Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2003
02/13/2003US20030031800 Method and system for spraying a viscous material on a wafer
02/13/2003US20030031794 Method of forming titanium film by CVD
02/13/2003US20030031793 Substrate is subjected to one or more reaction cycles of an organometallic gas precursor and an oxidizing gas to the heated substrate such as semiconductor wafer
02/13/2003US20030031791 Exposing high-purity copper to a plasma of a chlorine gas to etch the high-purity copper, and form copper chlorides, transporting said copper chlorides onto the surface of a substrate to be coated; efficiency, purity
02/13/2003US20030031790 Method of forming highly adhesive copper thin films on metal nitride substrates via CVD
02/13/2003US20030031789 Organosiloxanes
02/13/2003US20030031787 Chemisorption; for production of integrated circuits and semiconductor wafers
02/13/2003US20030031549 Alignment of semiconductor wafers and other articles
02/13/2003US20030031545 System and method for reticle protection and transport
02/13/2003US20030031544 Wafer blade for wafer pick-up from a water tank and method for using
02/13/2003US20030031539 Apparatus for storing and moving a cassette
02/13/2003US20030031538 Datum plate for use in installations of substrate handling systems
02/13/2003US20030031537 Load port, wafer processing apparatus, and method of replacing atmosphere
02/13/2003US20030031535 Wafer positioning check in vertical semiconductor furnaces
02/13/2003US20030031214 Laser irradiation apparatus, laser irradiation method, and method of manufacturing a semiconductor device
02/13/2003US20030031086 Slurry mixing feeder and slurry mixing and feeding method
02/13/2003US20030031078 Synchronous dynamic random access memory
02/13/2003US20030031074 One-time programmable memory using fuse/anti-fuse and vertically oriented fuse unit memory cells
02/13/2003US20030031071 Sense amplifier control circuit of semiconductor memory device
02/13/2003US20030031070 Sense amplifier and architecture for open digit arrays
02/13/2003US20030031068 Non-volatile memory cell array having discontinuous source and drain diffusions contacted by continuous bit line conductors and methods of forming
02/13/2003US20030031063 Semiconductor integrated circuit and electronic apparatus including the same
02/13/2003US20030031059 Semiconductor integrated circuit device
02/13/2003US20030031054 Semiconductor memory device
02/13/2003US20030031047 One-time programmable unit memory cell based on vertically oriented fuse and diode and one-time programmable memory using the same
02/13/2003US20030031046 Thin film magnetic memory device realizing both high-speed data reading operation and stable operation
02/13/2003US20030031045 Magnetic random access memory including memory cell unit and reference cell unit
02/13/2003US20030031044 Semiconductor memory device
02/13/2003US20030031040 Semiconductor storage device having high soft-error immunity
02/13/2003US20030031017 Illumination system, projection exposure apparatus and device manufacturing method
02/13/2003US20030030967 Dielectric capacitor and production process and semiconductor device
02/13/2003US20030030961 Method and apparatus for chucking a substrate
02/13/2003US20030030960 Semiconductor wafer processing apparatus and method
02/13/2003US20030030853 Method and apparatus for picking up 2D image of an object to be sensed
02/13/2003US20030030821 Bonding apparatus
02/13/2003US20030030794 Confocal 3D inspection system and process
02/13/2003US20030030781 Imaging apparatus
02/13/2003US20030030779 Anti-vibration system for exposure apparatus
02/13/2003US20030030768 Transflective type LCD and method manufacturing the same
02/13/2003US20030030689 Method of forming film pattern, device for forming film pattern, conductive film wiring, electro-optical device, electronic device, and non-contact card medium
02/13/2003US20030030532 Inductor element and integrated circuit employing inductor element
02/13/2003US20030030488 Trench bipolar transistor
02/13/2003US20030030483 Semiconductor device
02/13/2003US20030030482 Semiconductor integrated circuit and reference voltage generating circuit employing it
02/13/2003US20030030456 Method of measuring contact alignment in a semiconductor device including an integrated circuit
02/13/2003US20030030455 Test probe having a sheet body
02/13/2003US20030030445 Method of analyzing an integrated electric circuit, computer program utilizing the method, data carrier including the method, and method for downloading the program
