Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2003
02/04/2003US6514822 Method and system for reducing thinning of field isolation structures in a flash memory device
02/04/2003US6514821 Method for planarizing dielectric layer of flash memory
02/04/2003US6514819 High capacity stacked DRAM device and process for making a smaller geometry
02/04/2003US6514818 Nonvolatile ferroelectric memory without a separate cell plate line and method of manufacturing the same
02/04/2003US6514817 Method of forming shallow trench
02/04/2003US6514816 Method of fabricating a self-aligned shallow trench isolation
02/04/2003US6514815 Method for fabricating polysilicon capacitor
02/04/2003US6514814 Capacitor containing amorphous and polycrystalline ferroelectric films and fabrication method therefor, and method for forming amorphous ferroelectric film
02/04/2003US6514813 Method of fabricating a semiconductor device
02/04/2003US6514812 Structure and manufacturing method of semiconductor device having uneven surface at memory cell capacitor part
02/04/2003US6514811 Method for memory masking for periphery salicidation of active regions
02/04/2003US6514810 Buried channel PMOS transistor in dual gate CMOS with reduced masking steps
02/04/2003US6514809 SOI field effect transistors with body contacts formed by selective etch and fill
02/04/2003US6514808 Transistor having a high K dielectric and short gate length and method therefor
02/04/2003US6514807 Method for fabricating semiconductor device applied system on chip
02/04/2003US6514805 Trench sidewall profile for device isolation
02/04/2003US6514804 Thin-film transistor and fabrication method thereof
02/04/2003US6514803 Process for making an amorphous silicon thin film semiconductor device
02/04/2003US6514802 Method of providing a frontside contact to a substrate of SOI device
02/04/2003US6514801 Method for manufacturing thin-film transistor
02/04/2003US6514800 When channel etching for removing predetermined portions of an ohmic layer and a diffusion layer thereof by plasma etching is to be performed, a surface of a semiconductor layer of a channel portion is formed to have predetermined steps
02/04/2003US6514799 Method for substrate noise distribution
02/04/2003US6514798 Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages
02/04/2003US6514797 Underfill applications using film technology
02/04/2003US6514796 Fixing by selectively heating and press-contacting a dicing tape of separated integrated circuit chips to an oppositely facing substrate with a wire attached to one of the chips on the tape; thinness; cards; nonbreaking; noncracking; strength
02/04/2003US6514795 Packaged stacked semiconductor die and method of preparing same
02/04/2003US6514790 Method for handling a plurality of circuit chips
02/04/2003US6514788 Method for manufacturing contacts for a Chalcogenide memory device
02/04/2003US6514783 Method for determining a layout for a flip-chip transition interface structure
02/04/2003US6514780 Method for manufacturing an integrated circuit having a particular functionality required by a user of the circuit and having first structures to produce the particular functionality and second structures
02/04/2003US6514779 Large area silicon carbide devices and manufacturing methods therefor
02/04/2003US6514778 Method for measuring effective gate channel length during C-V method
02/04/2003US6514776 Instrument and method for measuring contamination of wafer surface
02/04/2003US6514676 Method for forming micropattern of resist
02/04/2003US6514674 Method of forming an optical element
02/04/2003US6514673 Rule to determine CMP polish time
02/04/2003US6514671 Interconnect line formed by dual damascene using dielectric layers having dissimilar etching characteristics
02/04/2003US6514667 Lithography structure
02/04/2003US6514666 Photoresist monomers, polymers thereof and photoresist compositions containing it
02/04/2003US6514665 Additives for improving post exposure delay stability of photoresist
02/04/2003US6514664 Radiation sensitive compositions containing image quality and profile enhancement additives
02/04/2003US6514663 Bottom resist
02/04/2003US6514658 Polyimide or precursor thereof soluble in alkaline solution, a photosensitive acid generator, and a compound having a phenolic hydroxyl group; positive-type, heat resistance
02/04/2003US6514642 Phase shift mask and method of manufacture
02/04/2003US6514582 Quartz glass member for use in dry etching and dry etching system equipped with the same
02/04/2003US6514570 Solution processing apparatus and method
02/04/2003US6514566 Ion processing element with composite media
02/04/2003US6514564 Dynamic blending gas delivery system and method
02/04/2003US6514560 Blend of thermosetting resin and conductive particles
