Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2003
01/30/2003WO2003009385A1 Semiconductor device, semiconductor storage device and production methods therefor
01/30/2003WO2003009384A1 Semiconductor storage
01/30/2003WO2003009382A2 Semiconductor structures with integrated control components
01/30/2003WO2003009380A2 Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates
01/30/2003WO2003009379A2 Semiconductive device and method of formation
01/30/2003WO2003009378A1 Solder-free pcb assembly
01/30/2003WO2003009377A2 Semiconductor structures with coplaner surfaces
01/30/2003WO2003009376A2 Semiconductor structures and devices
01/30/2003WO2003009375A2 Semiconductor back side processing
01/30/2003WO2003009374A1 Production method of semiconductor device
01/30/2003WO2003009372A2 Low resistivity tantalum nitride/tantalum bilayer stack
01/30/2003WO2003009371A1 Method of forming a conductive interconnect
01/30/2003WO2003009370A2 Substrate support pedestal
01/30/2003WO2003009369A2 Sol solution for producing glass coatings for electrically conductive materials that can be used in anodic bonding
01/30/2003WO2003009368A2 Low emitter resistance contacts to gaas high speed hbt
01/30/2003WO2003009367A1 Hafnium silicide target for forming gate oxide film and method for preparation thereof
01/30/2003WO2003009366A1 Method for enhancing surface condition of a semiconductor wafer
01/30/2003WO2003009365A1 Silicon wafer manufacturing method, silicon epitaxial wafer manufacturing method, and silicon epitaxial wafer
01/30/2003WO2003009364A2 Low dielectric constant layers
01/30/2003WO2003009362A1 Polishing element, cmp polishing device and productionj method for semiconductor device
01/30/2003WO2003009361A2 Planar metal electroprocessing
01/30/2003WO2003009360A2 Method and apparatus for depositing tungsten after surface treatment to improve film characteristics
01/30/2003WO2003009359A1 Method for forming a multilayer structure provided with predetermined parameters
01/30/2003WO2003009358A1 Thermal treatment apparatus and thermal treatment method
01/30/2003WO2003009357A2 Epitaxial semiconductor on insulator (soi) structures and devices
01/30/2003WO2003009356A1 Fabrication of buried devices within a semiconductor structure
01/30/2003WO2003009355A1 Rf, optical, photonic, analog, and digital functions in a semiconductor structure
01/30/2003WO2003009354A1 Semiconductor structure including a monocrystalline compound semiconductor layer
01/30/2003WO2003009353A1 Selective base etching
01/30/2003WO2003009352A1 Reactor for thin film deposition and method for depositing thin film on wafer using the reactor
01/30/2003WO2003009351A1 Thin-film semiconductor device and its production method
01/30/2003WO2003009350A2 Flash anneal
01/30/2003WO2003009349A2 Methods and compositions for chemical mechanical polishing substrates covered with at least two dielectric materials
01/30/2003WO2003009348A2 Facilities connection bucket for pre/facilitation of wafer fabrication equipment
01/30/2003WO2003009347A2 Integrated system for tool front-end workpiece handling
01/30/2003WO2003009346A2 Processing system
01/30/2003WO2003009345A2 Integration of fault detection with run-to-run control
01/30/2003WO2003009344A2 Iii-v arsenide nitride semiconductor substrate
01/30/2003WO2003009343A2 Plating apparatus
01/30/2003WO2003009342A2 Data carrier for contactless communication with an integrated component
01/30/2003WO2003009341A2 Damascene structure with integral etch stop layer
01/30/2003WO2003009340A2 Device and method for harmonised positioning of wafer disks
01/30/2003WO2003009339A2 Graded base gaassb for high speed gaas hbt
01/30/2003WO2003009337A2 Ferroelectric circuit element that can be fabricated at low temperatures and method for making same
01/30/2003WO2003009335A2 Ultra fine pitch capillary
01/30/2003WO2003009318A2 Support with getter-material for microelectronic, microoptoelectronic or micromechanical device
01/30/2003WO2003009317A2 Support with integrated deposit of gas absorbing material for manufacturing microelectronic, microoptoelectronic or micromechanical devices
01/30/2003WO2003009182A1 A method and apparatus for generating a solid state circuit layout with in-design variability associated to the setting of analog signal processing parameters, and an integrated circuit design and an integrated circuit produced by applying such method
01/30/2003WO2003009063A2 Real time analysis of periodic structures on semiconductors
