Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2002
09/24/2002US6454909 Method and apparatus for forming a film on an object to be processed
09/24/2002US6454908 Vacuum treatment system
09/24/2002US6454899 Apparatus for filling trenches
09/24/2002US6454898 Inductively coupled RF Plasma reactor having an overhead solenoidal antenna and modular confinement magnet liners
09/24/2002US6454869 Liquid or supercritical carbon dioxide
09/24/2002US6454866 Wafer support system
09/24/2002US6454865 Low mass wafer support system
09/24/2002US6454864 Two-piece chuck
09/24/2002US6454863 Compact process chamber for improved process uniformity
09/24/2002US6454855 Method for producing coated workpieces, uses and installation for the method
09/24/2002US6454854 Semiconductor wafer and production method therefor
09/24/2002US6454852 High efficiency silicon wafer optimized for advanced semiconductor devices
09/24/2002US6454819 Polymer particles having a siloxane bond-coupling section and a metal compound section on said polymer particles; metalloxane bond-containing section, alumina, ceria, or zirconia particle; strength, heat resistance
09/24/2002US6454641 Hydrostatic fluid bearing support with adjustable inlet heights
09/24/2002US6454637 Edge instability suppressing device and system
09/24/2002US6454635 Method and apparatus for a wafer carrier having an insert
09/24/2002US6454563 Wafer treatment chamber having thermal reflector
09/24/2002US6454519 Dual cassette load lock
09/24/2002US6454517 Wafer carrier device
09/24/2002US6454516 Semiconductor substrate aligner apparatus and method
09/24/2002US6454515 Semiconductor wafer accommodating jig, handling method and production system
09/24/2002US6454514 Microelectronic workpiece support and apparatus using the support
09/24/2002US6454512 Person-guided vehicle
09/24/2002US6454508 Dual cassette load lock
09/24/2002US6454472 Semiconductor manufacturing apparatus for photolithographic process
09/24/2002US6454367 Apparatus for processing workpieces
09/24/2002US6454332 Apparatus and methods for handling a substrate
09/24/2002US6454327 Wafer blade equipped with edge bumper
09/24/2002US6454160 Method for hermetically encapsulating microsystems in situ
09/24/2002US6454159 Method for forming electrical connecting structure
09/24/2002US6454158 Wire bonding apparatus and wire bonding method of semiconductor device
09/24/2002US6454153 Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies
09/24/2002US6454100 Semiconductor element carrying equipment
09/24/2002US6453916 Low angle solvent dispense nozzle design for front-side edge bead removal in photolithography resist process
09/24/2002US6453915 Reactive gas mixture of fluoride-containing compound and hydrogen gas; ammonium-based solvent; third cleaning operation using a solution of ozone in deionized water; fluorocompound can be carbon tetrafluoride and trifluoromethane
09/24/2002US6453914 Acid blend for removing etch residue
09/24/2002US6453742 System and method for calibrating semiconductor processing equipment
09/24/2002US6453574 Method for aligning a cassette pod to an overhead hoist transport system
09/24/2002US6453553 Method for making an anisotropic conductive coating with conductive inserts
09/24/2002US6453550 Method for forming modular sockets using flexible interconnects and resulting structures
09/24/2002US6453543 Transport and transfer device
09/24/2002US6453537 Cooling method for electronic components
09/24/2002US6453496 Apparatus for removing contaminant particles on a photomask
09/23/2002CA2359608A1 Electroplating methods for fabricating microelectronic interconnects and microelectronic structures fabricated thereby
09/19/2002WO2002074029A1 Multilayer printed wiring board
09/19/2002WO2002074027A1 Improved laser metallisation circuit formation and circuits formed thereby
09/19/2002WO2002073712A1 Pattering method
09/19/2002WO2002073706A1 Display apparatus and its manufacturing method
09/19/2002WO2002073702A1 Integrated toroidal coil inductors for ic devices
09/19/2002WO2002073700A1 Gate and cmos structure and mos structure
09/19/2002WO2002073699A2 Nanofabrication
09/19/2002WO2002073698A2 A 2f2 memory device system and method
