Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2002
10/22/2002US6468135 Method and apparatus for multiphase chemical mechanical polishing
10/22/2002US6468099 Semiconductor device fabricating method
10/22/2002US6468098 Electrical contactor especially wafer level contactor using fluid pressure
10/22/2002US6468022 Edge-gripping pre-aligner
10/22/2002US6468021 Integrated intra-bay transfer, storage, and delivery system
10/22/2002US6468018 Article transfer apparatuses
10/22/2002US6468017 Vehicle, system and method for loading and unloading
10/22/2002US6467976 Impurities at a molecular level, such as oxygen, basic substances, ozone, and organic substances, can be prevented from adhering to a substrate; for use in photolithography
10/22/2002US6467960 Air bearing linear guide for use in a vacuum
10/22/2002US6467827 IC wafer handling apparatus incorporating edge-gripping and pressure or vacuum driven end-effectors
10/22/2002US6467824 Floating seal pick and place system and unit therefor
10/22/2002US6467679 Wire bonding method
10/22/2002US6467678 Wire bonding method and apparatus
10/22/2002US6467677 Method and contact point for producing an electrical connection
10/22/2002US6467676 A hydroxyl-containing fluxing precursor compound is added to the encapsulant composition to react with the anhydride curing agent to produce an active fluxing agent under typical reflow conditions.
10/22/2002US6467674 Method of manufacturing semiconductor device having sealing film on its surface
10/22/2002US6467673 Bonding apparatus and bonding method
10/22/2002US6467672 Methods for clamping and wire-bonding the leads of a lead frame one set at a time
10/22/2002US6467670 Method and apparatus for mounting component
10/22/2002US6467666 Method of producing a semiconductor device
10/22/2002US6467626 Wafer storing method and storing container therefor and wafer transferring method for transferring wafer to the storing container
10/22/2002US6467491 Processing apparatus and processing method
10/22/2002US6467427 Evaporation source material supplier
10/22/2002US6467297 Wafer holder for rotating and translating wafers
10/22/2002US6467278 Cooling for singulation of composite materials in molded semiconductor packages
10/22/2002US6467189 Method of transferring a material from first apparatus to second apparatus in the clean room and an assembly line
10/22/2002US6467187 Vacuum processing apparatus and operating method therefor
10/22/2002US6467186 Transferring device for a vacuum processing apparatus and operating method therefor
10/22/2002US6467139 Mounting structure and mounting method for surface acoustic wave element
10/22/2002US6467120 Wafer cleaning brush profile modification
10/22/2002CA2222369C Endcap for indirectly heated cathode of ion source
10/17/2002WO2002082598A1 Injection seeded f2 laser with pre-injected filter
10/17/2002WO2002082597A1 Injection seeded laser with precise timing control
10/17/2002WO2002082560A1 Self-aligned contact doping for organic field effect transistors
10/17/2002WO2002082558A2 Method for producing a semiconductor circuit and semiconductor circuits produced according to said method
10/17/2002WO2002082554A1 Semiconductor device and method for manufacture thereof
10/17/2002WO2002082552A1 Semiconductor power component and corresponding production method
10/17/2002WO2002082551A1 A semiconductor structure exhibiting reduced leakage current
10/17/2002WO2002082550A2 Memory cell array and method for the production thereof
10/17/2002WO2002082549A1 Semiconductor integrated circuit device and its manufacturing method
10/17/2002WO2002082540A1 Semiconductor device, method of manufacture thereof, and semiconductor substrate
10/17/2002WO2002082537A1 High frequency integrated circuit (hfic) microsystems assembly and method for fabricating the same
10/17/2002WO2002082534A2 Method and apparatus for incorporating in-situ sensors
10/17/2002WO2002082532A2 Semiconductor test system and associated methods for wafer level acceptance testing
10/17/2002WO2002082530A2 In-situ thickness measurement for use in semiconductor processing
10/17/2002WO2002082529A1 Method for controlling parameter using a process of semiconductor production
10/17/2002WO2002082528A1 Contactor device for semiconductor device and method of testing semiconductor device
10/17/2002WO2002082527A1 Method of forming electrical connections
10/17/2002WO2002082526A1 Semiconductor device and its manufacturing method
