Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2002
08/01/2002US20020102765 Forming an electrical contact on an electronic component
08/01/2002US20020102764 Process for producing a photoelectric conversion device
08/01/2002US20020102761 Formation method for semiconductor layer
08/01/2002US20020102760 Method of making an electrode
08/01/2002US20020102758 Method of manufacturing display device
08/01/2002US20020102757 Method of manufacturing a display device
08/01/2002US20020102752 Method for measuring effective gate channel length during C-V method
08/01/2002US20020102751 Method of determining electrical properties of silicon-on-insulator wafers
08/01/2002US20020102749 Methods and systems for determining a characteristic of a layer formed on a specimen by a deposition process
08/01/2002US20020102748 Method and apparatus for measuring very thin dielectric film thickness and creating a stable measurement environment
08/01/2002US20020102747 Correction of overlay offset between inspection layers in integrated circuits
08/01/2002US20020102746 Method of manufacturing probe unit and probe unit manufactured using this method
08/01/2002US20020102745 Process for modifying chip assembly substrates
08/01/2002US20020102512 Ceramic heater
08/01/2002US20020102511 Apparatus for baking wafers
08/01/2002US20020102510 Semiconductor manufacturing apparatus
08/01/2002US20020102496 Thin film circuit substrate and manufacturing method therefor
08/01/2002US20020102492 Positive-working resist composition
08/01/2002US20020102483 Antireflective coating compositions
08/01/2002US20020102478 Semitransparent phase shifting mask has, in the periphery of a pattern element area, a light shielding portion which is formed by a semitransparent phase shifting portion and a transparent portion with the optimal size combination.
08/01/2002US20020102477 Semiconductor device manufacturing method
08/01/2002US20020102476 Preparing a plurality of first photomasks including one or more resist masks; and transferring each pattern of said photomasks onto a second photomask by reduced projection exposure.
08/01/2002US20020102473 Completely-light-shielding Cr section of the scribe-line region assumes a light-shielding structure of self-aligned type; dicing mark section assumes a light-shielding structure of Cr setback type.
08/01/2002US20020102430 Semiconductor device manufacturing method and semiconductor device
08/01/2002US20020102418 Oxidized film structure and method of making epitaxial metal oxide structure
08/01/2002US20020102413 Plasma curing of MSQ-based porous low-k film materials
08/01/2002US20020102396 Mesoporous films having reduced dielectric constants
08/01/2002US20020102365 Adhesion of diffusion barrier and fluorinated silicon dioxide using hydrogen based preclean technology
08/01/2002US20020102358 Forming an insulator by fabricating a nitrided oxide layer on a layer of silicon carbide; and annealing the nitrided oxide layer in an environment containing hydrogen.
08/01/2002US20020102156 Microelectronic workpiece transfer devices and methods of using such devices in the processing of microelectronic workpieces
08/01/2002US20020102155 Simplified and enhanced scara arm
08/01/2002US20020102098 Heat-treating methods and systems
08/01/2002US20020102016 Image processing method and device
08/01/2002US20020102015 Pellicle, identification system of the same, and method of identifying the same
08/01/2002US20020101956 X-ray projection exposure apparatus and a device manufacturing method
08/01/2002US20020101899 Vertical cavity surface emitting laser device
08/01/2002US20020101896 DFB semiconductor laser device
08/01/2002US20020101892 Exposure apparatus and device manufacturing method using the same
08/01/2002US20020101777 Method and apparatus for initializing an integrated circuit using compressed data from a remote fusebox
08/01/2002US20020101760 Mram architecture and system
08/01/2002US20020101759 Shared ground sram cell
08/01/2002US20020101757 Semiconductor memory device and method of operation thereof
08/01/2002US20020101754 Semiconductor memory device including an SOI
08/01/2002US20020101723 Coaxial wiring within SOI semiconductor, PCB to system for high speed operation and signal quality
08/01/2002US20020101596 Semiconductor wafer position detecting system, semiconductor device fabricating facility of using the same, and wafer position detecting method thereof
08/01/2002US20020101591 Vacuum measurement device
08/01/2002US20020101585 Apparatus for rapidly measuring angle-dependent diffraction effects on finely patterned surfaces
08/01/2002US20020101576 Method for analyzing impurities in a silicon substrate and apparatus for decomposing a silicon substrate through vapor-phase reaction