09/19/2002WO2002073697A1 Semiconductor integrated circuit device and process for producing the same
09/19/2002WO2002073696A1 Process for producing semiconductor integrated circuit device
09/19/2002WO2002073695A2 Thyristor configuration and surge suppressor comprising a thyristor configuration of this type
09/19/2002WO2002073694A2 Memory cell comprising a trench and method for production thereof
09/19/2002WO2002073693A1 Semiconductor device
09/19/2002WO2002073692A2 Apparatus and method for electrical isolation
09/19/2002WO2002073691A1 In-situ cap and method of fabricating same for an integrated circuit device
09/19/2002WO2002073689A2 Integrated barrier layer structure for copper contact level metallization
09/19/2002WO2002073688A2 Lithography method for forming semiconductor devices on a wafer and apparatus
09/19/2002WO2002073687A2 Method of removing oxide from copper bond pads
09/19/2002WO2002073686A1 Method of manufacturing semiconductor device
09/19/2002WO2002073685A2 Multi-layer circuit assembly and process for preparing the same
09/19/2002WO2002073684A1 Method for structuring a flat substrate consisting of a glass-type material
09/19/2002WO2002073683A1 Components with nested leads
09/19/2002WO2002073682A1 Method for etching a hardmask layer and a metal layer
09/19/2002WO2002073681A1 Method and composition for polishing by cmp
09/19/2002WO2002073680A2 Method of making layered superlattice material with ultra-thin top layer
09/19/2002WO2002073679A1 Vapor growth method for metal oxide dielectric film and pzt film
09/19/2002WO2002073678A1 Method for oxidation of a silicon substrate
09/19/2002WO2002073677A1 Method and evaporating solution for rinsing a developed photoresist layer
09/19/2002WO2002073676A1 Plasma treatment device
09/19/2002WO2002073675A1 Cleaning method for substrate treatment device and substrate treatment device
09/19/2002WO2002073674A1 Method for etching organic insulating film and dual damasene process
09/19/2002WO2002073672A1 Substrate treating device
09/19/2002WO2002073669A2 Method of making layered superlattice material with improved microstructure
09/19/2002WO2002073668A2 Method of deep trench formation with improved profile control and surface area
09/19/2002WO2002073667A2 Formation of a frontside contact on silicon-on-insulator substrate
09/19/2002WO2002073666A1 Atmospheric pressure plasma etching reactor
09/19/2002WO2002073665A2 Workpiece distribution and processing in a high throughput stacked frame
09/19/2002WO2002073664A1 Automatic continue wafer processing system and method for using the same
09/19/2002WO2002073663A1 Arrangement and method for the rear-faced contacting of a semiconductor substrate
09/19/2002WO2002073661A2 Extraction method of defect density and size distributions
09/19/2002WO2002073660A2 System and method to control radial delta temperature
09/19/2002WO2002073657A2 Semiconductor memory location comprising a trench capacitor and method for the production thereof
09/19/2002WO2002073654A1 Plasma chamber support having dual electrodes
09/19/2002WO2002073653A1 Focused ion beam system and machining method using it
09/19/2002WO2002073651A1 Thermal regulation of an ion implantation system
09/19/2002WO2002073620A2 Reference for mram cell
09/19/2002WO2002073474A1 Method and apparatus for design validation of complex ic without using logic simulation
09/19/2002WO2002073329A2 Valve control system for atomic layer deposition chamber
09/19/2002WO2002073318A2 Method and device for vibration control
09/19/2002WO2002073313A1 Structured organic materials and devices using low-energy particle beams
09/19/2002WO2002073312A1 Alternating phase shift masking for multiple levels of masking resolution
09/19/2002WO2002073309A2 Packaged radiation sensitive coated workpiece process for making and method of storing same
09/19/2002WO2002073308A1 High resolution resists for next generation lithographies
09/19/2002WO2002073307A2 Thermally cured underlayer for lithographic application
09/19/2002WO2002073249A1 Diffraction lens element and lighting system using the lens element
09/19/2002WO2002073122A2 Cyclic error reduction in average interferometric position measurements