Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2002
12/12/2002WO2002099871A2 Plastic housing comprising several semiconductor chips and a wiring modification plate, and method for producing the plastic housing in an injection-moulding mould
12/12/2002WO2002099870A1 Production method for semiconductor device
12/12/2002WO2002099869A1 A method concerning a junction barrier schottky diode, such a diode and use thereof
12/12/2002WO2002099868A1 Method of fabricating semiconductor device
12/12/2002WO2002099867A1 Structure and method for fabricating semiconductor structures on compliant substrates
12/12/2002WO2002099866A2 Oxidation of silicon nitride films in semiconductor devices
12/12/2002WO2002099865A1 Method of forming an integrated circuit device using dummy features and structure thereof
12/12/2002WO2002099864A1 Method for removing polysilane from a semiconductor without stripping
12/12/2002WO2002099862A1 Annealing method, ultra-shallow junction layer forming method and ultr-shallow junction layer forming device
12/12/2002WO2002099861A1 Rector having a movale shuter
12/12/2002WO2002099860A1 Method of preparing nitrogen containing semiconductor material
12/12/2002WO2002099859A1 Method of producing iii nitride compound semiconductor
12/12/2002WO2002099858A1 Integrated semiconductor devices for interacting with optical storage media
12/12/2002WO2002099857A1 Anti-reflective coating and methods of making the same
12/12/2002WO2002099856A1 Electron beam exposure-use mask and electron beam exposure method
12/12/2002WO2002099855A1 Ceramic heater for semiconductor producing and inspecting device and hot plate unit using the ceramic heater
12/12/2002WO2002099854A2 Semiconductor wafer handling robot for linear transfer chamber
12/12/2002WO2002099853A2 Temperature-controlled chuck and method for controlling the temperature of a substantially flat object
12/12/2002WO2002099851A2 Temperature controlled vacuum chuck
12/12/2002WO2002099850A2 Interchangeable microdeposition head apparatus and method
12/12/2002WO2002099849A2 Apparatus for microdeposition of multiple fluid materials
12/12/2002WO2002099848A2 Formation of printed circuit board structures using piezo microdeposition
12/12/2002WO2002099846A2 Integrated semiconductor devices for interacting with magnetic storage media
12/12/2002WO2002099845A2 Electronic chip and electronic chip assembly
12/12/2002WO2002099841A1 High performance magnetron for dc sputtering systems
12/12/2002WO2002099840A2 Inductively-coupled plasma processing system
12/12/2002WO2002099839A2 Wafer bias drive for a plasma source
12/12/2002WO2002099813A2 Semiconductor storage location
12/12/2002WO2002099808A1 Steering gate and bit line segmentation in non-volatile memories
12/12/2002WO2002099807A2 Method and apparatus for boosting bitlines for low vcc read
12/12/2002WO2002099534A2 Lighting system with a plurality of individual grids
12/12/2002WO2002099531A2 ANTI-REFLECTIVE COATING COMPOSITIONS FOR USE WITH LOW k DIELECTRIC MATERIALS
12/12/2002WO2002099500A2 Correction of birefringence in cubic crystalline projection lenses and optical systems
12/12/2002WO2002099482A2 Oscillating reference signal generator
12/12/2002WO2002099481A2 Semiconductor structure for an optically switched integrated device
12/12/2002WO2002099394A1 Methods and systems for monitoring process fluids
12/12/2002WO2002099349A1 Heating member for combination heating and chilling apparatus, and methods
12/12/2002WO2002099165A2 Tools with transfer devices for handling workpieces
12/12/2002WO2002099164A2 Electroless-plating solution and semiconductor device
12/12/2002WO2002099161A2 Method for the deposition of materials from mesomorphous films
12/12/2002WO2002099160A1 Gas port sealing for cvd/cvi furnace hearth plates
12/12/2002WO2002099158A1 Ring-type sputtering target
12/12/2002WO2002098955A1 Organosilicate polymer and insulating film therefrom
12/12/2002WO2002098870A1 Substituted oxime derivatives and the use thereof as latent acids
12/12/2002WO2002098676A1 Polishing device
12/12/2002WO2002098593A1 Method for solidifying liquid metal, method for jointing metal members utilizing the same and jointed structure
12/12/2002WO2002098580A1 Method of and apparatus for substrate pre-treatment
12/12/2002WO2002098576A1 Industrial microdeposition system for polymer light emitting diode displays, printed circuit boards and the like
12/12/2002WO2002098575A1 Over-clocking in a microdeposition control system to improve resolution
12/12/2002WO2002098574A1 Microdeposition apparatus
12/12/2002WO2002098573A1 Waveform generator for microdeposition control system
12/12/2002WO2002086937B1 Dipole ion source
