348A2 Method for incorporating silicon into cvd metal films |
| 07/18/2002 | WO2002056347A2 Method of testing of a semiconductor wafer by mechanical stressing of a die |
| 07/18/2002 | WO2002056346A2 Point contact for semiconductors and the production thereof |
| 07/18/2002 | WO2002056345A2 Flip chip package semiconductor device having double stud bumps and method of forming same |
| 07/18/2002 | WO2002056344A2 Transportable container including an internal environment monitor |
| 07/18/2002 | WO2002056343A2 Methods for improved planarization post cmp processing |
| 07/18/2002 | WO2002056342A2 Copper vias in low-k technology |
| 07/18/2002 | WO2002056340A2 Semiconductor device with fuse, resistor, diffusion barrier or capacitor of a refractory metal-silicon-nitrogen compound |