01/30/2003WO2003009062A1 Compensation of birefringence in a lens composed of crystal lenses
01/30/2003WO2003009057A1 Thin film transistors suitable for use in flat panel displays
01/30/2003WO2003009050A1 Intrinsic birefringence compensation for below 200 nanometer wavelength optical lithography components with cubic crystalline structures
01/30/2003WO2003009021A1 Delay element made from a cubic crystal and corresponding optical system
01/30/2003WO2003008984A2 Test head docking system and method
01/30/2003WO2003008955A1 Monitoring process for oxide removal
01/30/2003WO2003008940A1 Confocal 3d inspection system and process
01/30/2003WO2003008666A1 Electrostatic chuck with dielectric coating
01/30/2003WO2003008665A1 Method and apparatus for bpsg deposition
01/30/2003WO2003008663A1 Formation of titanium nitride films using a cyclical deposition process
01/30/2003WO2003008660A1 Depositing a tantalum film
01/30/2003WO2003008483A1 Aromatic fluoropolymer and use thereof
01/30/2003WO2003008359A1 Ceramic connection body, method of connecting the ceramic bodies, and ceramic structural body
01/30/2003WO2003008352A1 Device and method for scribing fragile material substrate
01/30/2003WO2003008323A2 Lifting and supporting device
01/30/2003WO2003008304A1 Protective shipper
01/30/2003WO2003008303A1 Tray for semiconductors
01/30/2003WO2003008301A1 300mm single stackable film frame carrier
01/30/2003WO2003008157A2 Centering double side edge grip end effector with integrated mapping sensor
01/30/2003WO2003008151A1 Fixed abrasive articles with wear indicators
01/30/2003WO2003008144A1 Resistance welding method and resistance welding machine
01/30/2003WO2003008140A2 Apparatus for processing a workpiece
01/30/2003WO2003008139A2 Etching process for micromachining crystalline materials and devices fabricated thereby
01/30/2003WO2003008115A1 Megasonic cleaner probe system with gasified fluid
01/30/2003WO2003008114A1 Systems and methods for processing workpieces
01/30/2003WO2003008110A1 A method of depositing an inorganic film on an organic polymer
01/30/2003WO2002095804A8 Method and device for the thermal treatment of substrates
01/30/2003WO2002091488A3 Semiconductor device including an optically-active material
01/30/2003WO2002091434A3 Wide bandgap semiconductor structure
01/30/2003WO2002088413A3 Sputter targets comprising ti and zr
01/30/2003WO2002087293A3 Support for electrical circuit elements
01/30/2003WO2002080275A3 Memory cell arrays and method for the production thereof
01/30/2003WO2002069390A9 Grating test patterns and methods for overlay metrology
01/30/2003WO2002052625A3 Process of forming p-n layer
01/30/2003WO2002047157A3 Negative ion implant mask formation for self-aligned, sublithographic resolution patterning for single-sided verticle device formation
01/30/2003WO2002037524A3 Bi mode ion implantation with non-parallel ion beams
01/30/2003WO2002027767A3 Fluid delivery ring and methods for making and implementing the same
01/30/2003WO2002019397A3 Keyed wafer lift system
01/30/2003WO2002009242A3 Optical structure on compliant substrate
01/30/2003WO2001094640A3 Bio-mediated assembly of micrometer-scale and nanometer-scale structures
01/30/2003WO2001001442A9 A plasma reaction chamber component having improved temperature uniformity
01/30/2003US20030023938 LSI layout method and apparatus for cell arrangement in which timing is prioritized
01/30/2003US20030023913 Testing device of semiconductor integrated circuit and test method therefor
01/30/2003US20030023912 Integrated testing of serializer/deserializer in FPGA
01/30/2003US20030023805 Memory module and system, an information processing apparatus and a mehtod of use
01/30/2003US20030023402 Wafer shape evaluating method and device producing method, wafer and wafer selecting method
01/30/2003US20030023343 Wafer transfer system, wafer transfer method and automatic guided vehicle system
01/30/2003US20030023340 Substrate processing system managing apparatus information of substrate processing apparatus
01/30/2003US20030023339 Mask pattern magnification correction method, magnification correction apparatus, and mask structure
01/30/2003US20030022953 Antireflective porogens
01/30/2003US20030022801 Applying composition comprising at least one reducing agent for reducing ions of transition metal to a lower valence state, at least one pH adjusting agent, at least one metal corrosion inhibitor and water