Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2002
09/12/2002US20020127847 Electrochemical co-deposition of metals for electronic device manufacture
09/12/2002US20020127846 Copper to aluminum interlayer interconnect using stud and via liner
09/12/2002US20020127845 Conductive structures in integrated circuits
09/12/2002US20020127844 Multilevel interconnect structure containing air gaps and method for making
09/12/2002US20020127843 Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit device
09/12/2002US20020127842 Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit device
09/12/2002US20020127841 Method of manufacturing semiconductor device
09/12/2002US20020127840 Method for photoresist strip, sidewall polymer removal and passivation for aluminum metallization
09/12/2002US20020127839 Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrument
09/12/2002US20020127837 Methods for forming a die package
09/12/2002US20020127836 decreasing the drift velocity
09/12/2002US20020127834 Assorted aluminum wiring design to enhance chip-level performance for deep sub-micron application
09/12/2002US20020127833 Method for fabricating metal interconnections
09/12/2002US20020127832 Manufacturing method of semiconductor device
09/12/2002US20020127831 Semiconductor component and method of manufacturing
09/12/2002US20020127830 Heating treatment device, heating treatment method and fabrication method of semiconductor device
09/12/2002US20020127829 Solution processing apparatus and solution processing method
09/12/2002US20020127828 Method of processing wafer
09/12/2002US20020127827 Method of manufacturing a semiconductor device
09/12/2002US20020127826 Method and a system for sealing an epitaxial silicon layer on a substrate
09/12/2002US20020127825 Method of preparing copper metallization die for wirebonding
09/12/2002US20020127824 Semiconductor wafer protection and cleaning for device separation using laser ablation
09/12/2002US20020127823 Reduced substrate capacitance high performance SOI process
09/12/2002US20020127822 Semiconductor device and method of manufacturing the same
09/12/2002US20020127821 Process for the production of thinned wafer
09/12/2002US20020127820 Semiconductor substrate and method for producing the same
09/12/2002US20020127819 Semiconductor device and fabrication process therefor
09/12/2002US20020127818 Recess-free trench isolation structure and method of forming the same
09/12/2002US20020127817 Semiconductor device having trench isolation layer and a method of forming the same
09/12/2002US20020127816 Dual silicon-on-insulator device wafer die
09/12/2002US20020127814 Semiconductor device and manufacturing method thereof
09/12/2002US20020127813 Method for using thin spacers and oxidation in gate oxides
09/12/2002US20020127812 Probe pin for testing electrical characteristics of apparatus, probe card using probe pins
09/12/2002US20020127811 Trench DRAM cell with vertical device and buried word lines
09/12/2002US20020127810 Semiconductor device and method for fabricating the same
09/12/2002US20020127809 Method of fabricating a semiconductor device
09/12/2002US20020127808 Method for forming self-aligned channel implants using a gate poly reverse mask
09/12/2002US20020127807 Semiconductor device, semiconductor wafer, and methods of producing the same device and wafer
09/12/2002US20020127806 Method of forming multiple gate oxide layers with different thicknesses in one ion implantation process
09/12/2002US20020127805 Method of manufacturing semiconductor integrated circuit device including nonvolatile semiconductor memory devices
09/12/2002US20020127804 Method of making non-volatile memory with sharp corner
09/12/2002US20020127803 Method for producing a memory cell for a semiconductor memory
09/12/2002US20020127802 Nonvolatile semiconductor memory device and method for manufacturing the same
09/12/2002US20020127801 Nonvolatile ferroelectric memory and method for fabricating the same
09/12/2002US20020127800 Flash memory cell process using a hardmask
09/12/2002US20020127799 High voltage oxidation method for highly reliable flash memory devices
09/12/2002US20020127798 2F2 memory device system and method
09/12/2002US20020127797 Multiple oxide thicknesses for merged memory and logic applications
09/12/2002US20020127796 Method for producing a cell of a semiconductor memory
09/12/2002US20020127795 Semiconductor device having trench capacitor and method for manufacturing the same
09/12/2002US20020127794 Semiconductor memory device and manufacturing method thereof
09/12/2002US20020127793 Semiconductor integrated circuit device having switching misfet and capacitor element and method of producing the same, including wiring therefor and method of producing such wiring
09/12/2002US20020127792 Optimum surface orientation of the silicon substrate and optimum orientation for epitaxial growth when the layer of a group III nitride compound semiconductor is formed on the silicon substrate by using epitaxial growth.
