Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2003
01/30/2003US20030020159 Heat-conducting adhesive compound and a method for producing a heat-conducting adhesive compound
01/30/2003US20030020158 Semiconductor device and contactor for inspection
01/30/2003US20030020157 Ceramic and method of manufacturing the same, dielectric capacitor, semiconductor device, and element
01/30/2003US20030020156 Electronic package with optimized lamination process
01/30/2003US20030020155 Chip-on-board module, and method of manufacturing the same
01/30/2003US20030020150 Compliant layer for encapsulated columns
01/30/2003US20030020148 Lead frame and semiconductor device having the same as well as method of resin-molding the same
01/30/2003US20030020147 Method of making leadframe by mechanical processing
01/30/2003US20030020144 Integrated communications apparatus and method
01/30/2003US20030020143 MOS-type semiconductor device and method for making same
01/30/2003US20030020142 Semiconductor die with contoured bottom surface and method for making same
01/30/2003US20030020141 Adapting a semiconductor wafer for planarization
01/30/2003US20030020140 Bipolar transistor including an improved emitter structure for large emitter current free of decrease in direct current amplification factor and design and method therefor
01/30/2003US20030020139 Bipolar transistor and method of fabricating a bipolar transistor
01/30/2003US20030020138 Cell nitride nucleation on insulative layers and reduced corner leakage of container capacitors
01/30/2003US20030020137 Structure and method for fabricating semiconductor inductor and balun structures utilizing the formation of a compliant substrate
01/30/2003US20030020136 Semiconductor device and its manufacturing method
01/30/2003US20030020135 Semiconductor component and method for producing the same
01/30/2003US20030020133 Method concerning a junction barrier schottky diode, such a diode and use thereof
01/30/2003US20030020129 Attachment structure for solid-state imaging device
01/30/2003US20030020128 On chip alpha-particle detector
01/30/2003US20030020127 Monolithically integrated sensing device and method of manufacture
01/30/2003US20030020125 InverseT- gate structure using damascene processing
01/30/2003US20030020124 Stabilization for thin substrates
01/30/2003US20030020123 Non-volatile semiconductor memory device
01/30/2003US20030020122 Methods of forming integrated circuit electrodes and capacitors by wrinkling a layer that includes a noble metal oxide, and integrated circuit electrodes and capacitors fabricated thereby
01/30/2003US20030020121 Semiconductor structure for monolithic switch matrix and method of manufacturing
01/30/2003US20030020120 Mosfet having a low aspect ratio between the gate and the source/drain
01/30/2003US20030020119 Semiconductor device and method of fabricating the same
01/30/2003US20030020118 Semiconductor device and manufacturing method
01/30/2003US20030020117 Silicon on insulator device having trench isolation layer and method for manufacturing the same
01/30/2003US20030020115 Power MOSFET with ultra-deep base and reduced on resistance
01/30/2003US20030020114 Metal-insulator-transition field-effect transistor utilizing a compliant substrate and method for fabricating same
01/30/2003US20030020113 Method of producing rough polysilicon by the use of pulsed plasma chemical vapor deposition and products produced by same
01/30/2003US20030020112 Method of preparing buried LOCOS collar in trench DRAMS
01/30/2003US20030020111 Economic and low thermal budget spacer nitride process
01/30/2003US20030020110 Method of preparing buried locos collar in trench drams
01/30/2003US20030020109 Nonvolatile semiconductor memory device and manufacturing method thereof
01/30/2003US20030020108 Films doped with carbon for use in integrated circuit technology
01/30/2003US20030020107 Structure and method for fabricating semiconductor capacitor structures utilizing the formation of a compliant structure
01/30/2003US20030020106 Semiconductor processing methods of forming transistors, semiconductor processing methods of forming dynamic random access memory circuitry, and related integrated circuitry
01/30/2003US20030020104 Increased efficiency semiconductor devices including intermetallic layer
01/30/2003US20030020103 Structures and methods for composite semiconductor field effect transistors
01/30/2003US20030020102 Trench-gate semiconductor devices, and their manufacture
01/30/2003US20030020098 Semiconductor integrated circuit device
01/30/2003US20030020097 Memory device with divided bit-line architecture
01/30/2003US20030020096 Method of producing a bonded wafer and the bonded wafer
01/30/2003US20030020095 Semiconductor integrated circuit with voltage down converter adaptable for burn-in testing
01/30/2003US20030020092 Insulating gate AlGaN/GaN HEMT
01/30/2003US20030020090 Structure including both compound semiconductor devices and silicon devices for optimal performance and function and method for fabricating the structure
