Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2003
02/06/2003US20030025118 Light emitting device, semiconductor device, and method of fabricating the devices
02/06/2003US20030025116 Semiconductor laminate configured for dividing into predetermined parts and method of manufacture therefor
02/06/2003US20030025115 III nitride compound semiconductor device
02/06/2003US20030025114 Semiconductor device and method for fabricating the same
02/06/2003US20030025113 Semiconductor structures having reduced contact resistance
02/06/2003US20030025085 Low-aberration deflectors for use in charged-particle-beam optical systems, and methods for fabricating such deflectors
02/06/2003US20030024965 Friction stir welding method and component part welded by the method
02/06/2003US20030024964 Die bonder for die-bonding a semiconductor chip to lead frame and method of producing a semiconductor device using the die bonder
02/06/2003US20030024963 Die bonding apparatus
02/06/2003US20030024920 Hot wall rapid thermal processor
02/06/2003US20030024905 Laser irradiating device, laser irradiating method and manufacturing method of semiconductor device
02/06/2003US20030024902 Method of plasma etching low-k dielectric materials
02/06/2003US20030024901 Method of reducing plasma charge damage for plasma processes
02/06/2003US20030024899 Exposure method utilizing optical proximity corrected exposure patterns, an apparatus for generating optical proximity corrected exposure data, and an exposure apparatus for optical proximity corrected exposure data
02/06/2003US20030024898 Method of forming noble metal thin film pattern
02/06/2003US20030024896 Methods of etching silicon-oxide-containing compositions
02/06/2003US20030024888 Wafer holding apparatus
02/06/2003US20030024826 Electro-chemical polishing apparatus
02/06/2003US20030024808 Methods of sputtering using krypton
02/06/2003US20030024735 Protective device for subassemblies and method for producing a protective device
02/06/2003US20030024731 Vertical electrical interconnections in a stack
02/06/2003US20030024680 Substrate support and method of fabricating the same
02/06/2003US20030024647 Plasma processing apparatus
02/06/2003US20030024646 Plasma etching apparatus and plasma etching method
02/06/2003US20030024645 Substrate processing apparatus
02/06/2003US20030024644 Method and apparatus for measuring and dispensing a wafer etchant
02/06/2003US20030024643 Plasma etching system and method
02/06/2003US20030024642 Method and apparatus for processing semiconductor substrates
02/06/2003US20030024635 Method for transferring element, method for producing element, integrated circuit, circuit board, electro-optical device, IC card, and electronic appliance
02/06/2003US20030024582 Valve for a slurry outlet opening of a chemical mechanical polishing device and chemical mechanical polishing device having a valve
02/06/2003US20030024557 Apparatus for wafer rinse and clean and edge etching
02/06/2003US20030024553 For treating substrates such as a semiconductor wafer, in which chemical fluids can spread uniformly over the substrate without substantially decomposing and changing their compositions, to prevent volatilization
02/06/2003US20030024477 Substrate processing apparatus
02/06/2003US20030024475 Method and apparatus for producing group-III nitrides
02/06/2003US20030024471 Fabrication of semiconductor structures and devices forms by utilizing laser assisted deposition
02/06/2003US20030024431 Containing dihydric copper ions, a complexing agent, an aldehyde acid, and an organic alkali; forming a thin film copper interconnection for a semiconductor device
02/06/2003US20030024216 Position sensing system for inspection handling system
02/06/2003US20030024120 Heat exchanger cast in metal matrix composite and method of making the same
02/06/2003DE10151657C1 Process for assembling a chip with contacts on a substrate comprises applying adhesion agent points and an adhesive mark, joining the chip and the substrate, and allowing the adhesives to harden
02/06/2003DE10137398C1 Method for producing a punched multi-hole mask produces a desired pattern of holes for the projection of particle radiation by cutting holes in a flattened stretched blank subjected to distorting forces after cutting.
