Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2003
02/11/2003US6518678 Apparatus and method for reducing interposer compression during molding process
02/11/2003US6518677 Semiconductor flip-chip package and method for the fabrication thereof
02/11/2003US6518676 Metal interconnections and active matrix substrate using the same
02/11/2003US6518675 Wafer level package and method for manufacturing the same
02/11/2003US6518674 For use in test and burn-in, and subsequent removal without damaging the solder balls, by using first and second volumes of fusible material with melting points such that first volume is not melted when first and second are joined
02/11/2003US6518671 An etch-stop layer is selectively provided between layers of a multiple-layered circuit in a selective manner so as to allow for outgassing of impurities during subsequent fabrication processes. The etch-stop layer is formed over an underlying
02/11/2003US6518670 Electrically porous on-chip decoupling/shielding layer
02/11/2003US6518669 Semiconductor device including a pad and a method of manufacturing the same
02/11/2003US6518668 Multiple seed layers for metallic interconnects
02/11/2003US6518667 Semiconductor package using micro balls and production method thereof
02/11/2003US6518666 Circuit board reducing a warp and a method of mounting an integrated circuit chip
02/11/2003US6518665 Enhanced underfill adhesion
02/11/2003US6518664 Semiconductor integrated circuit device and manufacturing method of that
02/11/2003US6518662 Method of assembling a semiconductor chip package
02/11/2003US6518654 Packages for semiconductor die
02/11/2003US6518653 Lead frame and semiconductor device
02/11/2003US6518651 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
02/11/2003US6518649 Tape carrier type semiconductor device with gold/gold bonding of leads to bumps
02/11/2003US6518648 Superconductor barrier layer for integrated circuit interconnects
02/11/2003US6518646 Semiconductor device with variable composition low-k inter-layer dielectric and method of making
02/11/2003US6518645 SOI-type semiconductor device and method of forming the same
02/11/2003US6518644 A semiconductor structure and method of processing same including a substrate, a lattice-mismatched first layer deposited on the substrate and annealed at a temperature greater than 100 degrees C. above the deposition temperature,
02/11/2003US6518642 Contact to passive device of a semiconductor circuit device, the passive device being, for example, a resistor, an inductor, a fuse or the like. Adjacent, spaced, elevated, so-called dummy pattern (shoulder) regions are formed under
02/11/2003US6518641 Deep slit isolation with controlled void
02/11/2003US6518636 Semiconductor MISFET
02/11/2003US6518635 Semiconductor device and manufacturing method thereof
02/11/2003US6518634 A method of forming a capacitor and transistor are disclosed. a substrate having a semiconductor material on a firstsurface is provided. A layer of strontium nitride is then deposited over the first surface and a gate electrode formed over the
02/11/2003US6518633 Semiconductor device and method for manufacturing the same
02/11/2003US6518631 Multi-Thickness silicide device formed by succesive spacers
02/11/2003US6518630 Thin film transistor array substrate for liquid crystal display and method for fabricating same
02/11/2003US6518629 Semiconductor device and process for producing the device
02/11/2003US6518628 Integrated CMOS circuit configuration, and production of same
02/11/2003US6518627 Semiconductor device and method of manufacturing the same
02/11/2003US6518626 Method of forming low dielectric silicon oxynitride spacer films highly selective of etchants
02/11/2003US6518625 Semiconductor device
02/11/2003US6518624 Trench-gate power semiconductor device preventing latch-up and method for fabricating the same
02/11/2003US6518623 Semiconductor device having a buried-channel MOS structure
02/11/2003US6518622 Vertical replacement gate (VRG) MOSFET with a conductive layer adjacent a source/drain region and method of manufacture therefor
02/11/2003US6518621 Trench DMOS transistor having reduced punch-through
02/11/2003US6518620 EEPROM memory cell with increased dielectric integrity
02/11/2003US6518619 Virtual-ground, split-gate flash memory cell arrangements and method for producing same
02/11/2003US6518618 Integrated memory cell and method of fabrication
02/11/2003US6518616 Vertical gate top engineering for improved GC and CB process windows
02/11/2003US6518615 Method and structure for high capacitance memory cells
02/11/2003US6518614 Embedded one-time programmable non-volatile memory using prompt shift device
02/11/2003US6518613 A MOS transistor of a memory cell and a bit line connected thereto are disposed on a first surface of a substrate. A capacitor of the memory cell is disposed on a second surface of the substrate, the second surface being opposite to the
02/11/2003US6518612 Semiconductor memory device using hemispherical grain silicon for bottom electrodes
02/11/2003US6518611 Capacitor array structure for semiconductor devices
02/11/2003US6518610 Rhodium-rich oxygen barriers
