Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2003
02/11/2003US6517641 Apparatus and process for collecting trace metals from wafers
02/11/2003US6517637 Method for cleaning wafers with ionized water
02/11/2003US6517636 Method for reducing particle contamination during the wet processing of semiconductor substrates
02/11/2003US6517635 For solar cells, liquid crytals
02/11/2003US6517616 Solvated ruthenium precursors for direct liquid injection of ruthenium and ruthenium oxide
02/11/2003US6517594 Air management system and method for chemical containment and contamination reduction in a semiconductor manufacturing facility
02/11/2003US6517592 For semiconductor processing chamber comprising a conduit for exhaust gases having at least one heater and one temperature sensor attached thereto and a cold trap connected to conduit
02/11/2003US6517421 Polishing head of a chemical and mechanical polishing apparatus for polishing a wafer
02/11/2003US6517420 Wafer surface machining apparatus
02/11/2003US6517418 Method of transporting a semiconductor wafer in a wafer polishing system
02/11/2003US6517417 Polishing pad with a transparent portion
02/11/2003US6517416 Chemical mechanical polisher including a pad conditioner and a method of manufacturing an integrated circuit using the chemical mechanical polisher
02/11/2003US6517415 Carrier head with a substrate detection mechanism for a chemical mechanical polishing system
02/11/2003US6517412 Method of controlling wafer polishing time using sample-skip algorithm and wafer polishing using the same
02/11/2003US6517362 Spiral contactor, semiconductor device inspecting apparatus and electronic part using same, and method of manufacturing the same
02/11/2003US6517304 Method for transporting substrates and a semiconductor manufacturing apparatus using the method
02/11/2003US6517303 Substrate transfer shuttle
02/11/2003US6517235 Using refractory metal silicidation phase transition temperature points to control and/or calibrate RTP low temperature operation
02/11/2003US6517130 Self positioning vacuum chuck
02/11/2003US6516994 Wire bonding apparatus for connecting semiconductor devices
02/11/2003US6516991 Wire bonding apparatus
02/11/2003US6516990 Apparatus for making wire connections
02/11/2003US6516867 Heat sink manufacturing device and manufacturing method
02/11/2003US6516816 Spin-rinse-dryer
02/11/2003US6516815 Edge bead removal/spin rinse dry (EBR/SRD) module
02/11/2003US6516743 Method and apparatus diffusing zinc into groups III-V compound semiconductor crystals
02/11/2003US6516742 Apparatus for improved low pressure inductively coupled high density plasma reactor
02/11/2003US6516517 Flexible bearing plate conforms to surface while adhesive hardens; generating pressure difference
02/11/2003US6516515 Semiconductor integrated circuit
02/06/2003WO2003010881A1 Oscillator
02/06/2003WO2003010837A1 Electronic device using carbon nanotubes
02/06/2003WO2003010834A2 Microelectronic piezoelectric structure
02/06/2003WO2003010833A2 Flip chip bonding of light emitting devices and light emitting devices suitable for flip-chip bonding
02/06/2003WO2003010828A1 Method for manufacturing thin-film structure
02/06/2003WO2003010827A2 Trench-gate semiconductor devices, and their manufacture
02/06/2003WO2003010826A2 Method for producing a vertical transistor in a trench
02/06/2003WO2003010825A1 Transfer method, method of manufacturing thin film element, method of manufacturing integrated circuit, circuit substrate and method of manufacturing the circuit substrate, electro-optic device and method of manufacturing the electro-optic device, and ic card and electronic equipmen
02/06/2003WO2003010824A1 Semiconductor device
02/06/2003WO2003010823A2 Semiconductor structures, devices and method of fabrication
02/06/2003WO2003010822A1 Semiconductor element and production method for semiconductor element
02/06/2003WO2003010821A1 Semiconductor integrated circuit
02/06/2003WO2003010820A1 Analog/digital hybrid integrated circuit
02/06/2003WO2003010819A1 Analog/digital mixed integrated circuit
02/06/2003WO2003010818A1 Integrated circuit
02/06/2003WO2003010815A2 Method of fabricating an alloy film on a face of a heat exchanger for an integrated circuit
02/06/2003WO2003010814A1 Production method for semiconductor device
02/06/2003WO2003010812A1 Manufacture of semiconductor devices with schottky barriers
02/06/2003WO2003010811A1 Method of planarizing a semiconductor wafer
