Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2002
08/01/2002US20020100928 Nonvolatile semiconductor device and fabrication process for the same
08/01/2002US20020100927 Semiconductor device
08/01/2002US20020100926 Semiconductor device having a flash memory cell and fabrication method thereof
08/01/2002US20020100924 Method of forming dram circuitry
08/01/2002US20020100923 Method for producing an electrode of a field-effect-controllable semiconductor component and field-effect-controllable semiconductor component
08/01/2002US20020100920 Sram device
08/01/2002US20020100917 Incorporation of carbon in silicon/silicon germanium epitaxial layer to enhance yield for si-ge bipolar technology
08/01/2002US20020100916 Self aligned symmetric intrinsic process and device
08/01/2002US20020100910 Band gap engineering of amorphous A1-Ga-N alloys
08/01/2002US20020100909 Thin film transistor
08/01/2002US20020100908 Thin film device provided with coating film, liquid crystal panel and electronic device, and method for making the thin film device
08/01/2002US20020100907 Metal-to-metal antifuse structure and fabrication method
08/01/2002US20020100905 Method for enhancing vertical growth during the selective formation of silicon, and structures formed using same
08/01/2002US20020100904 Dual work function semiconductor structure with borderless contact and method of fabricating the same
08/01/2002US20020100895 For polishing multiple metal layers and thin-films where one of the layers or films is comprises of copper or a copper containing alloy
08/01/2002US20020100881 Charged particle beam lithography apparatus for forming pattern on semi-conductor
08/01/2002US20020100872 Electron beam inspection method and apparatus and semiconductor manufacturing method and its manufacturing line utilizing the same
08/01/2002US20020100871 Focused ion beam apparatus
08/01/2002US20020100853 Stage apparatus
08/01/2002US20020100790 Bonding tool with polymer coating
08/01/2002US20020100753 Apparatuses and methods for resistively heating a thermal processing system
08/01/2002US20020100751 Apparatus and method for atmospheric pressure reactive atom plasma processing for surface modification
08/01/2002US20020100745 Ethching method
08/01/2002US20020100743 Multi-step polish process to control uniformity when using a selective slurry on patterned wafers
08/01/2002US20020100693 Forming a copper seed layer over a semiconductor body, wherein copper oxide forms at a surface of copper seed layer electrochemically reducing copper oxide; electrochemically depositing copper layer on copper seed layer
08/01/2002US20020100610 Electronic component and method and structure for mounting semiconductor device
08/01/2002US20020100558 Inner lead bonding apparatus
08/01/2002US20020100557 ICP window heater integrated with faraday shield or floating electrode between the source power coil and the ICP window
08/01/2002US20020100555 Linear drive system for use in a plasma processing system
08/01/2002US20020100554 Substrate processing using a member comprising an oxide of a group IIIB metal
08/01/2002US20020100553 Adhesive tape and process for removing resist
08/01/2002US20020100545 Multilayer; silicon substrate overcoated with silicon oxide or nitride dielectric, then passivation layer; noncracking
08/01/2002US20020100532 Method for making wallboard or backerboard sheets including aerated concrete
08/01/2002US20020100496 Apparatus for cleaning wafers
08/01/2002US20020100495 Method and apparatus for cleaning containers
08/01/2002US20020100424 Scanning deposition head for depositing particles on a wafer
08/01/2002US20020100423 Method of fabricating jig for vacuum apparatus
08/01/2002US20020100421 Deposited film forming apparatus and deposited film forming method
08/01/2002US20020100419 Film treatment apparatus and method
08/01/2002US20020100417 Heating-type trap device and film-deposition apparatus
08/01/2002US20020100413 Method for growing semiconductor epitaxial layer with different growth rates in selective areas
08/01/2002US20020100412 Low dislocation buffer and process for production thereof as well as device provided with low dislocation buffer
08/01/2002US20020100409 Method of crystallizing amorphous silicon layer and crystallizing apparatus thereof
08/01/2002US20020100391 Electroless Ni-B plating liquid, electronic device and method for manufacturing the same
08/01/2002US20020100354 Wire sawing device
08/01/2002US20020100334 Apparatus to quantify the adhesion of film
08/01/2002US20020100282 Thermal exchanger for a wafer chuck
08/01/2002US20020100165 Method of forming an integrated circuit device package using a temporary substrate
08/01/2002US20020100164 Wiring substrate manufacturing method
08/01/2002US20020100163 Universal clamping mechanism
08/01/2002US20020100162 Carrier reel, carriage method using the carrier reel, and method for manufacturing electronic device
08/01/2002US20020100132 Porous polymeric substrate treatment device and method
08/01/2002US20020100131 Labyrinth seal for bearing in brush mounting assembly for semiconductor wafer scrubber
08/01/2002DE10203820A1 Halbleiterbauelement und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation
08/01/2002DE10203604A1 Behälter für suspendierte Teilchen für einen Zerstäuber Container for suspended particles for a nebulizer
08/01/2002DE10164189A1 Halbton-Phasenverschiebungsmaske und -maskenrohling Halftone phase shift mask and -maskenrohling
