Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2002
10/15/2002US6465284 Semiconductor device and method for manufacturing the same
10/15/2002US6465283 Structure and fabrication method using latch-up implantation for improving latch-up immunity in CMOS fabrication process
10/15/2002US6465280 In-situ cap and method of fabricating same for an integrated circuit device
10/15/2002US6465279 Lead frame and production method thereof, and semiconductor device and fabrication method thereof
10/15/2002US6465278 Method and apparatus for delivering electrical power to a semiconductor die
10/15/2002US6465277 Molding apparatus and molding method for flexible substrate based package
10/15/2002US6465274 Lead frame tooling design for bleed barrier groove
10/15/2002US6465272 Extreme ultraviolet soft x-ray projection lithographic method and mask devices
10/15/2002US6465271 Method of fabricating silicon capacitive sensor
10/15/2002US6465270 Process for producing a semiconductor device
10/15/2002US6465268 Method of manufacturing an electro-optical device
10/15/2002US6465267 Method of measuring gate capacitance to determine the electrical thickness of gate dielectrics
10/15/2002US6465266 Semiconductor device short analysis
10/15/2002US6465265 Analysis of interface layer characteristics
10/15/2002US6465264 Method for producing semiconductor device and apparatus usable therein
10/15/2002US6465263 Method and apparatus for implementing corrected species by monitoring specific state parameters
10/15/2002US6465262 Method for manufacturing a semiconductor device
10/15/2002US6465261 Method for manufacturing FeRAM device
10/15/2002US6465260 Ferroelectric capacitor includes nb doped lead zirconate titanate (pnzt); made by preparing a sol-gel coating solution of pnzt for use in a ferroelectric random access memory
10/15/2002US6465160 After exposure, before development, photoresist is baked for a period of time sufficient to increase the resist contrast value of the resist pattern and thereby suppress the generation of side-lobes
10/15/2002US6465159 Method and apparatus for side wall passivation for organic etch
10/15/2002US6465158 Semiconductor wafer dividing method
10/15/2002US6465157 Dual layer pattern formation method for dual damascene interconnect
10/15/2002US6465149 Solution to be optically treated, a method for forming an antireflection film, a method for pattern-plating and a method for manufacturing a thin film magnetic head
10/15/2002US6465147 Cross-linker for photoresist, and process for forming a photoresist pattern using the same
10/15/2002US6465139 Mask pattern that prevents the source polysilicon layer from being etched and damaged in the word line trim etch step, and prevents the formation of difficult to remove polymers, which facilitates the subsequent manufacturing processes
10/15/2002US6465137 Resist composition and pattern forming process
10/15/2002US6465112 Method for fabricating semiconductor device
10/15/2002US6465082 Stress relaxation electronic part, stress relaxation wiring board, and stress relaxation electronic part mounted body
10/15/2002US6465057 Rf power and a dc power and the dc power is applied to an electrode carrying the deposition target object; carbon nitride layer formed at the surface portion of the carbon film
10/15/2002US6465055 Ozone eliminates organic substances on a wafer to form a film such as of spin on glass; stand for substrate, an irradiating body for generating ozone, casing for storing irradiating body, a penetrating body and exhaust system
10/15/2002US6465054 Process for coating surfaces
10/15/2002US6465053 Method for manufacturing a magnetic device
10/15/2002US6465051 Cleaning a plasma reactor by creating a vacuum in the chamber while introducing an etchant gas and applying rf energy to a ceiling electrode in the chamber while not necessarily applying rf energy to the coil antenna
10/15/2002US6465049 Method for preparation of diamond film
10/15/2002US6465045 Low stress polysilicon film and method for producing same
10/15/2002US6465044 Chemical vapor deposition of silicon oxide films using alkylsiloxane oligomers with ozone
10/15/2002US6464930 Furnace of apparatus for manufacturing a semiconductor device having a heat blocker for preventing heat loss during the unloading of wafers
10/15/2002US6464892 Methods of fabricating microelectromechanical and microfluidic devices
10/15/2002US6464891 Method for repetitive ion beam processing with a carbon containing ion beam
10/15/2002US6464855 Method and apparatus for electrochemical planarization of a workpiece
10/15/2002US6464843 Silicon carbide (sic) as a consumable chamber surface material which reduces metal and/or particle contamination; plasma etching an oxide layer on a semiconductor wafer
10/15/2002US6464825 Substrate processing apparatus including a magnetically levitated and rotated substrate holder
