Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2003
02/13/2003US20030030091 Dynamic random access memory trench capacitors
02/13/2003US20030030090 Semiconductor memory and method of manufacturing the same
02/13/2003US20030030089 Method of fabricating a semiconductor device with a trench isolation structure and semiconductor device
02/13/2003US20030030088 Semiconductor device with copper wiring connected to storage capacitor
02/13/2003US20030030087 Semiconductor memory device
02/13/2003US20030030085 Semiconductor memory device and method of fabricating the same
02/13/2003US20030030084 Fabricating an embedded ferroelectric memory cell
02/13/2003US20030030082 Method of forming an ultra thin dielectric film and a semiconductor device incorporating the same
02/13/2003US20030030081 Semiconductor device
02/13/2003US20030030080 Polysilicon TFT with a self-aligned LDD structure
02/13/2003US20030030079 Damascene FeRAM cell structure
02/13/2003US20030030078 MOS transistor having aluminum nitrade gate structure and method of manufacturing same
02/13/2003US20030030077 Semiconductor device and method for manufacturing the same
02/13/2003US20030030076 Semiconductor device having shallow trench isolation structure and manufacturing method thereof
02/13/2003US20030030075 Semiconductor device and method of arranging transistors for forming TEG
02/13/2003US20030030074 TFT mask ROM and method for making same
02/13/2003US20030030073 Semiconductor integrated circuit device
02/13/2003US20030030070 Bipolar transistor
02/13/2003US20030030069 Apparatus and method for fabricating a high reverse voltage semiconductor device
02/13/2003US20030030068 Nitride-based semiconductor element
02/13/2003US20030030058 Semiconductor device
02/13/2003US20030030057 Silicon carbide deposition for use as a low-dielectric constant anti-reflective coating
02/13/2003US20030030056 Voltage and current reference circuits using different substrate-type components
02/13/2003US20030030054 Electrostatic discharge protection for pixellated electronic device
02/13/2003US20030030053 Nitride semiconductor device and fabrication method thereof
02/13/2003US20030030052 Crystalline silicon thin film semiconductor device, crystalline silicon thin film photovoltaic device, and process for producing crystalline silicon thin film semiconductor device
02/13/2003US20030030050 Apparatus and method of inspecting semiconductor wafer
02/13/2003US20030030016 Reticles and rapid reticle-evaluation methods for use in charged-particle-beam microlithography
02/13/2003US20030030013 Apparatus for implanting an ion on a target and method for the same
02/13/2003US20030029912 Lithography rework analysis method and system
02/13/2003US20030029908 Bumps made with adhesive film instead of gold plating
02/13/2003US20030029859 Lamphead for a rapid thermal processing chamber
02/13/2003US20030029841 Method and apparatus for polishing metal and dielectric substrates
02/13/2003US20030029839 Method of reducing wet etch rate of silicon nitride
02/13/2003US20030029838 Mehtod for detecting removal of organic material from a semiconductor device in a manufacturing process
02/13/2003US20030029837 Dielectric etch plasma chamber utilizing a magnetic filter to optimize plasma characteristics
02/13/2003US20030029835 Method of etching organic antireflection coating (ARC) layers
02/13/2003US20030029834 Method and apparatus for monitoring and controlling wafer fabrication process
02/13/2003US20030029833 High speed photoresist stripping chamber
02/13/2003US20030029832 Method for forming large integration and ultra-fine lines on a substrate
02/13/2003US20030029772 Disk carrier
02/13/2003US20030029765 Composite kinematic coupling
02/13/2003US20030029715 An Apparatus For Annealing Substrates In Physical Vapor Deposition Systems
02/13/2003US20030029696 Work conveying system
02/13/2003US20030029610 Thermally conductive chuck for vacuum processor
02/13/2003US20030029572 Semiconductor wafer processing apparatus and method
02/13/2003US20030029571 Self-centering wafer support system
02/13/2003US20030029570 Wafer holder, wafer support member, wafer holding device, and heat treating furnance
02/13/2003US20030029569 Substrate processing apparatus
02/13/2003US20030029568 Pedestal with integral shield
02/13/2003US20030029566 Remote exposure of workpieces using a plasma
02/13/2003US20030029565 Method and apparatus for processing semiconductor substrates
02/13/2003US20030029564 Pedestal with integral shield
