Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2003
02/13/2003WO2003012859A1 Electrode structure, and method for manufacturing thin-film structure
02/13/2003WO2003012858A1 Method of heat-peeling chip cut pieces from heat peel type adhesive sheet, electronic part, and circuit board
02/13/2003WO2003012857A1 Testing vias and contacts in integrated circuit fabrication
02/13/2003WO2003012856A2 Method for hermetically encapsulating a component
02/13/2003WO2003012854A1 Semiconductor structure comprising a magnetoresistor
02/13/2003WO2003012853A1 Substrate and method for producing the same, and thin film structure
02/13/2003WO2003012852A2 A method of depositing a dielectric film
02/13/2003WO2003012851A2 Method of etching ferroelectric layers
02/13/2003WO2003012850A1 Selective metal oxide removal
02/13/2003WO2003012849A1 Heat treatment apparatus
02/13/2003WO2003012848A1 System and method for performing semiconductor processing on substrate being processed
02/13/2003WO2003012847A1 Semiconductor production apparatus monitoring method and control method
02/13/2003WO2003012846A1 Chemical mechanical polishing pad with micro-holes
02/13/2003WO2003012845A1 Semiconductor fabrication device and semiconductor fabrication method
02/13/2003WO2003012844A1 Xe preamorphizing implantation
02/13/2003WO2003012843A1 Method and apparatus for cleaning and method and apparatus for etching
02/13/2003WO2003012842A2 Semiconductor structure for monolithic switch matrix
02/13/2003WO2003012841A2 Semiconductor structures and devices not lattice matched to the substrate
02/13/2003WO2003012840A2 Method and device for the production of thin epiatctic semiconductor layers
02/13/2003WO2003012839A1 Method for tempering a resist layer on a wafer
02/13/2003WO2003012838A1 Method of etching conductive layers for capacitor and semiconductor device fabrication
02/13/2003WO2003012837A1 Semiconductor manufacturing apparatus control system
02/13/2003WO2003012836A1 Semiconductor manufacturing system, semiconductor manufacturing apparatus, semiconductor manufacturing method, and semiconductor device
02/13/2003WO2003012835A2 Substrate support and method of fabricating the same
02/13/2003WO2003012833A2 Process and apparatus for mounting semiconductor components to substrates and parts therefor
02/13/2003WO2003012832A2 Multiple epitaxial region substrate and technique for making the same
02/13/2003WO2003012831A2 Structure including a monocrystalline perovskite oxide layer
02/13/2003WO2003012830A1 Wafer processing system including a robot
02/13/2003WO2003012826A2 Monitoring and controlling perovskite oxide film growth
02/13/2003WO2003012821A2 Method and apparatus for producing uniform process rates
02/13/2003WO2003012802A1 Method for producing nanocomposite magnet using atomizing method
02/13/2003WO2003012570A1 Power source circuit
02/13/2003WO2003012567A1 Plasma chamber wall segment temperature control
02/13/2003WO2003012551A1 Electron beam processing
02/13/2003WO2003012548A2 System for measuring an optical system, especially an objective
02/13/2003WO2003012547A1 Composition having permitivity being radiation-sensitively changeable and method for forming permitivity pattern
02/13/2003WO2003012529A2 Objective, particularly a projection objective for use in semiconductor lithography
02/13/2003WO2003012499A2 Semiconductor multi-path wave guide to concurrently route signals
02/13/2003WO2003012359A1 Perimeter seal for backside cooling of substrates
02/13/2003WO2003012178A1 Crystal stacking substrate, crystal layer, device, and their manufacturing method
02/13/2003WO2003012169A1 Metal surface protection film forming agent and application thereof
02/13/2003WO2003012165A1 Gas treating device and gas treating method
02/13/2003WO2003012164A1 Method for the production of coated substrates
02/13/2003WO2003012163A2 Integral blocks, chemical delivery systems and methods for delivering an ultrapure chemical
02/13/2003WO2003011952A1 Polyparaxylylene film, production method therefor and semiconductor device
02/13/2003WO2003011951A1 Organic polymer film, method for producing the same and semiconductor device using the same
02/13/2003WO2003011945A2 Siloxane resins
02/13/2003WO2003011714A1 Disk carrier
02/13/2003WO2003011595A2 Laser spectral engineering for lithographic process
02/13/2003WO2003011523A1 Multiport polishing fluid delivery system
02/13/2003WO2003011522A1 Method for fabricating polishing pad using laser beam and mask