02/13/2003US20030030293 Holding apparatus
02/13/2003US20030030224 Positioning apparatus
02/13/2003US20030030187 Semiconductor chip molding apparatus and method of detecting when a lead frame has been improperly positioned in the same
02/13/2003US20030030154 Resin-sealed type semiconductor device
02/13/2003US20030030153 Bond pad structure comprising multiple bond pads with metal overlap
02/13/2003US20030030148 Low resistivity titanium silicide on heavily doped semiconductor
02/13/2003US20030030147 Low resistivity titanium silicide on heavily doped semiconductor
02/13/2003US20030030146 Semiconductor integrated circuit device
02/13/2003US20030030145 Method of forming a highly integrated non-volatile semiconductor memory device
02/13/2003US20030030144 Metal wiring and method of manufacturing the same, and metal wiring substrate and method of manufacturing the same
02/13/2003US20030030142 Semiconductor device and method of manufacturing the same
02/13/2003US20030030138 Semiconductor package and method for fabricating the same
02/13/2003US20030030137 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
02/13/2003US20030030136 Assembly device and method for assembling an electronic component
02/13/2003US20030030135 Semiconductor device that can have a defective bit found during or after packaging process repaired
02/13/2003US20030030134 Semiconductor device
02/13/2003US20030030133 Semiconductor package and method of fabricating same
02/13/2003US20030030132 Semiconductor chip package and manufacturing method thereof
02/13/2003US20030030131 Semiconductor package apparatus and method
02/13/2003US20030030130 Semiconductor device with mechanical stress protection during wafer cutting, and manufacturing process thereof
02/13/2003US20030030129 Semiconductor wafer
02/13/2003US20030030127 Bipolar transistor and method of manufacturing same
02/13/2003US20030030126 Bipolar transistor and manufacturing method therefor
02/13/2003US20030030125 Precision high-frequency capacitor on semiconductor substrate
02/13/2003US20030030124 Semiconductor device and process for the same
02/13/2003US20030030123 Semiconductor memory device equipped with memory transistor and peripheral transistor and method of manufacturing the same
02/13/2003US20030030122 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
02/13/2003US20030030121 Structure of trench isolation and a method of forming the same
02/13/2003US20030030120 Diode and method for manufacturing the same
02/13/2003US20030030119 Structure and method for improved piezo electric coupled component integrated devices
02/13/2003US20030030117 Semiconductor device
02/13/2003US20030030116 Bipolar ESD protection structure
02/13/2003US20030030115 Semiconductor device and manufacturing method thereof
02/13/2003US20030030114 Semiconductor device and method for fabricating the same
02/13/2003US20030030113 Semiconductor device
02/13/2003US20030030112 Semiconductor device having pocket and manufacture thereof
02/13/2003US20030030111 Methods of forming integrated circuit devices having gate oxide layers with different thicknesses and integrated circuit devices formed thereby
02/13/2003US20030030110 Semiconductor device and method of manufacturing the same
02/13/2003US20030030109 Semiconductor device
02/13/2003US20030030108 Thin film transistor and method for manufacturing the same
02/13/2003US20030030107 Globally planarized backend compatible thin film resistor contact/interconnect process
02/13/2003US20030030106 Local interconnect junction on insulator (joi) structure
02/13/2003US20030030104 Trench MIS device with graduated gate oxide layer
02/13/2003US20030030103 Structure of semiconductor device and method for manufacturing the same
02/13/2003US20030030102 MOS field effect transistor configuration
02/13/2003US20030030101 Semiconductor device and manufacturing method thereof
02/13/2003US20030030100 Non-volatile memory device and method for fabricating the same
02/13/2003US20030030098 Self-aligned floating gate flash cell system and method
02/13/2003US20030030097 Non-volatile memory device having floating trap type memory cell and method of forming the same
02/13/2003US20030030095 Semiconductor device and method of manufacturing the same
02/13/2003US20030030094 Semiconductor component and fabrication method
02/13/2003US20030030093 Capacitor forming methods and capacitor constructions
02/13/2003US20030030092 Trench MIS device with reduced gate-to-drain capacitance
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