Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2002
10/17/2002DE10115912A1 Verfahren zur Herstellung einer Halbleiteranordnung und Verwendung einer Ionenstrahlanlage zur Durchführung des Verfahrens A process for producing a semiconductor device and use of an ion beam system for carrying out the method
10/17/2002DE10115801A1 Platform for chemical-mechanical wafer polishing has device with diamond particles in contact with pad to maintain surface roughness, device for cleaning particle residues from pad
10/17/2002DE10115228A1 Double-layered semiconductor film formation for gate/bit line interface of transistor, involves flushing bulk dichloro silane tungsten silicide with silane and dichloro silane tungsten fluoride
10/17/2002DE10114956A1 Semiconductor component used in DRAMs comprises a binary metal oxide dielectric layer arranged on a substrate
10/17/2002DE10114778A1 Verfahren zur Herstellung eines MOSFETs mit sehr kleiner Kanallänge A process for producing a MOSFET having a very small channel length
10/17/2002DE10114767A1 Verfahren zur Realisierung von Verdrahtungsoptionen bei einem integrierten Schaltkreis und integrierter Schaltkreis A process for the realization of wiring options in an integrated circuit and integrated circuit
10/17/2002DE10110458A1 Production of a CMOS inverter comprises preparing a n-doped substrate, masking the surface, forming a p+-doped recess and further processing
10/16/2002WO2002071461A1 Method of manufacturing compound semiconductor wafer
10/16/2002EP1250033A2 Printed circuit board and electronic component
10/16/2002EP1250032A1 Electronic device using Zn-Al-Ge-Mg alloy solder having Al or Cu particles
10/16/2002EP1249906A2 Long wavelength laser diodes on metamorphic buffer modified gallium arsenide wafers
10/16/2002EP1249904A2 Group III nitride compound semiconductor laser and manufacturing method thereof
10/16/2002EP1249872A2 GaN HBT superlattice base structure
10/16/2002EP1249870A2 Semiconductor device
10/16/2002EP1249867A2 A metal barrier for copper interconnects that incorporates silicon in the metal barrier or at the copper/metal barrier interface
10/16/2002EP1249866A2 Use of a sacrificial layer to facilitate metallization
10/16/2002EP1249865A2 Multi-layered barrier metal thin films for Cu interconnect by ALCVD
10/16/2002EP1249864A1 Process and apparatus for reducing the thickness of wafers
10/16/2002EP1249863A1 Semiconductor joining substrate-use tape with adhesive and copper-clad laminate sheet using it
10/16/2002EP1249862A2 Semiconductor device and method for forming the same
10/16/2002EP1249861A2 A multi-step method for metal deposition
10/16/2002EP1249860A2 Method to improve copper thin film adhesion to metal nitride substrates by the addition of water
10/16/2002EP1249859A2 Substrate processing apparatus
10/16/2002EP1249858A2 Heater member for mounting heating object and substrate processing apparatus using the same
10/16/2002EP1249857A1 Semiconductor wafer detecting apparatus and method for detecting a semiconductor wafer in a slot of a wafer carrier
10/16/2002EP1249846A2 Polyalkylene oxide prorgens having hyper-branches and low dielectric-constant insulators using them
10/16/2002EP1249733A2 Exposure method for forming pattern for IC chips on reticle by use of master masks
10/16/2002EP1249522A2 Oxygen doping method for a gallium nitride single crystal substrate and oxygen-doped N-type gallium nitride freestanding single crystal substrate
10/16/2002EP1249517A1 Copper electroplating liquid, pretreatment liquid for copper electroplating and method of copper electroplating
10/16/2002EP1249433A1 Carbon-containing aluminium nitride sintered compact and ceramic substrate for use in equipment for manufacturing or inspecting semiconductor
10/16/2002EP1249318A2 A robot arm mechanism comprising a plurality of handling members
10/16/2002EP1249302A1 Solder alloy, electronic member having solder ball and solder bump
10/16/2002EP1249042A1 Personalized hardware
10/16/2002EP1249041A1 Organic flip chip packages with an array of through hole pins
10/16/2002EP1249040A2 Method and structure for adhering msq material to liner oxide
10/16/2002EP1249039A1 Dielectric formation to seal porosity of etched low dielectric constant materials
10/16/2002EP1249038A1 Maskless process for self-aligned contacts
10/16/2002EP1249037A2 Method to prevent oxygen out-diffusion from basrtio3 containing micro-electronic device
10/16/2002EP1249036A1 Low threading dislocation density relaxed mismatched epilayers without high temperature growth
10/16/2002EP1249035A2 Silicon/germanium bipolar transistor with an optimized germanium profile
10/16/2002EP1249033A1 Electrode assembly
10/16/2002EP1249032A1 Plasma doping system comprising a hollow cathode
10/16/2002EP1249031A1 Electron-optical corrector for eliminating third-order aberrations