08/01/2002DE10161058A1 Halbleiterbauelement und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation
08/01/2002DE10156341A1 Verdrahtungsaufbau für Übertragungsleitung Wiring structure for transmission line
08/01/2002DE10145045A1 Integrierter Schaltkreis mi einem tiefen Wannen-Bereich und dazu gehöriges Verfahren Integrated circuit mi a deep well region and associated method
08/01/2002DE10136655C1 Multichipmodul in COB Bauweise, insbesondere CompactFlash Card mit hoher Speicherkapazität und Verfahren zur Herstellung desselben The same multi-chip module in COB construction, in particular CompactFlash card with high storage capacity and methods of making
08/01/2002DE10135068A1 Ausrichtgerät zum Ausbilden eines Musters auf einem Halbleitersubstrat durch Belichten und Verfahren zur Herstellung einer Halbleitervorrichtung mit einem Ausrichtgerät Aligner for forming a pattern on a semiconductor substrate by exposing and method of manufacturing a semiconductor device having a positioning mechanism
08/01/2002DE10122283A1 Chemisch-mechanisches Polierverfahren Chemical mechanical polishing method
08/01/2002DE10111708A1 Halbleitervorrichtung und Herstellungsverfharen für dieselbe Semiconductor device and for the same Herstellungsverfharen
08/01/2002DE10104324A1 Verfahren zum Ätz-Strukturieren der Oberfläche eines Bauteils A method of etching patterning the surface of a component
08/01/2002DE10104177A1 Katadioptrisches Reduktionsobjektiv A catadioptric reduction objective
08/01/2002DE10103670A1 Erzeugung kristalliner Si-Schichten mit (100)-Textur durch Laserbeschuß amorpher Si-Schichten auf einem Substrat Generating crystalline Si layers with (100) texture by laser bombardment amorphous Si layers on a substrate
08/01/2002DE10103253A1 Verfahren und Anordnung zum Transportieren und Inspizieren von Halbleitersubstraten Method and apparatus for transporting and inspecting semiconductor substrates
08/01/2002DE10103193A1 Verfahren zur Herstellung von Leiterbahnstrukturen A process for the production of conductor track structures
08/01/2002DE10103186A1 Elektronisches Bauteil mit einem Halbleiter-Chip und Verfahren zur Herstellung desselben The same electronic component having a semiconductor chip and method for producing
08/01/2002DE10103111A1 Vorrichtung zum Behandeln von Substraten Apparatus for processing substrates
08/01/2002DE10103084A1 Halbleitermodul und Verfahren zu seiner Herstellung Semiconductor module and method for its preparation
08/01/2002DE10103062A1 Chemisch-mechanisches Polierverfahren für emulsionsfreie feste Schleifkissen Chemical mechanical polishing method for emulsion-free solid abrasive pad
08/01/2002DE10103061A1 Verfahren zur Inspektion der Tiefe einer Öffnung in einer dielektrischen Materialschicht A method for inspection of the depth of an opening in a dielectric material layer
08/01/2002DE10101875A1 Elektronisches Bauteil mit aufeinander gestapelten Halbleiterchips An electronic part having successive stacked semiconductor chips
08/01/2002DE10101526A1 Grabenkondensator mit verbessertem Dielektrikum und entsprechendes Herstellungsverfahren Grave capacitor with improved dielectric and method of manufacture
08/01/2002DE10100882A1 Verfahren zur Montage eines Halbleiterbauelementes und Halbleiterbauelement A method for mounting a semiconductor device and semiconductor device
08/01/2002DE10011642C2 Verfahren zur Erzeugung einer Flachgrabenisolation eines Halbleiterbauteils Method for producing a flat grave insulation of a semiconductor device
08/01/2002CA2435623A1 Viscous protective overlayers for planarization of integrated circuits
08/01/2002CA2434978A1 Method of alignment
08/01/2002CA2432012A1 Planarizers for spin etch planarization of electronic components and methods of use thereof
08/01/2002CA2431591A1 Composition for chemical mechanical planarization of copper, tantalum and tantalum nitride
08/01/2002CA2429983A1 Resistive heaters and uses thereof
07/2002
07/31/2002EP1227709A2 Process for manufacturing conductive track structures
07/31/2002EP1227590A1 Method and apparatus for generating a supply voltage necessary for the operation of an electronic switch
07/31/2002EP1227578A2 RF amplifier
07/31/2002EP1227524A2 Solar cell and method of manufacturing same
07/31/2002EP1227523A2 High-Voltage transistor with buried conduction layer and method of making the same
07/31/2002EP1227521A2 A method to form a transistor with multiple threshold voltages using a combination of different work function gate materials
07/31/2002EP1227519A2 Semiconductor integrated circuit device including nonvolatile semiconductor memory devices
07/31/2002EP1227518A2 Method of manufacturing semiconductor integrated circuit device including nonvolatile semiconductor memory devices
07/31/2002EP1227517A2 Semiconductor device
07/31/2002EP1227516A2 Thin film semiconductor device, production process and production apparatus
07/31/2002EP1227515A2 Buried type capacitor for integrated circuits
07/31/2002EP1227514A2 Method for forming a gate dielectric with high-K and low-K regions
07/31/2002EP1227513A2 Method for forming variable-K gate dielectric
07/31/2002EP1227502A1 Connection pad arrangements for electronic circuit comprising both functional logic and flash-EEPROM
07/31/2002EP1227501A2 Programming and erasing methods for an NROM array
07/31/2002EP1227498A2 An EEPROM array and method for operation thereof
07/31/2002EP1227495A2 Information storage device
07/31/2002EP1227494A2 Magnetic random access memory