10/15/2002US6464824 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
10/15/2002US6464806 Selectively heating during which the constraining material restricts thermal expansion in all directions but the one direction normal to the surface such that stresses are induced that cause grain growth in one direction
10/15/2002US6464799 Method for managing a fluid level associated with a substrate processing tank
10/15/2002US6464796 Methods for applying fluid through a brush interflow distributor
10/15/2002US6464795 Substrate support member for a processing chamber
10/15/2002US6464794 Process chamber used in manufacture of semiconductor device, capable of reducing contamination by particulates
10/15/2002US6464792 Process chamber with downstream getter plate
10/15/2002US6464791 Low-pressure apparatus for carrying out steps in the manufacture of a device, a method of manufacturing a device making use of such an apparatus, and a pressure control valve
10/15/2002US6464790 Substrate support member
10/15/2002US6464789 Substrate processing apparatus
10/15/2002US6464782 Apparatus for vaporization sequence for multiple liquid precursors used in semiconductor thin film applications
10/15/2002US6464781 Method of suppressing convection in a fluid in a cylindrical vessel
10/15/2002US6464780 Method for the production of a monocrystalline layer on a substrate with a non-adapted lattice and component containing one or several such layers
10/15/2002US6464778 Tungsten deposition process
10/15/2002US6464741 CMP polishing slurry dewatering and reconstitution
10/15/2002US6464740 Abrasive bimodal metal oxides; dimensional stability; chemical mechanical polishing
10/15/2002US6464568 Method and chemistry for cleaning of oxidized copper during chemical mechanical polishing
10/15/2002US6464563 Method and apparatus for detecting dishing in a polished layer
10/15/2002US6464466 Trap apparatus
10/15/2002US6464448 Substrate transport apparatus
10/15/2002US6464445 System and method for improved throughput of semiconductor wafer processing
10/15/2002US6464444 Apparatus for peeling off chips using a plurality of first and second protrusions
10/15/2002US6464126 Bonding apparatus and bonding method
10/15/2002US6464125 Rework and underfill nozzle for electronic components
10/15/2002US6464124 Electrically conductive elevation shaping tool
10/15/2002US6464123 Bondhead lead clamp apparatus and method
10/15/2002US6464081 Door guide for a wafer container
10/15/2002US6463941 Concentration control apparatus of liquid chemical
10/15/2002US6463938 Wafer cleaning method
10/15/2002US6463875 Multiple coil antenna for inductively-coupled plasma generation systems
10/15/2002US6463782 Self-centering calibration tool and method of calibrating
10/15/2002US6463678 Substrate changing-over mechanism in a vaccum tank
10/15/2002US6463676 Vacuum processing apparatus and operating method therefor
10/11/2002CA2381115A1 Heater member for mounting heating object and substrate processing apparatus using the same
10/11/2002CA2381113A1 Substrate processing apparatus
10/10/2002WO2002080644A1 A substrate for mounting a semiconductor
10/10/2002WO2002080632A1 Device and control method for micro wave plasma processing
10/10/2002WO2002080368A1 Buffer circuit having reduced leakage current and method of reducing leakage current in a field programmable device
10/10/2002WO2002080367A2 Wireless programmable logic devices
10/10/2002WO2002080320A1 Nitride semiconductor element
10/10/2002WO2002080287A2 Semiconductor structures and devices for detecting far-infrared light
10/10/2002WO2002080285A1 Ain coated heterojunction field effect transistor
10/10/2002WO2002080284A1 Negative-resistance field-effect device
10/10/2002WO2002080282A1 Double diffused field effect transistor having reduced on-resistance
10/10/2002WO2002080281A1 Horizontal current bipolar transistor
10/10/2002WO2002080280A1 Methods of fabricating nanostructures and nanowires and devices fabricated therefrom
10/10/2002WO2002080279A1 Three-dimensional metal devices highly suspended above semiconductor substrate, their circuit model, and method for manufacturing the same
10/10/2002WO2002080277A1 Simox substrate production process and simox substrate
10/10/2002WO2002080276A1 Production method for simox substrate and simox substrate
10/10/2002WO2002080275A2 Memory cell arrays and method for the production thereof
10/10/2002WO2002080274A2 Electrical discharge circuit
10/10/2002WO2002080271A2 Fluxless flip chip interconnection
10/10/2002WO2002080269A2 Method and structure for ex-situ polymer stud grid array contact formation
10/10/2002WO2002080268A1 A substrate for mounting a semiconductor chip
10/10/2002WO2002080267A2 Contact formation for semiconductor device
10/10/2002WO2002080266A1 Soi devices with integrated gettering structure
10/10/2002WO2002080265A2 Plasma processor and method for operating same
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