Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2002
10/10/2002WO2002080264A2 Method and apparatus for controlling feature critical dimensions based on scatterometry derived profile
10/10/2002WO2002080263A2 Flip chip interconnection using no-clean flux
10/10/2002WO2002080261A1 Wafer level insulation underfill for die attach
10/10/2002WO2002080260A1 Deposition method, deposition apparatus, insulating film and semiconductor integrated circuit
10/10/2002WO2002080259A1 Film forming method and film forming device
10/10/2002WO2002080258A1 Integrated circuit structure
10/10/2002WO2002080257A1 Film forming method and film forming device
10/10/2002WO2002080256A1 Film forming method and film forming device
10/10/2002WO2002080254A1 Microwave plasma process device, plasma ignition method, plasma forming method, and plasma process method
10/10/2002WO2002080253A1 Device and method for plasma processing, and slow-wave plate
10/10/2002WO2002080252A1 Plasma processing device
10/10/2002WO2002080251A1 Plasma processing device
10/10/2002WO2002080250A1 Plasma processing device
10/10/2002WO2002080248A1 Plasma processing device
10/10/2002WO2002080247A1 Sacrificial films to provide structural integrity to critical dimension structures
10/10/2002WO2002080246A1 Method for making multilayer electronic devices
10/10/2002WO2002080245A1 Phosphorus dopant control in low-temperature si and sige epitaxy
10/10/2002WO2002080244A2 Improved process for deposition of semiconductor films
10/10/2002WO2002080243A1 Production method of iii nitride compound semiconductor, and iii nitride compound semiconductor element based on it
10/10/2002WO2002080242A1 Method for manufacturing group-iii nitride compound semiconductor, and group-iii nitride compound semiconductor device
10/10/2002WO2002080241A1 Method of forming strained silicon on insulator (ssoi) and structures formed thereby
10/10/2002WO2002080240A2 Method for producing a semi-conductor arrangement and the use of an ion beam arrangement for carrying out said method
10/10/2002WO2002080239A2 Process for forming sub-lithographic photoresist features
10/10/2002WO2002080238A1 Processing apparatus and processing system for semiconductor device
10/10/2002WO2002080237A1 Angular spin, rinse, and dry module and methods for making and implementing the same
10/10/2002WO2002080236A2 An apparatus and method for creating an ultra-clean mini-environment through lozalized air flow augmentation
10/10/2002WO2002080235A2 A method for fabrication of a high capacitance interpoly dielectric
10/10/2002WO2002080234A2 Method of plasma etching organic antireflective coating
10/10/2002WO2002080233A2 Process and apparatus for removing residues from the microstructure of an object
10/10/2002WO2002080232A2 Substrate storage pod access device
10/10/2002WO2002080231A2 Semiconductor wafer lifting device and methods for implementing the same
10/10/2002WO2002080230A2 Method of plasma etching low-k organosilicate materials
10/10/2002WO2002080229A2 Microelectronic assembly with die support and method
10/10/2002WO2002080228A2 Structure including cubic boron nitride films
10/10/2002WO2002080227A2 Memory address and decode circuits with ultra thin body transistors
10/10/2002WO2002080225A2 Method and apparatus for growing submicron group iii nitride structures utilizing hvpe techniques
10/10/2002WO2002080220A1 Inductive plasma processor including current sensor for plasma excitation coil
10/10/2002WO2002080219A1 Stacked rf excitation coil for inductive plasma processor
10/10/2002WO2002080185A1 Stage device, exposure device, and method of manufacturing device
10/10/2002WO2002079887A2 Apparatus and methods with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wafer
10/10/2002WO2002079881A2 Lithography apparatus comprising a mobile lens for producing digital holograms
10/10/2002WO2002079880A2 Method for adjusting the overlay of two masking planes in a photolithographic process
10/10/2002WO2002079876A2 Lithographic template
10/10/2002WO2002079705A2 Nozzle design for generating fluid streams useful in the manufacture of microelectronic devices
10/10/2002WO2002079699A1 Production system
10/10/2002WO2002079551A1 Suppression of n-type autodoping in low-temperature si and sige epitaxy
10/10/2002WO2002079550A1 Process for preparing fluoride monocrystals
10/10/2002WO2002079549A2 Preparation of 157nm transmitting barium fluoride crystals with permeable graphite
10/10/2002WO2002079538A1 Cerium oxide containing ceramic components and coatings in semiconductor processing equipment
10/10/2002WO2002079537A2 W-cvd with fluorine-free tungsten nucleation
10/10/2002WO2002079536A1 Sputter device