01/30/2003US20030020089 Method for real-time monitoring and controlling perovskite oxide film growth and semiconductor structure formed using the method
01/30/2003US20030020087 Nitride semiconductor, semiconductor device, and method of manufacturing the same
01/30/2003US20030020086 Tuned delay components for an integrated circuit
01/30/2003US20030020084 Method of making light emitting diode displays
01/30/2003US20030020078 Structure and method for fabricating semiconductor structures and devices with optical processing layers utilizing the formation of a compliant substrate for materials used to form the same
01/30/2003US20030020072 Thermal management systems and methods
01/30/2003US20030020071 Integral semiconductor apparatus for conducting a plurality of functions
01/30/2003US20030020070 Semiconductor structure for isolating high frequency circuitry and method for fabricating
01/30/2003US20030020069 Structure and method for optimizing transmission media through dielectric layering and doping in semiconductor structures and devices utilizing the formation of a compliant substrate
01/30/2003US20030020068 Structure and method for integrating compound semiconductor structures and devices utilizing the formation of a compliant substrate for materials used to form the same
01/30/2003US20030020066 Semiconductor device and manufacturing method thereof
01/30/2003US20030020065 Semiconductor device
01/30/2003US20030020064 Display and fabricating method thereof
01/30/2003US20030020063 Composite semiconductor structure and device for digital processing systems
01/30/2003US20030020009 Monitor, method of monitoring, polishing device, and method of manufacturing semiconductor wafer
01/30/2003US20030019922 System and method for interlocking management in semiconductor material supply equipment
01/30/2003US20030019917 Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatus
01/30/2003US20030019909 Die attach system and process using cornercube offset tool
01/30/2003US20030019906 Bonding device
01/30/2003US20030019858 Ceramic heater with thermal pipe for improving temperature uniformity, efficiency and robustness and manufacturing method
01/30/2003US20030019851 Method and structure for forming metallic interconnections using directed thermal diffusion
01/30/2003US20030019842 Plasma reaction chamber assemblies
01/30/2003US20030019841 Use of perfluoroketones as vapor reactor cleaning, etching, and doping gases
01/30/2003US20030019839 Maintenance method and system for plasma processing apparatus etching and apparatus
01/30/2003US20030019837 Method and apparatus for producing at least one depression in a semiconductor material
01/30/2003US20030019835 Inductor and fabricating method thereof
01/30/2003US20030019834 using polishing system comprising an abrasive, a polishing pad, an acid, and a carrier
01/30/2003US20030019831 Polysilicon etch useful during the manufacture of a semiconductor device
01/30/2003US20030019783 Wafer container and dusting prevention method thereof and method for containing wafer
01/30/2003US20030019782 Packaged radiation sensitive coated workpiece process for making and method of storing same
01/30/2003US20030019744 Substrate holder
01/30/2003US20030019585 Using lawnmower tool having elongated handle which has length greater than radius of mower blade, shaft, and attached scraping blade with sharpened edge facing away from handle and shaft, and perpendicular to longitudinal axis of handle
01/30/2003US20030019584 Chuck assembly of etching apparatus for preventing byproducts
01/30/2003US20030019583 Semiconductor wafer holding assembly
01/30/2003US20030019582 Electrostatic control of deposition of, and etching by, ionized materials in semiconductor processing
01/30/2003US20030019580 Method of and apparatus for tunable gas injection in a plasma processing system
01/30/2003US20030019579 Dry etching apparatus for manufacturing semiconductor devices
01/30/2003US20030019578 Substrate processing apparatus equipping with high-pressure processing unit
01/30/2003US20030019577 Differential pressure application apparatus for use in polishing layers of semiconductor device structures and methods
01/30/2003US20030019574 Method for preparing high performance ball grid array board and jig applicable to said method
01/30/2003US20030019572 Oled packaging
01/30/2003US20030019568 Method for joining conductive structures and an electrical conductive article
01/30/2003US20030019563 Method of manufacturing multilayer ceramic wiring board and conductive paste for use
01/30/2003US20030019561 Method and device for ultrasonic vibration
01/30/2003US20030019507 Cleaning and drying method and apparatus
01/30/2003US20030019506 Method of avoiding or eliminating deposits in the exhaust area of a vacuum system
01/30/2003US20030019429 Purified silicon production system
01/30/2003US20030019427 In situ stabilized high concentration BPSG films for PMD application
01/30/2003US20030019426 Plating apparatus and method
01/30/2003US20030019423 Structure and method for fabricating semiconductor structures and devices utilizing the formation of a compliant gallium nitride substrate