Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2002
07/23/2002US6424001 Flash memory with ultra thin vertical body transistors
07/23/2002US6424000 Floating gate memory apparatus and method for selected programming thereof
07/23/2002US6423999 Semiconductor device and capacitor with means to prevent deterioration due to hydrogen
07/23/2002US6423998 Semiconductor device capacitor and method of manufacturing the same
07/23/2002US6423997 Semiconductor integrated circuit having a non-volatile semiconductor memory and a capacitor
07/23/2002US6423996 Process for fabricating a metal-metal capacitor within an integrated circuit, and corresponding integrated circuit
07/23/2002US6423992 Semiconductor integrated circuit device
07/23/2002US6423990 Vertical heterojunction bipolar transistor
07/23/2002US6423989 Semiconductor device and method of manufacturing the same
07/23/2002US6423982 Diamond interconnection substrate and a manufacturing method therefor
07/23/2002US6423978 System for detecting disk-shaped object such as semiconductor wafer or magnetic disk
07/23/2002US6423977 Pattern size evaluation apparatus
07/23/2002US6423976 Ion implanter and a method of implanting ions
07/23/2002US6423975 Wafer holder for simox processing
07/23/2002US6423973 X-ray image sensor and method for fabricating the same
07/23/2002US6423967 Detection apparatus and detection method to be used for scanning probe and observation apparatus and observation method
07/23/2002US6423949 Multi-zone resistive heater
07/23/2002US6423947 Thermal processing chamber for heating and cooling wafer-like objects
07/23/2002US6423939 Micro soldering method and apparatus
07/23/2002US6423938 Method for the electrical and/or mechanical interconnection of components of a microelectronic system
07/23/2002US6423927 Laser system
07/23/2002US6423797 Anti-reflective coating polymers from p-tosylmethylacrylamide and preparation method
07/23/2002US6423654 Method of manufacturing a semiconductor device having silicon oxynitride passavation layer
07/23/2002US6423653 Reduction of plasma damage for HDP-CVD PSG process
07/23/2002US6423652 Forming dielectric layer over substrate, implanting dopants including hydrogen ions into dielectric layer to form compact layer on surface, performing annealing operation
07/23/2002US6423651 Insulating film of semiconductor device and coating solution for forming insulating film and method of manufacturing insulating film
07/23/2002US6423650 Ultra-thin resist coating quality by increasing surface roughness of the substrate
07/23/2002US6423649 Method and apparatus for stabilizing high pressure oxidation of a semiconductor device
07/23/2002US6423648 Controllable oxidation technique for the formation of high-quality ultra-thin gate oxide using carbon dioxide as the oxidizing agent
07/23/2002US6423647 Formation of dielectric regions of different thicknesses at selective location areas during laser thermal processes
07/23/2002US6423646 Exposing silicon surface having fluoropolymer contaminating films and damaged silicon layers formed thereon, to ethanolamine-containing cleaning solution for time to remove films and layers, rinsing to remove cleaning solution
07/23/2002US6423645 Method for forming a self-aligned contact
07/23/2002US6423644 Method of etching tungsten or tungsten nitride electrode gates in semiconductor structures
07/23/2002US6423643 Process of making carrier substrate and semiconductor device
07/23/2002US6423642 Reactor for processing a semiconductor wafer
07/23/2002US6423641 Method of making self-aligned bit-lines
07/23/2002US6423640 Headless CMP process for oxide planarization
07/23/2002US6423639 Planarization method of insulating layer for semiconductor device
07/23/2002US6423638 Filter apparatus and method therefor
07/23/2002US6423637 A diffusion prevention film is formed on a damascene pattern, a first copper film is formed by a physical vapor depositon, a second copper film is formed by spin-on coating and third copper film is formed by electrochemical deposition
07/23/2002US6423636 Process sequence for improved seed layer productivity and achieving 3mm edge exclusion for a copper metalization process on semiconductor wafer
07/23/2002US6423635 Method of filling a recess
07/23/2002US6423634 Method of forming low resistance metal silicide region on a gate electrode of a transistor
07/23/2002US6423633 Implanting plurality of atoms into surface of patterned copper layer using implantation gas which comprises one selected from group consisting of nitrogen, oxygen, nitrogen dioxide and nitrous oxide, heat treating
07/23/2002US6423632 Semiconductor device and a process for forming the same
07/23/2002US6423631 Isolation using an antireflective coating
07/23/2002US6423630 Process for forming low K dielectric material between metal lines
07/23/2002US6423629 Multilevel copper interconnects with low-k dielectrics and air gaps
07/23/2002US6423628 Method of forming integrated circuit structure having low dielectric constant material and having silicon oxynitride caps over closely spaced apart metal lines
07/23/2002US6423627 Method for forming memory array and periphery contacts using a same mask