09/12/2002US20020127791 Semiconductor device and its manufacture method
09/12/2002US20020127790 Electroless plating apparatus and method
09/12/2002US20020127789 For producing semiconductor device
09/12/2002US20020127788 Method of manufacturing semiconductor device and semiconductor device
09/12/2002US20020127787 Single supply hfet with temperature compensation
09/12/2002US20020127786 Method of forming cross strapped VSS layout for full CMOS SRAM cell and device produced thereby
09/12/2002US20020127785 Method of manufacturing a semiconductor device
09/12/2002US20020127784 Method of manufacturing SOI element having body contact
09/12/2002US20020127783 Method for manufacturing a semiconductor device
09/12/2002US20020127781 Method for forming conductors in semiconductor devices
09/12/2002US20020127780 Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby
09/12/2002US20020127777 Semiconductor device and manufacturing method thereof
09/12/2002US20020127776 Semiconductor device having an organic material layer and method for making the same
09/12/2002US20020127774 Flip-chip semiconductor package structure and process for fabricating the same
09/12/2002US20020127773 Production of semiconductor device
09/12/2002US20020127772 Bumpless flip chip assembly with solder via
09/12/2002US20020127770 Die support structure
09/12/2002US20020127769 Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby
09/12/2002US20020127766 Semiconductor wafer manufacturing process
09/12/2002US20020127764 Thin-film solar cells and method of making
09/12/2002US20020127763 Sidewall spacers and methods of making same
09/12/2002US20020127762 Method for manufacturing solid state image pick-up device
09/12/2002US20020127761 Process for manufacturing components in a semiconductor material wafer with reduction in the starting wafer thickness
09/12/2002US20020127757 Semiconductors
09/12/2002US20020127756 For producing assembly such as nanostructured units selected from the group comprising nanoparticles, like metal, semiconductor, or core/shell semiconductor nanoparticles, nanowires, nanotubes, nanobelts, and electrodes
09/12/2002US20020127753 Method of manufacturing organic EL display
09/12/2002US20020127752 Providing a quantum well structure comprising an Indium Gallium Arsenide Phosphide (InGaAsP); providing Indium Phosphide layers with vacancy type defects; Rapid Thermal Annealing (RTA) controlled diffusion
09/12/2002US20020127749 Characteristic evaluation apparatus for insulated gate type transistors
09/12/2002US20020127746 Gallium phosphide single-crystalline substrate at least one each of n-type gallium phosphide layer and p-type gallium phosphide layer
09/12/2002US20020127745 By irradiating the test liquid with ultraviolet radiation and measuring the change in conductivity due to the produced organic acids and carbon dioxide
09/12/2002US20020127743 Method for fabricating cladding layer in top conductor
09/12/2002US20020127509 Heat treatment equipment for object to be treated and its exhausting method
09/12/2002US20020127508 Emissivity-change-free pumping plate kit in a single wafer chamber
09/12/2002US20020127501 Covering surface of wafer with patterned mask; and transferring mask pattern to wafer surface at particular magnification factor, wherein transferring mask pattern comprises exposing portions of wafer surface while moving
09/12/2002US20020127500 Photoresist stripper composition and method for stripping photoresist using the same
09/12/2002US20020127499 For forming resist pattern, fineness, semiconductors
09/12/2002US20020127496 Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates
09/12/2002US20020127494 Providing perforate metal core; applying a dielectric polymer onto all exposed surfaces; applying a dielectric polymer; ablating surface of dielectric polymer in a pattern to expose; forming metallized vias; applying photosensitive layer
09/12/2002US20020127493 Providing a substrate; forming a first metal layer on the substrate; forming a photo-resist; exposing and developing the photo-resist using an exposure system and only a single mask such that the photo-resist has a pattern having comb shape
09/12/2002US20020127490 Radiation sensitive bilayer resists which are used in manufacture of integrated circuits
09/12/2002US20020127486 Suitable for a pattern formation on a semiconductor wafer
09/12/2002US20020127485 Exposing a photoresist film formed on a peripheral area of a wafer by radiating light; inspecting whether light is uniformly radiated onto a predetermined width of peripheral area of wafer; adjusting position of light to be radiated
09/12/2002US20020127483 For use in semiconductor device
09/12/2002US20020127482 Coating lithography resist onto wafer; exposing wafer to irradiation through a reticle in an exposure tool, stabilizing lithography resist; developing lithography resist in predetermined; stabilizing; metrology inspection
09/12/2002US20020127418 Embedding resin and wiring substrate using the same
09/12/2002US20020127416 For forming dielectric film
09/12/2002US20020127406 Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof