Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2002
09/19/2002US20020130676 Integrated compliant probe for wafer level test and burn-in
09/19/2002US20020130614 Display device
09/19/2002US20020130524 Contactless handling of objects
09/19/2002US20020130426 Semiconductor device, memory system, and electronic instrument
09/19/2002US20020130425 Mask-making member and its production method, mask and its making method, exposure process, and fabrication method of semiconductor device
09/19/2002US20020130424 Semiconductor integrated circuit
09/19/2002US20020130423 Semiconductor device and manufacturing method thereof
09/19/2002US20020130422 Semiconductor/printed circuit board assembly, and computer system
09/19/2002US20020130421 Semiconductor device
09/19/2002US20020130420 Semiconductor devices having gradual slope contacts
09/19/2002US20020130419 Barrier-metal-free copper damascene technology using atomic hydrogen enhanced reflow
09/19/2002US20020130418 Stable halogen containing dielectric layer with less halogen outgassing and diffusion
09/19/2002US20020130417 Dual damascene structure for the wiring-line structures of multi-level interconnects in integrated circuit
09/19/2002US20020130416 Integrated circuits with multiple low dielectric-constant inter-metal dielectrics
09/19/2002US20020130415 Semiconductor device and manufacturing method thereof
09/19/2002US20020130414 Semiconductor device and method of manufacturing the same
09/19/2002US20020130412 Semiconductor device and method of manufacture thereof
09/19/2002US20020130411 Bga substrate via structure
09/19/2002US20020130409 Semiconductor device and drive circuit using the semiconductor devices
09/19/2002US20020130406 Components and methods with nested leads
09/19/2002US20020130404 Semiconductor module in which plural semiconductor chips are enclosed in one package
09/19/2002US20020130402 Electronic device and method of manufacture the same
09/19/2002US20020130401 Underfill applications using film technology
09/19/2002US20020130400 Semiconductor package with lead frame
09/19/2002US20020130399 Method for manufacturing a dual chip package
09/19/2002US20020130397 Direct attachment semiconductor chip to organic substrate
09/19/2002US20020130396 Nitrogen-containing polymers as porogens in the preparation of highly porous, low dielectric constant materials
09/19/2002US20020130395 Integrated circuit contact
09/19/2002US20020130394 Semiconductor device and manufacturing method thereof
09/19/2002US20020130393 Semiconductor device and method of fabricating the same
09/19/2002US20020130392 Internally ballasted silicon germanium transistor
09/19/2002US20020130391 Method for manufacturing a package structure of integrated circuits
09/19/2002US20020130389 Compound semiconductor device and method of manufacturing the same
09/19/2002US20020130388 Damascene capacitor having a recessed plate
09/19/2002US20020130387 Semiconductor device comprising windings constituting inductors
09/19/2002US20020130386 Integrated coil inductors for IC devices
09/19/2002US20020130385 Method of manufacturing insulating layer and semiconductor device including insulating layer, and semiconductor device formed thereby
09/19/2002US20020130384 Deep trench isolation for reducing soft errors in integrated circuits
09/19/2002US20020130383 Semiconductor device having wiring patterns with insulating layer
09/19/2002US20020130382 Element isolating method in semiconductor integrated circuit device, semiconductor integrated circuit device and manufacturing method thereof
09/19/2002US20020130380 Simplified upper electrode contact structure for PIN diode active pixel sensor
09/19/2002US20020130378 Technique to mitigate short channel effects with vertical gate transistor with different gate materials
09/19/2002US20020130377 Method for improved plasma nitridation of ultra thin gate dielectrics
09/19/2002US20020130376 Method to reduce transistor channel length using SDOX
09/19/2002US20020130375 Damascene structure and method of making
09/19/2002US20020130374 Semiconductor device and method of manufacturing the same
09/19/2002US20020130373 Semiconductor device and manufacturing method thereof
09/19/2002US20020130372 Semiconductor device having silicide thin film and method of forming the same
09/19/2002US20020130370 Bipolar/bicmos semiconductor device
09/19/2002US20020130369 Semiconductor integrated circuit device with reduced cross-talk and method for fabricating same
09/19/2002US20020130368 Method for protecting MOS components form antenna effect and the apparatus thereof
09/19/2002US20020130367 Semiconductor device incorporating elements formed of refractory metal-silicon-nitrogen and method for fabrication
09/19/2002US20020130366 ESD protection circuit for a semiconductor integrated circuit
09/19/2002US20020130365 Novel UMOS-like gate-controlled thyristor structure for ESD protection