02/13/2003WO2003011521A2 Electro-chemical polishing apparatus
02/13/2003WO2003011520A1 Method for fabricating chemical mechanical polishing pad using laser
02/13/2003WO2003011518A1 Cmp system and method for efficiently processing semiconductor wafers
02/13/2003WO2003011479A1 Selective electroless deposition and interconnects made therefrom
02/13/2003WO2002095800A3 A method for making a micromechanical device by removing a sacrificial layer with multiple sequential etchants
02/13/2003WO2002093625B1 Method of making a flexible substrate containing self-assembling microstructures
02/13/2003WO2002082503A3 Multi-thickness silicide device
02/13/2003WO2002079549A3 Preparation of 157nm transmitting barium fluoride crystals with permeable graphite
02/13/2003WO2002078090A3 Field-effect transistor structure and method of manufacture
02/13/2003WO2002078056A3 Passivation layer for molecular electronic device fabrication
02/13/2003WO2002077484A8 Method and device for vibration control
02/13/2003WO2002073660A3 System and method to control radial delta temperature
02/13/2003WO2002071458A3 Growth of compound semiconductor structures on patterned oxide films
02/13/2003WO2002065538A3 Post chemical-mechanical planarization (cmp) cleaning composition
02/13/2003WO2002065528A3 Use of ammonia for etching organic low-k dielectrics
02/13/2003WO2002062680A3 Conveyorized storage and transportation system
02/13/2003WO2002059899A3 Mram bit line word line architecture
02/13/2003WO2002057506A3 Low contamination plasma chamber components and methods for making the same
02/13/2003WO2002054494A3 Integrated semiconductor memory arrangement and a method for producing the same
02/13/2003WO2002054484A3 Metal ion diffusion barrier layers
02/13/2003WO2002052626A3 Method for producing a microelectronic component and component produced according to said method
02/13/2003WO2002050882A3 Copper alloys for interconnections having improved electromigration characteristics and methods of making same
02/13/2003WO2002047151A3 Method for making a semiconductor chip using an integrated rigidity layer
02/13/2003WO2002047144A3 Patterned buried insulator
02/13/2003WO2002045476A3 Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
02/13/2003WO2002045132A3 Low defect density, thin-layer, soi substrates
02/13/2003WO2002044293A3 Method and composition for the removal of residual materials during substrate planarization
02/13/2003WO2002043140A3 Imaging layer as hard mask for organic low-k materials
02/13/2003WO2002039480A3 Ion beam deposition targets having a replaceable insert
02/13/2003WO2002039463A9 Methods and system for attaching substrates using solder structures
02/13/2003WO2002039099A3 Measurement of surface defects
02/13/2003WO2002037570A9 Semiconductor device and method of making same
02/13/2003WO2002036847A3 Sputtering target
02/13/2003WO2002036301A3 Installation docking pedestal for_wafer fabrication equipment
02/13/2003WO2002029858A3 Deep trench etching method to reduce/eliminate formation of black silicon
02/13/2003WO2002025723A3 Lateral shift measurement using an optical technique
02/13/2003WO2002009150A3 Semiconductor structure for use with high-frequency signals
02/13/2003WO2001073617A3 Method for the surface optimisation of components in integrated circuits
02/13/2003US20030033581 Method of layout compaction
02/13/2003US20030033579 Method to improve isolation layer fill in a DRAM array area
02/13/2003US20030033130 Method and system for simulating processing condition of sample
02/13/2003US20030033120 Method and system for in-line monitoring process performance using measurable equipment signals
02/13/2003US20030033116 Method for characterizing the performance of an electrostatic chuck
02/13/2003US20030033101 Sequential unique marking
02/13/2003US20030033046 Method and system for manufacturing semiconductor devices
02/13/2003US20030033043 Method to reduce lot-to-lot variation of array threshold voltage in a DRAM device
02/13/2003US20030033034 Component mounting apparatus and component mounting method, and recognition apparatus for component mount panel, component mounting apparatus for liquid crystal panel, and component mounting method for liquid crystal panel
02/13/2003US20030032567 Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials
02/13/2003US20030032380 Polishing media stabilizer
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