10/10/2002WO2002079294A1 One-component hot-setting epoxy resin composition and semiconductor mounting underfill material
10/10/2002WO2002079287A1 Polycyclic fluorine-containing polymers and photoresists for microlithography
10/10/2002WO2002079211A1 Metalloamide and aminosilane precursors for cvd formation of dielectric thin films
10/10/2002WO2002079085A2 Surface modification of porous silicon
10/10/2002WO2002079080A1 Production device and production method for silicon-based structure
10/10/2002WO2002079059A1 Integrated substrate handler having pre-aligner and storage pod access mechanism
10/10/2002WO2002079053A1 Thin wafer insert
10/10/2002WO2002078905A1 Method and apparatus for end point triggering with integrated steering
10/10/2002WO2002078904A1 Support for a polishing belt
10/10/2002WO2002078903A2 Method and apparatus for avoiding particle accumulation during an electrochemical process
10/10/2002WO2002078902A1 Reinforced polishing pad with a shaped or flexible window structure
10/10/2002WO2002078901A1 A chemical mechanical planarization system with an adjustable force applying air platen
10/10/2002WO2002078900A2 Apparatus and methods for aligning a surface of an active retainer ring with a wafer surface for chemical mechanical polishing
10/10/2002WO2002078896A1 Methods and systems for processing a device, methods and systems for modeling same and the device
10/10/2002WO2002078895A1 High-speed, precision, laser-based method and system
10/10/2002WO2002078781A2 Method and apparatus for providing hermetic electrical feedthrough
10/10/2002WO2002067055A3 Template for room temperature, low pressure micro- and nano-imprint lithography
10/10/2002WO2002065529A3 Chemical-mechanical planarization using ozone
10/10/2002WO2002064287A3 Rejuvenation of refractory metal products
10/10/2002WO2002063683A3 Method of manufacturing a semiconductor device and a semiconductor device obtained by means of said method
10/10/2002WO2002063671A3 Method for producing a semiconductor component comprising a t-shaped contact electrode
10/10/2002WO2002060632A3 Bonding tool with polymer coating
10/10/2002WO2002059933A3 Vertically translatable chuck assembly and method for a plasma reactor system
10/10/2002WO2002058113A3 Electrochemical methods for polishing copper films on semiconductor substrates
10/10/2002WO2002056347A3 Method of testing of a semiconductor wafer by mechanical stressing of a die
10/10/2002WO2002049082A3 Process of shaping a semiconductor substrate and/or a lithographic mask
10/10/2002WO2002048668A3 Integrated cmos capacitive pressure sensor
10/10/2002WO2002047448A3 Attaching devices using polymers
10/10/2002WO2002044803A3 Liquid-crystal display
10/10/2002WO2002043117A3 Trench gate fermi-threshold field effect transistors and methods of fabricating the same
10/10/2002WO2002041404A3 Trench-gate field-effect transistors and their manufacture
10/10/2002WO2002037541A3 Etch chamber for etching dielectric layer with expanded process window
10/10/2002WO2002027063A3 Vapor deposition of oxides, silicates and phosphates
10/10/2002WO2002025825A3 Method for assembling components and antennae in radio frequency identification devices
10/10/2002WO2002025701A3 Body-tied silicon on insulator semiconductor device structure and method therefor
10/10/2002WO2002023597A3 Double dual slot load lock for process equipment
10/10/2002WO2002017388A3 Method of improving the adhesion of copper
10/10/2002WO2002009178A3 Semiconductor device and a process for forming the same
10/10/2002WO2001099198A3 Power mosfet and method of making the same
10/10/2002WO2001099186A3 Shielding of analog circuits on semiconductor substrates
10/10/2002WO2001096888A9 Difference frequency imaging and spectroscopy to measure dopants using an alternating current scanning tunneling microscope
10/10/2002WO2001090820A9 Flexible piezoelectric chuck
10/10/2002WO2001085392A3 Metal chemical mechanical polishing process for minimizing dishing during semiconductor wafer fabrication
10/10/2002WO2001073157A9 Method and apparatus for reducing contamination in a loadlock
10/10/2002WO2001054184A9 Method for removing residues with reduced etching of oxide
10/10/2002WO2001001455A3 Chip with protruding microelectrodes and method for the production thereof
10/10/2002US20020147958 Method and apparatus for adaptively selecting the wiring model for a design region
10/10/2002US20020147555 Method and apparatus for analyzing a source current waveform in a semiconductor integrated circuit
10/10/2002US20020147553 Electromagnetic disturbance analysis method and apparatus and semiconductor device manufacturing method using the method
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