Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2002
08/29/2002US20020117671 Method Of Manufacturing Thin Film Transistor
08/29/2002US20020117666 Method of forming thin film transistors on predominantly <100> polycrystalline silicon films
08/29/2002US20020117665 Bipolar transistor
08/29/2002US20020117664 Growth of compound semiconductor structures on patterned oxide films and process for fabricating same
08/29/2002US20020117661 Silicon-based film and photovoltaic element
08/29/2002US20020117657 Heterojunction bipolar transistor (HBT) having an improved emitter-base junction
08/29/2002US20020117647 Vapor deposition approach from metalorganic precursors, such as metal ( beta -diketonates)
08/29/2002US20020117635 Patterned wafer inspection method and apparatus therefor
08/29/2002US20020117630 Laser illumination apparatus
08/29/2002US20020117619 Inspecting system using electron beam and inspecting method using same
08/29/2002US20020117617 Direct detection of low-energy charged particles using metal oxide semiconductor circuitry
08/29/2002US20020117535 Rework and underfill nozzle for electronic components
08/29/2002US20020117473 Capable of becoming rare earth hydroxide in reaction with water vapor; noncracking, nonswelling, nonchipping; disk drives
08/29/2002US20020117472 Cleaning of multicompositional etchant residues
08/29/2002US20020117471 Method of plasma heating and etching a substrate
08/29/2002US20020117470 Method for controlling the sheet resistance of thin film resistors
08/29/2002US20020117399 Barrier composed of highly resistive materials include metal oxides, and tantalum nitride, coated onto the sidewalls and bottom of via hole intented for copper metallization
08/29/2002US20020117383 Tray accommodation unit
08/29/2002US20020117330 Resilient contact structures formed and then attached to a substrate
08/29/2002US20020117267 Electric component compression bonding machine and method
08/29/2002US20020117231 Device and method for shaping terminal leads
08/29/2002US20020117202 System and method of operation of a digital mass flow controller
08/29/2002US20020117192 Vertical batch type wafer cleaning apparatus
08/29/2002US20020117188 Wafer presence sensor for detecting quartz wafers
08/29/2002US20020117113 Substrate processing apparatus
08/29/2002US20020117112 Vacuum processing apparatus
08/29/2002US20020117105 Method of heat-treating fluoride crystal, method of producing optical part, and optical apparatus
08/29/2002US20020117104 Nitride-based semiconductor element and method of forming nitride-based semiconductor
08/29/2002US20020117103 Method of growing a semiconductor multi-layer structure
08/29/2002US20020117082 Process for forming a low dielectric constant fluorine and carbon-containing silicon oxide dielectric material characterized by improved resistance to oxidation
08/29/2002US20020116882 Semiconductor substrate processing tool and fabrications facilities intergration plate
08/29/2002US20020116836 Method and apparatus for heating and cooling substrates
08/29/2002DE10206140A1 Verfahren zum Ausbilden einer Vertiefung in einem Halbleitersubstrat A method of forming a recess in a semiconductor substrate
08/29/2002DE10205559A1 Verflochtene Verbindungen für integrierte Schaltungen Intertwined connections for integrated circuits
08/29/2002DE10203354A1 Verfahren zum Bilden eines Verbindungsmusters in einer Halbleitervorrichtung A method for forming an interconnection pattern in a semiconductor device
08/29/2002DE10164283A1 Magnetspeichervorrichtung und Magnetsubstrat A magnetic memory device and magnet substrate
08/29/2002DE10160093A1 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation
08/29/2002DE10135782A1 Halbleiterspeichervorrichtung A semiconductor memory device
08/29/2002DE10132133A1 Statische Halbleiterspeichervorrichtung mit T-Typ-Bitleitungsstruktur Static semiconductor memory device with T-type bit line
08/29/2002DE10120029A1 Presskontaktierung von Mikrochips Press contact of microchips
08/29/2002DE10113187C1 Verfahren zur Herstellung eines Grabenkondensators einer Speicherzelle eines Halbleiterspeichers A process for the preparation of a grave capacitor of a memory cell of a semiconductor memory
08/29/2002DE10108369A1 Verfahren und Vorrichtung zum Ablösen eines Halbleiterwafers von einem Träger Method and apparatus for peeling a semiconductor wafer from a carrier
08/29/2002DE10103456C1 Vorrichtung mit mindestens einem Halbleiterbauteil und einer Leiterplatte und Verfahren zur Herstellung einer elektromechanischen Verbindung zwischen beiden A device with at least one semiconductor device and a circuit board and method for producing an electro-mechanical connection between the two
08/28/2002EP1235351A1 Programmable logic device and programming method
08/28/2002EP1235350A2 Semiconductor switching device
