Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2003
02/06/2003US20030026894 Manufacturing method of magnetic memory device
02/06/2003US20030026892 Method for application of a chemical process to a workpiece
02/06/2003US20030026683 Gripper for supporting substrate in a vertical orientation
02/06/2003US20030026677 High-pressure process apparatus
02/06/2003US20030026575 Structure and method for fabricating semiconductor optical waveguide structures utilizing the formation of a compliant substrate
02/06/2003US20030026553 Optical chip packaging via through hole
02/06/2003US20030026472 Pattern forming method, mask manufacturing method, and LSI manufacturing method
02/06/2003US20030026310 Structure and method for fabrication for a lighting device
02/06/2003US20030026309 Process for producing semiconductor laser element including S-ARROW structure formed by etching through mask having pair of parallel openings
02/06/2003US20030026136 Semiconductor memory device and method for testing the same
02/06/2003US20030026125 Thin film magnetic memory device including memory cells having a magnetic tunnel junction
02/06/2003US20030026123 Semiconductor memory device
02/06/2003US20030026119 Semiconductor integrated circuit device having internal synchronizing circuit responsive to test mode signal
02/06/2003US20030026083 Tray for semiconductors
02/06/2003US20030026065 Substrate holding device and electric-circuit fabricating process
02/06/2003US20030026060 Electrostatic chuck
02/06/2003US20030026054 Active power/ground ESD trigger
02/06/2003US20030026052 ESD protection devices for a differential pair of transistors
02/06/2003US20030026001 Geometric beamsplitter and method for its fabrication
02/06/2003US20030025962 Wavelength division multiplexed optical interconnection device
02/06/2003US20030025926 Image processing apparatus and image processing method
02/06/2003US20030025918 Confocal 3D inspection system and process
02/06/2003US20030025905 Method of detecting and classifying scratches, particles and pits on thin film disks or wafers
02/06/2003US20030025904 Method and apparatus for inspecting defects
02/06/2003US20030025893 Projection exposure apparatus and projection exposure method
02/06/2003US20030025891 Lithographic apparatus, device manufacturing method, and device manufactured thereby
02/06/2003US20030025890 Exposure apparatus and exposure method capable of controlling illumination distribution
02/06/2003US20030025889 Exposure apparatus and control method therefor, and device manufacturing method
02/06/2003US20030025847 Method of forming a reflective electrode and a liquid crystal display device
02/06/2003US20030025552 Semiconductor integrated circuit
02/06/2003US20030025551 Reference voltage generator
02/06/2003US20030025549 Booster circuit capable of switching between a conventional mode and a low consumption current mode
02/06/2003US20030025548 Voltage generation circuits and methods of operating same that use charge sharing to increase voltage step-up
02/06/2003US20030025517 Method and apparatus for determining the location of an alignment mark on a wafer
02/06/2003US20030025516 Testing vias and contacts in integrated circuit fabrication
02/06/2003US20030025444 Flat panel display with high capacitance and method of manufacturing the same
02/06/2003US20030025422 Surface acoustic wave element and manufacturing method of the same
02/06/2003US20030025245 Composite substrate carrier
02/06/2003US20030025244 Process for fabricating composite substrate carrier
02/06/2003US20030025217 Full CMOS SRAM cell
02/06/2003US20030025216 Phase shift mask blank, phase shift mask, and method of manufacture
02/06/2003US20030025213 Device for attaching a semiconductor chip to a chip carrier
02/06/2003US20030025212 Semiconductor LED flip-chip with high reflectivity dielectric coating on the mesa
02/06/2003US20030025210 Patterning three dimensional structures
02/06/2003US20030025209 Semiconductor device and method for fabricating the same
02/06/2003US20030025208 Semiconductor device with mushroom electrode and manufacture method thereof
02/06/2003US20030025207 Semiconductor device and its fabrication method
02/06/2003US20030025206 Boron-doped titanium nitride layer for high aspect ratio semiconductor devices
02/06/2003US20030025203 Under bump metallization pad and solder bump connections
02/06/2003US20030025202 Semiconductor device having an external electrode
