H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2002
12/12/2002	US20020185303 Wiring circuit board and method for producing same
12/12/2002	US20020185268 Thermal interface wafer and method of making and using the same
12/12/2002	US20020185230 Article holders that use gas vortices to hold an article in a desired position
12/12/2002	US20020185229 Inductively-coupled plasma processing system
12/12/2002	US20020185227 Plasma processor method and apparatus
12/12/2002	US20020185225 Substrate processing method and substrate processing apparatus
12/12/2002	US20020185224 Chemical mechanical polishing system and method for planarizing substrates in fabricating semiconductor devices
12/12/2002	US20020185223 Apparatus and method for conditioning polishing pad in a chemical mechanical planarization process
12/12/2002	US20020185185 Fluid control apparatus
12/12/2002	US20020185164 Apparatus for applying cleaning treatment to the surface of a processed member
12/12/2002	US20020185163 Reactor for processing a semiconductor wafer
12/12/2002	US20020185155 Method of applying liquid to a megasonic apparatus for improved cleaning control
12/12/2002	US20020185154 Includes rotatable chuck for supporting substrate and splash guard which deflects fluid flung off from centrifugal force; for cleaning semiconductor wafers
12/12/2002	US20020185153 Stackable process chambers
12/12/2002	US20020185152 For cleaning semiconductor substrates
12/12/2002	US20020185151 Plasma process for removing polymer and residues from substrates
12/12/2002	US20020185121 Group encapsulated dicing chuck
12/12/2002	US20020185068 Reactor having a movable shutter
12/12/2002	US20020185062 Compact process chamber for improved process uniformity
12/12/2002	US20020185058 Single crystal silicon carbide thin film fabrication method and fabrication apparatus of the same
12/12/2002	US20020185057 Process for growing calcium fluoride monocrystals
12/12/2002	US20020185054 High surface quality gan wafer and method of fabricating same
12/12/2002	US20020184788 Process for drying an object having microstructure and the object obtained by the same
12/12/2002	US20020184758 Method of fabricating semiconductor chip assemblies
12/12/2002	US20020184756 Wiring process
12/12/2002	US20020184720 Integrated substrate processing system
12/12/2002	DE10224559A1 Polierverfahren zur Entfernung von Eckmaterial von einem Halbleiterwafer A polishing method for removing corner material from a semiconductor wafer
12/12/2002	DE10223748A1 Integrierte Schaltungsvorrichtung, die selbstjustierte Kontakte mit einer erhöhten Ausrichtungsgrenze aufweisen, und Verfahren zur Herstellung derselben An integrated circuit device having self-aligned contacts with increased alignment boundary, and methods of making the same
12/12/2002	DE10222670A1 Elektrische Vorrichtung, welche eine Metallkontaktstelle besitzt, auf die eine Metallverdrahtung gebondet ist, und ein Herstellungsverfahren davon An electrical device which has a metal pad to which a metal wiring is bonded, and a manufacturing method thereof
12/12/2002	DE10222608A1 Halbleitervorrichtung und Verfahren zum Herstellen derselben A semiconductor device and method of manufacturing the same
12/12/2002	DE10202701A1 Semiconductor wafer polishing device, has chemical/mechanical polishing device with polishing head
12/12/2002	DE10201863A1 Waferraumhaltevorrichtung, die auf einer elektrostatischen Aufnahmevorrichtung installiert ist und Verfahren zur Herstellung derselben Wafer space holding device that is installed on an electrostatic recording apparatus and method for manufacturing the same
12/12/2002	DE10200833A1 Gerät und Verfahren für eine Teststimuliverdichtung Apparatus and method for a compression test stimuli
12/12/2002	DE10162979A1 Halbleitervorrichtung und Verfahren zu deren Herstellung Semiconductor device and process for their preparation
12/12/2002	DE10161129A1 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation
12/12/2002	DE10143283C1 Production of a trench capacitor comprises a preparing a substrate having a surface in which a trench is formed and having an upper region, a lower region and a side wall
12/12/2002	DE10132709A1 Method for short-term thermal treatment of surfaces of flat objects esp. semiconductor-, glass-, or metal-substrates, involves monitoring surface temperatures of substrate relative to heat exchange via thermal radiation
12/12/2002	DE10128154A1 Digital magnetic storage cell arrangement used for reading and writing operations comprises a soft magnetic reading and/or writing layer system, and a hard magnetic reference layer system formed as an AAF system
12/12/2002	DE10127449A1 Illumination system has grid element with individual grids, grid period, physical stop in stop plane located after grid element in beam path from object plane to field plane
12/12/2002	DE10127074A1 Treating hetero-epitaxial semiconductor layers on silicon-on-insulator used in the production of electronic devices comprises irradiating the surface of an epitaxial layer with a light impulse
12/12/2002	DE10127073A1 Verfahren zur Behandlung heteroepitaktischer Halbleiterschichten auf Siliziumsubstraten A method of treating heteroepitaxial semiconductor layers on silicon substrates,
12/12/2002	DE10127042A1 Method for treating or handling substrates e.g. for wafers or silicon discs, involves supporting substrate in lower edge region on supporting elements
12/12/2002	DE10127009A1 Plastic housing used for packing semiconductor chips comprises semiconductor chips arranged in lines and gaps
12/12/2002	DE10126860A1 Organic field effect transistor used in the production of integrated circuits comprises a gate electrode, an insulating layer and a semiconductor layer arranged on a substrate
12/12/2002	DE10126734A1 Umverdrahtungsverfahren Umverdrahtungsverfahren