07/23/2002US6423626 Removal of metal cusp for improved contact fill
07/23/2002US6423625 Method of improving the bondability between Au wires and Cu bonding pads
07/23/2002US6423622 Lead-bond type chip package and manufacturing method thereof
07/23/2002US6423620 Semiconductor processing methods of forming contact openings, methods of forming memory circuitry, methods of forming electrical connections, and methods of forming dynamic random access memory dram circuitry
07/23/2002US6423619 Transistor metal gate structure that minimizes non-planarity effects and method of formation
07/23/2002US6423618 Method of manufacturing trench gate structure
07/23/2002US6423617 In-situ use of dichloroethene and NH3 in an H2O steam based oxidation system to provide a source of chlorine
07/23/2002US6423616 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
07/23/2002US6423615 Silicon wafers for CMOS and other integrated circuits
07/23/2002US6423614 Method of delaminating a thin film using non-thermal techniques
07/23/2002US6423613 Low temperature silicon wafer bond process with bulk material bond strength
07/23/2002US6423612 Method of fabricating a shallow trench isolation structure with reduced topography
07/23/2002US6423611 Manufacturing process of capacitor
07/23/2002US6423610 Method for forming inner capacitor of semiconductor devices using oxide layers formed through a plurality of radially-arranged injecting holes of a SACVD equipment showerhead
07/23/2002US6423609 Methods of forming capacitors on a wafer, photolithographic methods of forming capacitors on a wafer, and semiconductor wafer
07/23/2002US6423608 Method of manufacturing a capacitor in a semiconductor integrated circuit and a capacitor fabricated thereby
07/23/2002US6423607 Trench capacitor with insulation collar and corresponding fabrication method
07/23/2002US6423606 Semiconductor processing methods, methods of forming a resistor and methods of forming a diode
07/23/2002US6423605 Method and apparatus for forming ultra-shallow junction for semiconductor device
07/23/2002US6423604 Determination of thermal resistance for field effect transistor formed in SOI technology
07/23/2002US6423603 Method of forming a microwave array transistor for low-noise and high-power applications
07/23/2002US6423602 Circuit manufacturing method and apparatus, anneal control method and apparatus, information storage medium
07/23/2002US6423601 Retrograde well structure formation by nitrogen implantation
07/23/2002US6423600 Anisotropic etching silicon nitride layer to remove portions and form spacers, also removing portion of underlying oxide layer, cleaning oxide layer, applying dilute hydrogen fluoride solution to make thickness uniform, doping through oxide
07/23/2002US6423599 Method for fabricating a field effect transistor having dual gates in SOI (semiconductor on insulator) technology
07/23/2002US6423598 Semiconductor device, a method of manufacturing the same, and a semiconductor device protective circuit
07/23/2002US6423597 Structure of a DRAM and a manufacturing process thereof
07/23/2002US6423596 Method for two-sided fabrication of a memory array
07/23/2002US6423595 Method for scribing a semiconductor device
07/23/2002US6423594 Method of fabricating deep trench capacitor
07/23/2002US6423593 Semiconductor integrated circuit device and process for manufacturing the same
07/23/2002US6423592 PZT layer as a temporary encapsulation and hard mask for a ferroelectric capacitor
07/23/2002US6423591 Semiconductor device and method for fabricating the same
07/23/2002US6423590 High voltage transistor using P+ buried layer
07/23/2002US6423589 Methods for fabricating CMOS integrated circuits including source/drain compensating regions
07/23/2002US6423588 Method of manufacturing semiconductor integrated circuit device
07/23/2002US6423587 Method for fabricating a MOS transistor
07/23/2002US6423586 Melting a noncrystal semiconductor film containing silicon, oxygen, nitrogen and carbon by irradiating with a laser beam to crystallize; specified raman shift; thin film transistors
07/23/2002US6423585 Heating treatment device, heating treatment method and fabrication method of semiconductor device
07/23/2002US6423584 method for forming capacitors and field effect transistors in a semiconductor integrated circuit device
07/23/2002US6423583 Methodology for electrically induced selective breakdown of nanotubes
07/23/2002US6423582 Use of DAR coating to modulate the efficiency of laser fuse blows
07/23/2002US6423580 Method for manufacturing a dual chip package
07/23/2002US6423578 Field-effect transistor and manufacture thereof
07/23/2002US6423574 Method of manufacturing diodes with ceramic base
07/23/2002US6423573 Integrated electronic circuit comprising at least an electronic power component
07/23/2002US6423570 Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby
07/23/2002US6423568 Method of fabricating a silicon solar cell
07/23/2002US6423567 Method for producing contact structures in solar cells
07/23/2002US6423566 Moisture and ion barrier for protection of devices and interconnect structures