12/12/2002WO2002084402A3 Process for producing film forming resins for photoresist compositions
12/12/2002WO2002082519A3 Method for producing a semiconductor component comprising a t-shaped contact electrode
12/12/2002WO2002080239A3 Process for forming sub-lithographic photoresist features
12/12/2002WO2002078041A3 Neutral particle beam processing apparatus
12/12/2002WO2002075787A3 Method of manufacturing a semiconductor device with metallization layers interconnected by tungsten plugs
12/12/2002WO2002068727A3 Copper-plating solution, plating method and plating apparatus
12/12/2002WO2002067305A3 Reduction of metal silicide/silicon interface roughness by dopant implantation processing
12/12/2002WO2002067294A3 Arrangement and a method for reducing contamination with particles on a substrate in a process tool
12/12/2002WO2002061807A3 Method and system for rotating a semiconductor wafer in processing chambers
12/12/2002WO2002058163A3 Method for producing semiconductor components
12/12/2002WO2002058107A3 Method for producing an optical semiconductor box and optical semiconductor box
12/12/2002WO2002056344A3 Transportable container including an internal environment monitor
12/12/2002WO2002036331A3 Device for sintering, removing material and/or labeling by means of electromagnetically bundled radiation and method for operating the device
12/12/2002US20020188925 Pattern-creating method, pattern-processing apparatus and exposure mask
12/12/2002US20020188924 Optical proximity correction for phase shifting photolithographic masks
12/12/2002US20020188922 Method for storing multiple levels of design data in a common database
12/12/2002US20020188916 Integrated circuit, integrated circuit design method and hardware description generation method to generate hardware behavior description of integrated circuit
12/12/2002US20020188913 Apparatus and method of layout generation, and program thereof
12/12/2002US20020188901 Systems and methods for facilitating testing of pad drivers of integrated circuits
12/12/2002US20020188417 Methods and systems for determining a property of a specimen prior to, during, or subsequent to an etch process
12/12/2002US20020188414 Systems and methods for calibrating integrated inspection tools
12/12/2002US20020188370 Chemical mechanical polishing apparatus and methods with central control of polishing pressure applied by polishing head
12/12/2002US20020188367 Method and system for managing semiconductor manufacturing equipment
12/12/2002US20020187755 Semiconductor switching device
12/12/2002US20020187735 Polishing apparatus
12/12/2002US20020187662 Photolithographically-patterned out-of-plane coil structures and method of making
12/12/2002US20020187658 Method for manufacturing silicon mirror wafer, silicon mirror wafer, and heat treatment furnace
12/12/2002US20020187657 Semiconductor device and method for manufacturing the same
12/12/2002US20020187656 Hydrogen assisted undoped silicon oxide deposition process for HDP-CVD
12/12/2002US20020187655 HDP-CVD deposition process for filling high aspect ratio gaps
12/12/2002US20020187654 Methods and apparatus for forming a high dielectric film and the dielectric film formed thereby
12/12/2002US20020187653 Method of forming a spin-on-passivation layer
12/12/2002US20020187652 For disposable products that disintegrate in landfills
12/12/2002US20020187651 Method for making a semiconductor device
12/12/2002US20020187650 Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing
12/12/2002US20020187649 Method for producing thin film
12/12/2002US20020187648 Material removal method for forming a structure
12/12/2002US20020187647 Stepped upper electrode for plasma processing uniformity
12/12/2002US20020187646 Notched gate configuration for high performance integrated circuits
12/12/2002US20020187645 Method for plasma etching of Ir-Ta-O electrode and for post-etch cleaning
12/12/2002US20020187644 Vapor deposition using organometallic or organosilicon compound
12/12/2002US20020187643 Plasma treatment system
12/12/2002US20020187642 Composition compatible with aluminum planarization and methods therefore
12/12/2002US20020187641 Method for avoiding microscratch in interlevel dielectric layer chemical mechanical polishing process
12/12/2002US20020187640 Method of manufacturing semiconductor device
12/12/2002US20020187639 Process for treating a polished semiconductor water immediately after the semiconductor wafer has been polished
12/12/2002US20020187638 Method for fabricating semiconductor device
12/12/2002US20020187637 Polishing method using ceria slurry, and method of manufacturing semiconductor device