02/06/2003US20030025201 Integrated circuit chip with little possibility of becoming damaged and structure for mounting the same
02/06/2003US20030025200 Process of manufacturing semiconductor device and slurry used therefor
02/06/2003US20030025198 Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat
02/06/2003US20030025192 Forming microelectronic connection components by electrophoretic deposition
02/06/2003US20030025185 U-shape tape for BOC FBGA package to improve moldability
02/06/2003US20030025184 Semiconductor device and method for manufacturing the same
02/06/2003US20030025179 Graded base GaAsSb for high speed GaAs HBT
02/06/2003US20030025175 Schottky barrier diode
02/06/2003US20030025174 Thermoelectric infrared detector
02/06/2003US20030025173 Semiconductor device and manufacturing method thereof
02/06/2003US20030025172 Method of manufacturing a probe card
02/06/2003US20030025171 Multiple epitaxial region substrate and technique for making the same
02/06/2003US20030025167 Activating in-situ doped gate on high dielectric constant materials
02/06/2003US20030025166 Light emitting device
02/06/2003US20030025165 Buried channel pmos transistor in dual gate cmos with reduced masking steps
02/06/2003US20030025164 Semiconductor device and fabrication method thereof
02/06/2003US20030025163 Semiconductor device having elevated source/drain and method of fabricating the same
02/06/2003US20030025162 Semiconductor device having resistive element formed of semiconductor film
02/06/2003US20030025161 Field effect transistor and method of manufacturing the same as well as liquid crystal display using the same and method of manufacturing the same
02/06/2003US20030025159 Semiconductor devices
02/06/2003US20030025158 Semiconductor device and method of manufacturing the same
02/06/2003US20030025157 Deep trench body SOI contacts with epitaxial layer formation
02/06/2003US20030025156 Laser processing method, method for forming a flash memory, insulated gate semiconductor device and method for forming the same
02/06/2003US20030025155 High-voltage transistor with multi-layer conduction region
02/06/2003US20030025153 Semiconductor device and method for fabricating the same
02/06/2003US20030025152 Field-effect controlled semiconductor component and method of manufacturing a field-effect controlled semiconductor component
02/06/2003US20030025151 EEPROM memory cell and method of forming the same
02/06/2003US20030025150 Non-volatile semiconductor memory device
02/06/2003US20030025149 Semiconductor device
02/06/2003US20030025147 Semiconductor device and method of producing the same
02/06/2003US20030025146 Processes for making a barrier between a dielectric and a conductor and products produced therefrom
02/06/2003US20030025145 Semiconductor device and method for fabricating the same
02/06/2003US20030025144 Integrated circuit device formed with high Q MIM capacitor
02/06/2003US20030025143 Metal-insulator-metal capacitor and method of manufacture
02/06/2003US20030025142 Integrated capacitors fabricated with conductive metal oxides
02/06/2003US20030025141 Arrangement of trenches in a semiconductor substrate, in particular for trench capacitors
02/06/2003US20030025140 One-transistor memory cell configuration and method for its fabrication
02/06/2003US20030025139 Method of forming a metal-insulator-metal capacitor for dual damascene interconnect processing and the device so formed
02/06/2003US20030025137 Method for manufacturing a semiconductor device having self-aligned contacts
02/06/2003US20030025136 Integral-type liquid crystal panel with image sensor function
02/06/2003US20030025135 Semiconductor device and method of manufacturing same
02/06/2003US20030025134 Predominantly <100> polycrystalline silicon thin film transistor
02/06/2003US20030025131 Formation of planar strained layers
02/06/2003US20030025130 Suppressing the leakage current in an integrated circuit
02/06/2003US20030025128 Low emitter resistance contacts to GaAs high speed HBT
02/06/2003US20030025127 Thin film transistor device and method of manufacturing the same
02/06/2003US20030025126 Ultra-thin SOI MOS transistors
02/06/2003US20030025122 Semiconductor integrated circuit
02/06/2003US20030025121 Robust Group III light emitting diode for high reliability in standard packaging applications
02/06/2003US20030025119 LCD device with optimized channel characteristics
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