08/01/2002US20020101548 Structure of a liquid crystal display and the method of manufacturing the same
08/01/2002US20020101508 Monitoring system for hostile environment
08/01/2002US20020101460 Lithography apparatus, lithography method and method of manufacturing master print for transfer
08/01/2002US20020101394 Thin film transistor for supplying power to element to be driven
08/01/2002US20020101283 RF amplifier
08/01/2002US20020101278 Digitally controlled impedance for I/O of an integrated circuit device
08/01/2002US20020101273 Semiconductor device
08/01/2002US20020101253 Method and device for vibration control
08/01/2002US20020101178 Active matrix organic electroluminescence display device and method for manufacturing the same
08/01/2002US20020101152 Light emitting device
08/01/2002US20020100989 Electronic device package
08/01/2002US20020100988 Semiconductor apparatus and a semiconductor device mounting method
08/01/2002US20020100986 Electronic device
08/01/2002US20020100984 Semiconductor device and its fabrication method
08/01/2002US20020100983 Method for producing dual damascene interconnections and structure produced thereby
08/01/2002US20020100982 Wafer level package and method for manufacturing the same
08/01/2002US20020100981 Tantalum - aluminum - nitrogen material for semiconductor devices
08/01/2002US20020100980 Semiconductor device and method of manufacturing the same
08/01/2002US20020100978 Semiconductor device with an improvement in alignment, and method of manufacturing the same
08/01/2002US20020100977 Semiconductor device having reliable coupling with mounting substrate
08/01/2002US20020100975 Semiconductor integrated circuit and fabrication process therefor
08/01/2002US20020100974 Semiconductor device, semiconductor device mounting structure, liquid crystal device, and electronic apparatus
08/01/2002US20020100973 Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same
08/01/2002US20020100972 Semiconductor device with gold bumps, and method and apparatus of producing the same
08/01/2002US20020100969 Flip chip package with improved cap design and process for making thereof
08/01/2002US20020100966 Method for fabricating a multilayer ceramic substrate
08/01/2002US20020100964 Electronic component, method of manufacturing the electronic component, and method of manufacturing electronic circuit device
08/01/2002US20020100962 Unmolded package for a semiconductor device
08/01/2002US20020100960 Wafer level package including ground metal layer
08/01/2002US20020100959 Capacitor for semiconductor memory device and method of manufacturing the same
08/01/2002US20020100955 Method and apparatus for extending fatigue life of solder joints semiconductor device
08/01/2002US20020100953 Semiconductor device having shallow trench isolation structure and manufacturing method thereof
08/01/2002US20020100952 Semiconductor device and method of forming isolation area in the semiconductor device
08/01/2002US20020100951 Offset-gate-type semiconductor device
08/01/2002US20020100949 Bonding pad structure of semiconductor device and method for fabricating the same
08/01/2002US20020100947 Method for forming variable-K gate dielectric
08/01/2002US20020100946 Silicon oxide based gate dielectric layer
08/01/2002US20020100945 Method for delineation of eDRAM support device notched gate
08/01/2002US20020100944 Semiconductor integrated circuit device
08/01/2002US20020100943 Method of manufacturing semiconductor device, and semiconductor device manufactured thereby
08/01/2002US20020100942 CMOS inverter and integrated circuits utilizing strained silicon surface channel MOSFETs
08/01/2002US20020100941 Thin-film semiconductor device and method of manufacturing the same
08/01/2002US20020100939 Method of manufacturing a semiconductor device
08/01/2002US20020100938 Fully inverted type SOI-MOSFET capable of increasing the effective mutual conductance
08/01/2002US20020100937 Semiconductor device and method of manufacturing the same
08/01/2002US20020100936 Gate insulating structure for power devices, and related manufacturing process
08/01/2002US20020100934 High voltage semiconductor device
08/01/2002US20020100933 Field effect transistor having a lateral depletion structure
08/01/2002US20020100932 Method of forming a trench transistor having a superior gate dielectric
08/01/2002US20020100931 Method and composite for decreasing charge leakage
08/01/2002US20020100930 Non-volatile semiconductor memory device and method of manufacturing the same
08/01/2002US20020100929 Semiconductor integrated circuit device including nonvolatile semiconductor memory devices
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