09/19/2002US20020130363 Semiconductor device and fabrication method thereof
09/19/2002US20020130362 High voltage semiconductor device having high breakdown voltage and method of fabricating the same
09/19/2002US20020130359 Semiconductor device and method of manufacturing the same
09/19/2002US20020130358 Semiconductor devices
09/19/2002US20020130357 Self-aligned floating gate flash cell system and method
09/19/2002US20020130356 Novel split gate flash cell for multiple storage
09/19/2002US20020130355 Semiconductor device and method of manufacturing the same
09/19/2002US20020130354 Double-gate field-effect transistor, integrated circuit using the transistor and method of manufacturing the same
09/19/2002US20020130352 Semiconductor device comprising an EEPROM memory and a FLASH-EPROM memory, and method of manufacturing such a semiconductor device
09/19/2002US20020130350 Flash memory device and a method for fabricating the same
09/19/2002US20020130348 6F2 dram array, a dram array formed on a semiconductive substrate, a method of forming memory cells in a 6F2 dram array and a method of isolating a single row of memory cells in a 6F2 dram array
09/19/2002US20020130347 Formation of a frontside contact on silicon-on-insulator substrate
09/19/2002US20020130346 Structure and process for buried bitline and single sided buried conductor formation
09/19/2002US20020130345 Semiconductor device and method of manufcaturing the same
09/19/2002US20020130344 Semiconductor device
09/19/2002US20020130343 Semiconductor device which increases the capacity without deepening the contact hole
09/19/2002US20020130342 Semiconductor integrated circuit device and method of manufacturing the same
09/19/2002US20020130340 Method of forming a multilayer dielectric stack
09/19/2002US20020130339 Magnetoresistance effect device, method of manufacturing the same, magnetic memory apparatus, personal digital assistance, and magnetic reproducing head, and magnetic information reproducing apparatus
09/19/2002US20020130338 Structures, methods, and systems for ferroelectric memory transistors
09/19/2002US20020130337 Ferroelectric, memory device and their manufacturing methods
09/19/2002US20020130336 Method and apparatus for a monolithic integrated mesfet and p-i-n optical receiver
09/19/2002US20020130335 Semiconductor device for detecting neutron, and method for the fabrication
09/19/2002US20020130333 Transistor
09/19/2002US20020130330 High voltage semiconductor device using sipos and methods for fabricating the same
09/19/2002US20020130325 Method of achieving higher inversion layer mobility in novel silicon carbide semiconductor devices
09/19/2002US20020130324 Thin film transistor array panel for a liquid crystal display and methods for manufacturing the same
09/19/2002US20020130323 Semiconductor device and method of manufacturing the same
09/19/2002US20020130322 Semiconductor device having a thin film transistor
09/19/2002US20020130314 Non-volatile memory device having a metal-oxide-nitride-oxide-semiconductor gate structure and fabrication method thereof
09/19/2002US20020130312 Column-row addressable electric microswitch arrays and sensor matrices employing them
09/19/2002US20020130311 Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices
09/19/2002US20020130302 Capable of firmly adhering to an electronic component and a circuit board and achieving good electrical continuity by thermal compression bonding at low temperature at which the circuit board is not eteriorated
09/19/2002US20020130298 For removing a photoresist; for removing a residue of a semiconductor element generated in semiconductor treatment
09/19/2002US20020130297 Heating an aromatic polyimide to carbonize the polyimide; incorporating into carbonized polyimide one or more hetero atoms other than carbon atom which are selected from the group consisting of boron, aluminum, gallium and indium
09/19/2002US20020130278 Thermal regulation of an ion implantation system
09/19/2002US20020130277 Method and system for determining pressure compensation factors in an ion implanter
09/19/2002US20020130276 Gas cooled electrostatic pin chuck for vacuum applications
09/19/2002US20020130271 Ion implantation method and ion implantation equipment
09/19/2002US20020130250 Method for detecting a wafer
09/19/2002US20020130164 Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing system
09/19/2002US20020130161 Method of attaching a body made of metal matrix composite (MMC) material or copper to a ceramic member
09/19/2002US20020130158 Detection of wire bonding failures
09/19/2002US20020130114 Laser wire bonding for wire embedded dielectrics to integrated circuits
09/19/2002US20020130107 Etching method and etching apparatus of carbon thin film
09/19/2002US20020130106 Method and apparatus for removing a liquid from a surface of a rotating substrate