02/04/2003US6514425 Forming patterns on silicon dioxide films using plasma gases comprising acyclic fluoroethers, having short half-life; pollution control; integrated circuits
02/04/2003US6514424 Using plates which rotate in opposite directions and are covered with polishing cloth, so that at least 2 mu m of semiconductor material is removed; accuracy
02/04/2003US6514423 Method for wafer processing
02/04/2003US6514390 Induction coupled plasma (ICP) generators, for coating semiconductor wafers by coupling electromagnetic energy and magnetically shielding targets; noncontamination
02/04/2003US6514389 Method of processing a workpiece
02/04/2003US6514378 Method for improving uniformity and reducing etch rate variation of etching polysilicon
02/04/2003US6514377 Apparatus for and method of processing an object to be processed
02/04/2003US6514376 Thermal control apparatus for inductively coupled RF plasma reactor having an overhead solenoidal antenna
02/04/2003US6514375 Dry etching endpoint detection system
02/04/2003US6514355 Preventing damage to electronics, by detecting malfunctions associated with power sources, robots, computer software or hardware, then draining the chemical reactor and rinsing with water
02/04/2003US6514352 Cleaning method using an oxidizing agent, chelating agent and fluorine compound
02/04/2003US6514348 Substrate processing apparatus
02/04/2003US6514347 Apparatus and method for plasma treatment
02/04/2003US6514345 Processing apparatus and managing method of operational condition parameter thereof
02/04/2003US6514344 Reduced slide resistance to restrain the vibration when discharge nozzle is moved
02/04/2003US6514343 Coating apparatus
02/04/2003US6514126 Pad conditioner coupling and end effector for a chemical mechanical planarization system and method therefor
02/04/2003US6514124 Carrier head for chemical mechanical polishing a substrate
02/04/2003US6514122 System for manufacturing semiconductor device utilizing photolithography technique
02/04/2003US6514073 Resist processing method and resist processing apparatus
02/04/2003US6514033 Mechanical gripper for wafer handling robots
02/04/2003US6514032 Substrate transfer system
02/04/2003US6513848 Hydraulically actuated wafer clamp
02/04/2003US6513796 Wafer chuck having a removable insert
02/04/2003US6513694 Semiconductor wafer cleaving method and apparatus
02/04/2003US6513654 SMIF container including an electrostatic dissipative reticle support structure
02/04/2003US6513564 Nozzle for cleaving substrates
02/04/2003US6513540 System and method for using bent pipes in high-purity fluid handling systems
02/04/2003US6513538 Containing hydrogen peroxide, chelate compound, hydrogen and fluorine gases
02/04/2003US6513537 Substrate processing method and substrate processing apparatus
02/04/2003US6513452 Adjusting DC bias voltage in plasma chamber
02/04/2003US6513389 Technique for determining curvatures of embedded line features on substrates
02/04/2003US6513374 Apparatus to quantify the adhesion of film
02/04/2003US6513250 Micro positioning device with shared actuators
02/04/2003US6513239 Providing liquid retainer surrounding heat exchanger's face and compliant member which forms seal between heat exchanger and retainer; dispensed liquid which falls from face is retained and kept from leaking until removal
02/04/2003US6513236 Method of manufacturing bump-component mounted body and device for manufacturing the same
02/04/2003US6513214 Method of producing plural device chips from a thin plate of a pyroelectric material
02/04/2003CA2279229C Method and apparatus to produce large inductive plasma for plasma processing
02/04/2003CA2240701C Apparatus and method of separating sample and substrate fabrication method
01/2003
01/30/2003WO2003009421A1 Apparatus for effecting transfer of electromagnetic energy
01/30/2003WO2003009404A2 Transistor and method for making a transistor on a sige/soi substrate
01/30/2003WO2003009399A1 Gallium nitride-based led and a production method therefor
01/30/2003WO2003009398A2 Structure and method for fabricating an optical bus
01/30/2003WO2003009396A2 Algaas or ingap low turn-on voltage gaas-based heterojunction bipolar transistor
01/30/2003WO2003009395A2 Multijunction solar cell
01/30/2003WO2003009392A1 Semiconductor device and method for fabricating the same and semiconductor device application system
01/30/2003WO2003009391A1 Trench-gate semiconductor device and its manufacturing method
01/30/2003WO2003009390A1 Mis type transistor and its manufacturing method
01/30/2003WO2003009388A2 Bipolar transistors and high electron mobility transistors
01/30/2003WO2003009387A1 Semiconductor structure for edge mounting applications
01/30/2003WO2003009386A1 Method for producing bonding wafer