02/06/2003CA2454797A1 Flip-chip bonding of light emitting devices and light emitting devices suitable for flip-chip bonding
02/06/2003CA2453237A1 Photosensitive resin composition
02/06/2003CA2452281A1 Electronic device using carbon nanotubes
02/05/2003EP1282173A2 Field effect transistor and method of manufacturing the same as well as liquid crystal display using the same as well as method of manufacturing the same
02/05/2003EP1282172A2 Bipolar semiconductor device and method for fabrication thereof
02/05/2003EP1282168A2 Semiconductor device and its fabrication method
02/05/2003EP1282166A2 Metal casing for semiconductor device having high thermal conductivity and thermal expansion coefficient similar to that of semiconductor and method for manufacturing the same
02/05/2003EP1282165A2 Semiconductor device and manufacturing method thereof
02/05/2003EP1282164A2 Method to improve the adhesion of dielectric layers to copper
02/05/2003EP1282163A1 Semiconductor device and manufacturing method thereof
02/05/2003EP1282162A2 Method for fabricating semiconductor-mounting body and apparatus for fabricating semiconductor-mounting body
02/05/2003EP1282161A1 LOW RELATIVE PERMITTIVITY SIO x? FILM, PRODUCTION METHOD, SEMICONDUCTOR DEVICE COMPRISING THE FILM
02/05/2003EP1282160A1 Process for forming nitride-oxide dielectric layers
02/05/2003EP1282159A1 Method of forming an isolation layer and method of manufacturing a trench capacitor
02/05/2003EP1282158A1 Method of manufacturing a bipolar transistor in an integrated CMOS circuit
02/05/2003EP1282157A2 Apparatus and method for controlling the temperature of a substrate
02/05/2003EP1282156A2 Transporting apparatus
02/05/2003EP1282155A1 Apparatus for transporting and placing substrates comprising semiconductor chips
02/05/2003EP1282139A1 Multilayer-coated reflective mirrors for x-ray optical systems, and methods for producing same
02/05/2003EP1282135A2 Sector protection circuit and method for flash memory devices
02/05/2003EP1282132A2 Data storage device
02/05/2003EP1282065A1 Information managing method and system and processing apparatus
02/05/2003EP1282011A2 Reflective projection lens for EUV photolithography
02/05/2003EP1281973A1 Probe card device and probe for use therein
02/05/2003EP1281691A1 Ceramic substrate
02/05/2003EP1281680A2 Method for making glass by plasma deposition and so obtained photomask material
02/05/2003EP1281679A2 Method for making glass by plasma deposition using silica powder, silica powder and photomask obtained by the method
02/05/2003EP1281666A1 Method for precisely machining microstructure
02/05/2003EP1281477A1 Polishing pads
02/05/2003EP1281440A1 Device for receiving a chip shaped carrier and process for assembling a plurality of such devices
02/05/2003EP1281439A1 Device for receiving a chip shaped carrier and process for assembling a plurality of such devices
02/05/2003EP1281204A1 One-time uv-programmable non-volatile semiconductor memory and method of programming such a semiconductor memory
02/05/2003EP1281200A2 Method of making a semiconductor device having a recessed insulating layer of varying thickness
02/05/2003EP1281199A2 Metal chemical mechanical polishing process for minimizing dishing during semiconductor wafer fabrication
02/05/2003EP1281198A1 REPAIR OF FILM HAVING AN Si-O BACKBONE
02/05/2003EP1281197A1 Method of modifying the surface of a semiconductor wafer
02/05/2003EP1281196A1 Method of doping silicon with phosphorus and growing oxide on silicon in the presence of steam
02/05/2003EP1281195A1 Semiconductor manufacturing system and control method thereof
02/05/2003EP1281194A1 Longitudinal conveyor
02/05/2003EP1281193A2 Method of high selectivity sac etching
02/05/2003EP1281179A1 Semiconductor device
02/05/2003EP1281108A2 Method and system for self-replicating manufacturing stations
02/05/2003EP1212783A4 Systems and methods using sequential lateral solidification for producing single or polycrystalline silicon thin films at low temperatures
02/05/2003EP1082470A4 Microchamber
02/05/2003EP0965133A4 Nonvolatile pmos two transistor memory cell and array
02/05/2003EP0925497B1 Apparatus and method for detecting micro defects in semi-conductors
02/05/2003EP0837966B1 Method for overall regulation of the headbox and/or the former of a paper machine or equivalent
02/05/2003CN2534677Y Connect-disconnect integrated circuit apparatus
02/05/2003CN1395747A Dual bit multi-level ballistic MONOS memory, and manufacturing method, programming, and operation process for memory
02/05/2003CN1395746A Semiconductor device and its manufacturing method
02/05/2003CN1395745A Silicon/germanium bipolar transistor with optimized germanium profile
02/05/2003CN1395744A Anneal wafer manufacturing method and anneal wafer
02/05/2003CN1395743A Method of forming metal wiring and semiconductor manufacturing apparatus for forming metal wiring
02/05/2003CN1395602A Wafer machining adhesive tape, and its manufacturing method and using method
02/05/2003CN1395515A In situ module for particle removal from solid state surface
02/05/2003CN1395464A Method for mfg. multilayer ceramic plate
02/05/2003CN1395351A Power supply including thermoelectric capacity
02/05/2003CN1395322A Method for manufacturing nitride semiconductor and method for making semiconductor device
02/05/2003CN1395319A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
02/05/2003CN1395318A Electronic device with non-luminous display