12/12/2002	DE10126296A1 Production of an electronic component, especially a chip, mounted on a support comprises spraying or casting an elastic material using a spray or casting mold to form elastic material
12/12/2002	DE10126130A1 Producing contact holes in integrated circuit involves using optical lithography with mask with elongated, slit-shaped openings for producing essentially circular and/or elongated holes
12/12/2002	DE10126019A1 Apparatus for heating substrates comprises emitters for emitting electromagnetic waves, reflectors for (in)directly directing electromagnetic radiation released by emitters onto substrate, and rigid or adjustable screens
12/12/2002	DE10125912A1 Production of a semiconductor layer on a crystalline substrate by molecular beam epitaxy used in the semiconductor industry comprises growing at a specified temperature using a vicinal substrate having a predetermined mis-orientation
12/12/2002	DE10125800A1 Speicherbaustein mit einer Speicherzelle und Verfahren zur Herstellung eines Speicherbausteins Memory device having a memory cell and method for manufacturing a memory device
12/12/2002	DE10124774A1 Halbleiterbauelement mit zumindest einem Halbleiterchip auf einem als Substrat dienenden Basischip und Verfahren zu dessen Herstellung A semiconductor device comprising at least a semiconductor chip on a substrate serving as a base chip and process for its preparation
12/12/2002	DE10122669A1 Vorrichtung zum Nassreinigen von scheibenförmigen Substraten An apparatus for wet cleaning of disk-shaped substrates
12/12/2002	CA2448488A1 Heatsink assembly and method of manufacturing the same
12/11/2002	EP1265464A2 Electronic component and method of manufacturing the same
12/11/2002	EP1265295A2 Silicon carbide Schottky diode and method for manufacturing the same
12/11/2002	EP1265293A2 Semiconductor component having pores and method of making the same
12/11/2002	EP1265292A2 Charge multiplier with logarithmic dynamic range compression implemented in charge domain
12/11/2002	EP1265289A2 Electrically erasable and programmable memory device
12/11/2002	EP1265288A2 Semiconductor structure with buried conductive lines and method of electrically contacting of buried conductive lines
12/11/2002	EP1265284A1 Semiconductor switching device
12/11/2002	EP1265283A2 Semiconductor switching device
12/11/2002	EP1265279A1 Flash memory device and method for manufacturing the same, and method for forming dielectric film
12/11/2002	EP1265278A1 Method for manufacturing a trench capacitor with an isolation trench
12/11/2002	EP1265277A2 Additional n-type LDD/pocket implant for improving short-channel nmos ESD robustness
12/11/2002	EP1265276A1 Method for forming dielectric film
12/11/2002	EP1265275A2 Thermal stability improvement of CoSi2 film by stuffing in titanium
12/11/2002	EP1265274A2 Single crystal silicon carbide thin film fabrication method and fabrication apparatus for the same
12/11/2002	EP1265273A1 Production method of iii nitride compound semiconductor and iii nitride compound semiconductor element
12/11/2002	EP1265272A1 Group iii nitride compound semiconductor and method for manufacturing the same
12/11/2002	EP1265267A2 RF power probe head with a thermally conductive bushing
12/11/2002	EP1265251A2 Sensing methodology for a 1T/1C ferroelectric memory
12/11/2002	EP1265249A2 Magneto-resistance effect film and memory using it
12/11/2002	EP1265235A2 Phase change of a recording layer under a temporary capping layer
12/11/2002	EP1265107A2 Position detection method and apparatus
12/11/2002	EP1265104A1 Lithographic apparatus, device manufacturing method, and device manufactured thereby
12/11/2002	EP1265063A1 Improved sample inspection system
12/11/2002	EP1264520A1 Packaging structure and method
12/11/2002	EP1264351A1 Integrated component comprising a metal-insulator-metal capacitor
12/11/2002	EP1264349A1 A die attachment surface having pedestals for receiving components and method of using the attachment
12/11/2002	EP1264345A2 Spin transistor
12/11/2002	EP1264344A1 Electronic component comprising an electrically conductive connection consisting of carbon nanotubes and a method for producing the same
12/11/2002	EP1264342A1 A dual spacer process for non-volatile memory devices
12/11/2002	EP1264341A2 Method of preventing bridging between polycrystalline micro-scale features
12/11/2002	EP1264340A2 Use of organic spin on materials as a stop-layer for local interconnect, contact and via layers
12/11/2002	EP1264339A1 Simox substrate and method for production thereof
12/11/2002	EP1264338A1 Method for adjusting an electrical parameter on an integrated electronic component
12/11/2002	EP1264337A1 Method of manufacturing source/drain regions having a deep junction
12/11/2002	EP1264336A2 Forming microscale structures from polycrystalline materials
12/11/2002	EP1264335A1 Method of forming ultrashallow junctions by laser annealing and rapid thermal annealing
12/11/2002	EP1264334A2 Digital feature separation
12/11/2002	EP1264333A2 Localized heating and cooling of substrates
12/11/2002	EP1264332A1 Recipe cascading in a wafer processing system
12/11/2002	EP1264329A2 Plasma deposition method and system
12/11/2002	EP1264328A1 Method and device for attenuating harmonics in semiconductor plasma processing systems
12/11/2002	EP1264315A2 Reference cell trimming verification circuit
12/11/2002	EP1264217A1 Method and apparatus for controlling photoresist baking processes
12/11/2002	EP1264216A1 Method of reducing defects
12/11/2002	EP1264213A2 Method and apparatus for mixed-mode optical proximity correction
12/11/2002	EP1264208A2 A method of forming electrodes or pixel electrodes and a liquid crystal display device
12/11/2002	EP1264011A1 Iii-v nitride substrate boule and method of making and using the same

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