02/06/2003WO2003010810A1 Method of forming an isolation layer and method of manufacturing a trench capacitor
02/06/2003WO2003010809A1 Plasma treating device and substrate mounting table
02/06/2003WO2003010808A1 Method and apparatus for supplying tetrafluoroethylene gas to dry etching apparatus
02/06/2003WO2003010807A1 Method of manufacturing semiconductor integrated circuit device
02/06/2003WO2003010806A2 Semiconductor substrate bonding by mass transport growth fusion
02/06/2003WO2003010805A2 Complementary iii-v structures and devices
02/06/2003WO2003010804A1 Method of producing semiconductor thin film, method of producing semiconductor device, semiconductor device, integrated circuit, electrooptical device and electronic apparatus
02/06/2003WO2003010801A1 Method and device for development
02/06/2003WO2003010800A1 Processing apparatus and processing method
02/06/2003WO2003010799A2 Plasma ashing process
02/06/2003WO2003010795A2 Optical communication device within a semiconductor structure
02/06/2003WO2003010792A1 Method of measuring the performance of a scanning electron microscope
02/06/2003WO2003010772A1 Non orthogonal mram device
02/06/2003WO2003010771A1 Memory system with independently accessible memory subsystems
02/06/2003WO2003010746A1 Device comprising an array of pixels allowing storage of data
02/06/2003WO2003010606A1 Fluoropolymer-coated photomasks for photolithography
02/06/2003WO2003010604A1 Method for printing a near-field photoinduced stable structure and optical fibre tip therefor
02/06/2003WO2003010602A1 Photosensitive resin composition
02/06/2003WO2003010601A1 Method of preparing optically imaged high performance photomasks
02/06/2003WO2003010598A1 Removable optical pellicle
02/06/2003WO2003010550A2 Integrated testing of serializer/deserializer in fpga
02/06/2003WO2003010366A1 Apparatus for plating treatment
02/06/2003WO2003010365A1 Plating method and plating apparatus
02/06/2003WO2003010355A1 Method for cvd of bpsg films
02/06/2003WO2003010246A1 Siloxane resins
02/06/2003WO2003010086A2 Microelectromechanical system devices integrated with semiconductor structures
02/06/2003WO2003010070A1 A container
02/06/2003WO2003010069A1 Cover body for sheet supporting container and sheet supporting container
02/06/2003WO2003009932A1 High-pressure treatment apparatus and high-pressure treatment method
02/06/2003WO2002095820A3 Hollow structure in an integrated circuit
02/06/2003WO2002089180A3 Method of enhanced oxidation of mos transistor gate corners
02/06/2003WO2002084710A3 Systems and methods for epitaxially depositing films
02/06/2003WO2002078060A3 Damascene processing using dielectric barrier films
02/06/2003WO2002076641A3 Cleaning apparatus and cleaning method
02/06/2003WO2002074686A3 A method and device for protecting micro electromechanical systems structures during dicing of a wafer
02/06/2003WO2002073694A3 Memory cell comprising a trench and method for production thereof
02/06/2003WO2002071480A3 Electronic package with improved cap design for reduced interfacial stresses
02/06/2003WO2002071452A3 Method for patterning silicides in the submicrometer range and components so produced
02/06/2003WO2002069383A3 Method of forming a notched silicon-containing gate structure
02/06/2003WO2002069380A3 Atomically thin highly resistive barrier layer in a copper via
02/06/2003WO2002063670A3 Method for removing copper from a wafer edge
02/06/2003WO2002059937A3 Process for etching buried cavities within silicon wafers
02/06/2003WO2002059936A3 Resistive heaters and uses thereof
02/06/2003WO2002057514A3 Method and apparatus for electrodeposition or etching of uniform film with minimal edge exclusion on substrate
02/06/2003WO2002054486A3 Self-passivating cu laser fuse
02/06/2003WO2002052642A3 Method for eliminating reaction between photoresist and organosilicate glass
02/06/2003WO2002049107A9 Method for stacking semiconductor die within an implanted medical device
02/06/2003WO2002045142A9 Copper alloy interconnections for integrated circuits and methods of making same
02/06/2003WO2002045140A3 Semiconductor structures having a compliant substrate
02/06/2003WO2002029887A3 One-step etch processes for dual damascene metallization
02/06/2003WO2002025729A3 Control of separation between gate and storage node in vertical dram
02/06/2003WO2002021580A3 Portable enclosure for semiconductor processing
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