10/16/2002EP1249004A1 Method to manufacture a smart label inlet web and a smart label inlet web
10/16/2002EP1248989A2 Behavioral-synthesis electronic design automation tool and business-to-business application service provider
10/16/2002EP1248968A1 Arrangement for temperature monitoring and regulation
10/16/2002EP1248963A1 Mitigation of substrate defects in reticles using multilayer buffer layers
10/16/2002EP1248865A1 Atomic-layer-chemical-vapor-deposition of films that contain silicon dioxide
10/16/2002EP1203513A4 High-speed symmetrical plasma treatment system
10/16/2002EP1092175B1 Microlithography illumination system with depolariser
10/16/2002EP1089851B1 Wafer edge polishing method and apparatus
10/16/2002EP1078372A4 High-efficiency miniature magnetic integrated circuit structures
10/16/2002EP1071834B1 Method of passivating a cvd chamber
10/16/2002EP1001864B1 A carrier head with local pressure control for a chemical mechanical polishing apparatus
10/16/2002EP0981655B1 Chemical vapour deposition precursors
10/16/2002EP0948057B1 Semiconductor device and process for manufacturing the same
10/16/2002EP0928499B1 Method for detecting the transition of different materials when etching semiconductor structures
10/16/2002EP0902436B1 Microcomputer with flash memory programmable via external terminal
10/16/2002EP0823126B1 Bottom electrode structure for dielectric capacitors and method of making the same
10/16/2002EP0729652B1 Method for fabricating a contact structure for interconnections, interposer, semiconductor assembly
10/16/2002EP0719451B1 Filling holes and the like in substrates
10/16/2002EP0646286B1 Fabrication of semiconductor devices on SOI substrates
10/16/2002EP0601068B1 Electrically erasable, directly overwritable, multibit single cell memory elements and arrays fabricated therefrom
10/16/2002CN2517110Y Locating ring for chip polishing
10/16/2002CN2517109Y Locating ring for chip polishing
10/16/2002CN1375114A Easy shrinkable novel non-volatile semiconductor memory cell utilizing split dielectric floating gate and method for making same
10/16/2002CN1375113A Thin-film transistor and method for producing the same
10/16/2002CN1375112A Carrier tray for integrated circuits such as microprocessors
10/16/2002CN1375111A Chemical vapor deposition of siliconoxide films using alkylsiloxane oilgomers with ozone
10/16/2002CN1374993A Electronic tag assembly and method therefor
10/16/2002CN1374890A Method and system for in situ cleaning of semiconductor manufacturing equipment using combination chemistries
10/16/2002CN1374831A Parts fixed head, parts installing apparatus and installing method using with the same fixed head
10/16/2002CN1374830A Electronic component pressure binding machine and pressure binding method
10/16/2002CN1374707A Semi-conductor device and its producing method
10/16/2002CN1374706A Molecular tunnen diode and its manufacture
10/16/2002CN1374705A Thin film transistor substrate and its producing method
10/16/2002CN1374704A High-voltage P-type MOS transistor and its prepn
10/16/2002CN1374703A Semiconductor with insulation grid type double-polar transistor
10/16/2002CN1374700A Nonvolatile semiconductor memory
10/16/2002CN1374699A Semi-conductor device and its producing method
10/16/2002CN1374698A Semi-conductor apparatus and its pattern wiring method
10/16/2002CN1374697A Resin sealing semi-conductor device and its producing method
10/16/2002CN1374696A Lead wire holder
10/16/2002CN1374692A Design method of built-in parallel two-dimensional discrete wavelet conversion VLSI structure
10/16/2002CN1374691A Method for producing top conductor covering
10/16/2002CN1374690A Manufacture of double mosaic wire copper wire inside low layer
10/16/2002CN1374689A Prepn of shallow-channel isolating element with low pressure lining
10/16/2002CN1374688A Pin block structure for fixing plug pin
10/16/2002CN1374687A Manufacture of high electron mobility transistor capable of obtaining grid
10/16/2002CN1374686A Doping ,method for gas source molecular beam epitaxial growth Ge-Si heterojunction bipolar transistor material
10/16/2002CN1374685A Silicide eliminating method for pre-cleaning chamber
10/16/2002CN1374684A Particle preventing method for pre-cleaning chamber
10/16/2002CN1374683A III-V family compound semi-conductor crystal structure and its epitaxial growth method and semi-conductor device
10/16/2002CN1374561A Exposure method and exposure apparatus
10/16/2002CN1374560A Projection optics and exposure device with the same projection optics
10/16/2002CN1374546A Liquid crystal display device
10/16/2002CN1374532A Program executive system for semi-conductor test instrument
10/16/2002CN1374474A Module fluid transportation apparatus
10/16/2002CN1092844C Method for producing semiconductor
10/16/2002CN1092843C 半导体器件封装 The semiconductor device package
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