10/17/2002WO2002082525A1 Semiconductor device and production method therefor
10/17/2002WO2002082524A1 Heat treating device
10/17/2002WO2002082523A1 Heat treating method and heat treating device
10/17/2002WO2002082522A1 Single wafer processing method and system for processing semiconductor
10/17/2002WO2002082520A1 Method of cutting out leakage of container gas and container with internal gas leakage cutout structure
10/17/2002WO2002082519A2 Method for producing a semiconductor component comprising a t-shaped contact electrode
10/17/2002WO2002082518A1 An apparatus and a method for forming a pattern using a crystal structure of material
10/17/2002WO2002082517A1 Production method for semiconductor substrate and semiconductor element
10/17/2002WO2002082516A1 Gaseous phase growing device
10/17/2002WO2002082515A1 Semiconductor structure and device including a carbon film
10/17/2002WO2002082514A1 A method for semiconductor device fabrication
10/17/2002WO2002082513A1 Semiconductor structures and devices utilizing a stable template
10/17/2002WO2002082512A1 Method for forming exposure pattern and exposure pattern
10/17/2002WO2002082511A2 Pedestal assembly with enhanced thermal conductivity
10/17/2002WO2002082510A1 Single transistor rare earth manganite ferroelectric nonvolatile memory cell
10/17/2002WO2002082508A1 Metallization methods using foils
10/17/2002WO2002082507A1 Wafer handling system and apparatus
10/17/2002WO2002082503A2 Multi-thickness silicide device
10/17/2002WO2002082502A2 Method for selectively transferring at least an element from an initial support onto a final support
10/17/2002WO2002082499A2 Conductive collar surrounding semiconductor workpiece in plasma chamber
10/17/2002WO2002082496A2 Method and system for controlling beam scanning in an ion implantation device
10/17/2002WO2002082492A1 Helium ion generation method and apparatus
10/17/2002WO2002082489A2 Ion source filament
10/17/2002WO2002082456A1 Device and method for using complementary bits in a memory array
10/17/2002WO2002082448A1 Identification of an integrated circuit from its physical manufacture parameters
10/17/2002WO2002082188A2 Substrate alignment
10/17/2002WO2002082184A1 Silicon-containing acetal protected polymers and photoresists compositions thereof
10/17/2002WO2002082182A2 Alleviating line end shortening in transistor endcaps by extending phase shifters
10/17/2002WO2002082100A1 Method for manufacturing a silicon sensor and a silicon sensor
10/17/2002WO2002081983A1 Multi-channel temperature control system for semiconductor processing facilities
10/17/2002WO2002081783A1 Workpiece wet processing
10/17/2002WO2002081782A1 Back-end metallisation process
10/17/2002WO2002081584A1 Polishing composition having organic polymer particles
10/17/2002WO2002081107A1 Nextgen wet process tank
10/17/2002WO2002081106A1 Megazone system
10/17/2002WO2002067266A3 Method for writing into magnetoresistive memory cells and magnetoresistive memory which can be written into according to said method
10/17/2002WO2002065548A3 Integrated circuit arrangement consisting of a flat substrate
10/17/2002WO2002053800A3 Windows used in thermal processing chambers
10/17/2002WO2002052612A3 In-process wafer charge monitor and control system for ion implanter
10/17/2002WO2002052349A3 Process for removal of photoresist after post ion implantation
10/17/2002WO2002051961A3 Composition comprising an oxidizing and complexing compound
10/17/2002WO2002050867A3 Centrifugal type contaminant collector trap for ion implanter
10/17/2002WO2002047118A3 Wafer carrier with stacking adaptor plate
10/17/2002WO2002043103A3 Extraction and deceleration of low energy beam with low beam divergence
10/17/2002WO2002039455A8 Mram arrangement with selection transistors of large channel width
10/17/2002WO2002031867A3 Electronic structure having in-situ resistors
10/17/2002WO2002025722A3 Method and system for determining pressure compensation factors in an ion implanter
10/17/2002WO2002019431A3 Method and device to reduce gate-induced drain leakage (gidl) current in thin gate oxide mosfets
10/17/2002WO2002013240A3 Method for forming aluminum lines over aluminum-filled vias in a semiconductor substrate
10/17/2002WO2002003429A3 Integrated electronic hardware for wafer processing control and diagnostic
10/17/2002WO2001097277A9 Electronic parts packaging method and electronic parts package
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