02/13/2003US20030029559 Adhesive for connecting electrodes and adhesion methods with the use of the same
02/13/2003US20030029556 Adhesive-coated electronic parts on a connection sheet
02/13/2003US20030029544 To fix or protect a work piece during processing of the work piece temporarily held on a hard plate
02/13/2003US20030029543 Ultrasonic bonding method
02/13/2003US20030029540 Method for the manufacture of a smart label inlet web, and a smart label inlet web
02/13/2003US20030029480 Device for treating substrates
02/13/2003US20030029479 Substrate cleaning apparatus and method
02/13/2003US20030029383 Dynamic control of wafer processing paths in semiconductor manufacturing processes
02/13/2003US20030029375 Silicon single crystal wafer fabricating method and silicon single crystal wafer
02/13/2003US20030029220 Surface inspection system
02/13/2003US20030029212 Method and apparatus for processing thin metal layers
02/13/2003US20030029035 Wiring forming method
02/13/2003US20030029033 Apparatus and method for mounting electronic parts
02/13/2003US20030029032 Apparatus and method for mounting electronic parts
02/13/2003US20030029029 Pick-up tool
02/13/2003DE20215637U1 Electronic component used as a Hall sensor has a system support with a platform for the electronic component, and a housing surrounding the component and the platform
02/13/2003DE10132136C1 Halbleiterbauelement mit Ladungskompensationsstruktur sowie zugehöriges Herstellungsverfahren A semiconductor device having charge compensation structure and associated production method
02/13/2003DE10130786C1 Laser-Programmierung integrierter Schaltkreise sowie zugehöriger integrierter Schaltkreis Laser-programming of integrated circuits and associated integrated circuit
02/13/2003DE10128326C1 Fabrication of trench capacitor for memory cell, by forming trench in substrate, providing lower capacitor electrode adjoining wall of trench in lower trench region, and providing storage dielectric and upper capacitor electrode
02/13/2003DE10127350C1 Halbleiterstruktur mit vergrabenen Leiterbahnen sowie Verfahren zur elektrischen Kontaktierung der vergrabenen Leiterbahnen Semiconductor structure with buried conductor tracks and to methods for making electrical contact with the buried conductor tracks
02/13/2003CA2424557A1 Radiation sensitive dielectric constant changing composition and dielectric constant changing method
02/12/2003EP1283613A1 Receiver and inverse-spreading code generating method
02/12/2003EP1283551A2 Angular substrates
02/12/2003EP1283549A1 Semiconductor device with mechanical stress protection during wafer cutting, and manufacturing process thereof
02/12/2003EP1283548A1 Sealing resin for flip-flop mounting
02/12/2003EP1283547A1 Packaging process for semiconductor package
02/12/2003EP1283546A1 Method for detecting removal of organic material from a semiconductor device in a manufacturing process
02/12/2003EP1283545A2 Semiconductor device having ferroelectric substance capacitor
02/12/2003EP1283544A2 Reaction chamber for processing semiconducter wafers
02/12/2003EP1283446A2 Workpiece stage of a resist curing device
02/12/2003EP1283282A1 A method for Cu electroplating in integrated circuit fabrication
02/12/2003EP1283279A2 Modular injector and exhaust assembly
02/12/2003EP1283250A1 Polishing composition and polishing method employing it
02/12/2003EP1283089A2 Wafer holding plate for wafer grinding apparatus and method for manufacturing the same
02/12/2003EP1283085A1 Method and apparatus for thermal assembling of connecting areas of two substrates
02/12/2003EP1282922A1 Encapsulated microelectronic devices
02/12/2003EP1282918A1 Charge carrier extracting transistor
02/12/2003EP1282917A1 Vertical transistor
02/12/2003EP1282915A2 Uniform bitline strapping of a non-volatile memory cell
02/12/2003EP1282914A2 Semiconductor device with shallow trench isolation (sti) sidewall implant
02/12/2003EP1282913A2 Wireless radio frequency testing method of integrated circuits and wafers
02/12/2003EP1282912A1 Adjusting defect profiles in crystal or crystalline structures
02/12/2003EP1282911A1 Process for producing integrated circuits
02/12/2003EP1282902A2 Magnetic multilayer structure with improved magnetic field range
02/12/2003EP1282901A2 Lead zirconate titanate dielectric thin film composites on metallic foils
02/12/2003EP1282660A1 Rheology-controlled epoxy-based compositions
02/12/2003EP1282486A1 Self teaching robotic wafer handling system
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