02/11/2003US6518609 Niobium or vanadium substituted strontium titanate barrier intermediate a silicon underlayer and a functional metal oxide film
02/11/2003US6518608 Semiconductor integrated circuit device with enhanced protection from electrostatic breakdown
02/11/2003US6518606 Semiconductor device permitting electrical measurement of contact alignment error
02/11/2003US6518605 Solid state imaging pickup device and method for manufacturing the same
02/11/2003US6518603 Selective electrochemical process for creating semiconductor nano- and micro-patterns
02/11/2003US6518602 Nitride compound semiconductor light emitting device and method for producing the same
02/11/2003US6518596 Formation of contacts on thin films
02/11/2003US6518594 Semiconductor devices
02/11/2003US6518593 Integrated circuit and method of designing integrated circuit
02/11/2003US6518592 Apparatus, method and pattern for evaluating semiconductor device characteristics
02/11/2003US6518591 Contact monitor, method of forming same and method of analizing contact-, via- and/or trench-forming processes in an integrated circuit
02/11/2003US6518589 Dual mode FET & logic circuit having negative differential resistance mode
02/11/2003US6518588 Magnetic random access memory with thermally stable magnetic tunnel junction cells
02/11/2003US6518571 Through-the-substrate investigation of flip-chip IC's
02/11/2003US6518548 Unifying the temperature of the substrate and capable of shortening the temperature elevation time (temperature lowering time), the substrate temperature control system is equipped with a temperature control plate (heating or cooling
02/11/2003US6518547 A heat treatment apparatus rotating a substrate and irradiating said substrate with light for performing heat treatment, comprising: a lamp group having a plurality of lamps, each irradiating said substrate with light, arranged to
02/11/2003US6518502 Ceramic multilayer circuit boards mounted on a patterned metal support substrate
02/11/2003US6518392 Encapped oligomeric polybenzoxazole, polybenzothiazole, polyamic acid or polyamic acid esters as precursors for dielectric compounds
02/11/2003US6518390 Precursor of a heat resistant resin, heat resistant resin, insulating film and semiconductor device
02/11/2003US6518206 Method for etching an anti-reflective coating
02/11/2003US6518205 Multifunctional reagents for the surface modification of nanoporous silica films
02/11/2003US6518204 Curable organopolysiloxane composition and method of manufacturing semiconductor devices with the use of the aforementioned composition
02/11/2003US6518203 Passivating dielectric layer with activated nitrogen atoms, then forming metal nitride film on the nitrogen passivated dielectric layer
02/11/2003US6518202 Feeding water to the surface of a semiconductor wafer and forming a thin oxide film as a gate insulating film of an transistor
02/11/2003US6518201 Method for fabricating semiconductor integrated circuit device
02/11/2003US6518200 Graded composite layer and method for fabrication thereof
02/11/2003US6518199 Method and system for coating and developing
02/11/2003US6518198 Electroless deposition of doped noble metals and noble metal alloys
02/11/2003US6518197 Method for manufacturing semiconductor device
02/11/2003US6518196 Method of manufacturing semiconductor device
02/11/2003US6518195 Plasma reactor using inductive RF coupling, and processes
02/11/2003US6518194 Intermediate transfer layers for nanoscale pattern transfer and nanostructure formation
02/11/2003US6518193 Substrate processing system
02/11/2003US6518192 Two etchant etch method
02/11/2003US6518191 Method for etching organic film, method for fabricating semiconductor device and pattern formation method
02/11/2003US6518188 Apparatus and methods for chemical-mechanical polishing of semiconductor wafers
02/11/2003US6518186 Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor device
02/11/2003US6518185 Integration scheme for non-feature-size dependent cu-alloy introduction
02/11/2003US6518184 Enhancement of an interconnect
02/11/2003US6518183 Hillock inhibiting method for forming a passivated copper containing conductor layer
02/11/2003US6518181 Conductive material for integrated circuit fabrication
02/11/2003US6518180 Method for fabricating semiconductor device and method for forming mask suitable therefor
02/11/2003US6518179 Method of controlling hillock formation of platinum thin film of semiconductor memory device by ion bombardment
02/11/2003US6518178 Method for forming a field effect transistor having increased breakdown voltage
02/11/2003US6518177 Method of manufacturing a semiconductor device
02/11/2003US6518176 Method of selective formation of a barrier layer for a contact level via
02/11/2003US6518175 Process for reducing critical dimensions of contact holes, vias, and trench structures in integrated circuits
02/11/2003US6518174 Combined resist strip and barrier etch process for dual damascene structures
02/11/2003US6518173 Method for avoiding fluorine contamination of copper interconnects
02/11/2003US6518172 Method for applying uniform pressurized film across wafer
02/11/2003US6518171 Dual damascene process using a low k interlayer for forming vias and trenches