08/28/2002EP1235314A2 Method and apparatus for optimizing the output beam characteristics of a laser
08/28/2002EP1235282A2 Method for fabricating a nitride film
08/28/2002EP1235279A2 Semiconductor device using nitride compound and method for fabricating the same
08/28/2002EP1235278A2 Heterojunction bipolar transistor (HBT) having an improved emitter-base junction
08/28/2002EP1235276A1 Semiconductor device and process for fabrication thereof
08/28/2002EP1235274A1 Temperature monitoring device for microprocessor cooling devices
08/28/2002EP1235272A2 Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device
08/28/2002EP1235271A2 Native field effect transistor and method of manufacturing same
08/28/2002EP1235270A2 Process of evaluating manufacturing and/or process deficiencies, method of evaluating apparatus tendencies, as well as associated components
08/28/2002EP1235269A2 Wafer testing and marking process for semiconductor components with fusing structures
08/28/2002EP1235268A1 Methods of inspecting and manufacturing silicon wafer, method of manufacturing semiconductor device, and silicon wafer
08/28/2002EP1235267A1 Two-metal tab tape, double-sided csp tape, bga tape, and method for manufacturing the same
08/28/2002EP1235266A1 Chip bonding device
08/28/2002EP1235265A1 Method for etching a hardmask layer and a metal layer
08/28/2002EP1235264A2 Direct etch for thin film resistor using a hard mask
08/28/2002EP1235263A2 Gas switching during an etch process to modulate the characteristics of the etch
08/28/2002EP1235262A1 Heat treatment device
08/28/2002EP1235260A2 Method for manufacturing polycristalline semiconductor layers and thin-film transistors, and laser annealing apparatus
08/28/2002EP1235259A2 Method of heat treating a semiconductor film by laser irradiation
08/28/2002EP1235258A1 Method for cleaning substrate and method for manufacturing semiconductor device
08/28/2002EP1235257A1 Semiconductor-manufacturing apparatus
08/28/2002EP1235256A2 A method of growing a semiconductor multi-layer structure
08/28/2002EP1235227A2 Programmable sub-surface aggregating metallization structure
08/28/2002EP1235226A2 Nonvolatile memory
08/28/2002EP1235164A2 Method and apparatus for scalable interconnect solution
08/28/2002EP1235115A2 Stage device and movement guidance method
08/28/2002EP1235113A2 Illumination system with reduced energy load
08/28/2002EP1235112A2 Objective subsystem for illumination system
08/28/2002EP1235110A2 Optical beam guide system and method of preventing contamination of optical components thereof
08/28/2002EP1235109A1 Method for exposing at least one or at least two semiconductor wafers
08/28/2002EP1235108A1 Antireflective coating material and semiconductor product with an ARC layer
08/28/2002EP1235103A2 An optical proximity correction method utilizing gray bars as sub-resolution assist features
08/28/2002EP1235092A2 Projection optical system, projection apparatus and projection exposure method
08/28/2002EP1235091A2 Projection optical system and exposure apparatus with the same
08/28/2002EP1234800A1 Aqueous dispersion, process for its production and use thereof
08/28/2002EP1234342A1 Method and apparatus for self-doping contacts to a semiconductor
08/28/2002EP1234340A1 Formation of contacts on thin films
08/28/2002EP1234337A2 Semiconductor circuit arrangement and a method for producing same
08/28/2002EP1234336A1 Radiation resistant integrated circuit design
08/28/2002EP1234335A1 Method of manufacturing a semiconductor device using a halo implantation
08/28/2002EP1234332A2 Dram cell structure with tunnel barrier
08/28/2002EP1234330A2 Method relating to anodic bonding
08/28/2002EP1234329A1 Method for producing a bipolar transistor and method for producing an integrated circuit arrangement with such a bipolar transistor
08/28/2002EP1234328A2 Method for rapid thermal processing of substrates
08/28/2002EP1234327A1 Reactor for processing a semiconductor wafer
08/28/2002EP1234325A1 Process for fabricating a uniform gate oxide of a vertical transistor
08/28/2002EP1234324A1 High temperature oxide deposition for eeprom devices
08/28/2002EP1234323A2 Monitoring system for a conveying device that conveys flat articles, especially wafers
08/28/2002EP1234322A2 Method and apparatus for supercritical processing of multiple workpieces
08/28/2002EP1234314A1 Inductor on integrated circuit and methods for manufacture
08/28/2002EP1234216A1 Method and apparatus for aligning a crystalline substrate
08/28/2002EP1234171A2 Defect knowledge library
08/28/2002EP1234133A1 Compact gate valve
08/28/2002EP1234063A2 Chemical fluid deposition for the formation of metal and metal alloy films on patterned and unpatterned substrates
08/28/2002EP1234010A2 Use of cesium hydroxide in a dielectric cmp slurry