Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2003
02/06/2003WO2002021565A3 Apparatus for magnetically scanning and/or switching a charged-particle beam
02/06/2003WO2002017355A9 Semiconductor wafer container cleaning apparatus
02/06/2003WO2002015190A3 Non-volatile memory, method of manufacture and programming
02/06/2003WO2002009287A3 Architecture and method for partially reconfiguring an fpga
02/06/2003WO2002009198A9 Etching apparatus having a confinement and guide object for gas flow of plasma and method for using same
02/06/2003WO2002009170A3 Method and apparatus for performing final critical dimension control
02/06/2003WO2002005314A9 Apparatus for processing a microelectronic workpiece including a workpiece cassette inventory assembly
02/06/2003WO2002002282A9 Edge-gripping pre-aligner
02/06/2003WO2001036901A3 Systems and methods for quantifying nonlinearities in interferometry systems
02/06/2003US20030028888 Systems and methods for providing consumers with entertainment content and associated periodically updated advertising
02/06/2003US20030028853 Wiring layout method of integrated circuit
02/06/2003US20030028745 Semiconductor storage device
02/06/2003US20030028486 Information managing method, information managing system, and processing apparatus
02/06/2003US20030028343 Intelligent measurement modular semiconductor parametric test system
02/06/2003US20030027899 Process for production of epoxy resin composition for semiconductor encapsulation, epoxy resin composition for semiconductor encapsulation, and semiconductor device
02/06/2003US20030027885 Polyamides that contain a biphenylene unit, which can be dimerized by exposure; also contain hydroxy groups that react with amide hydrogens to form benzoxazole groups by cyclizing.
02/06/2003US20030027501 Method of grinding rear side of semiconductor wafer
02/06/2003US20030027494 Apparatus for cutting a wafer
02/06/2003US20030027479 Panel inspection apparatus
02/06/2003US20030027433 Method of making thin films dielectrics using a process for room temperature wet chemical growth of SiO based oxides on a substrate
02/06/2003US20030027430 Process for etching thin-film layers of a workpiece used to form microelectronic circuits or components
02/06/2003US20030027429 Process for removing polymers during the fabrication of semiconductor devices
02/06/2003US20030027427 Integrated system for oxide etching and metal liner deposition
02/06/2003US20030027425 Patterned product and its manufacturing method
02/06/2003US20030027424 Feedforward and feedback control for conditioning of chemical mechanical polishing pad
02/06/2003US20030027423 Contact structure and production method thereof and probe contact assembly using same
02/06/2003US20030027422 Method of locally forming metal silicide layers
02/06/2003US20030027421 Method of locally forming metal silicide layers
02/06/2003US20030027420 Method for forming the partial salicide
02/06/2003US20030027419 Tri-tone photomask to form dual damascene structures
02/06/2003US20030027418 Semiconductor device fabricating method and treating liquid
02/06/2003US20030027416 Method of forming integrated circuitry, method of forming memory circuitry, and method of forming random access memory circuitry
02/06/2003US20030027415 Ball grid assembly with solder columns
02/06/2003US20030027414 Method of fabricating semiconductor device having L-shaped spacer
02/06/2003US20030027413 Method to improve the adhesion of dielectric layers to copper
02/06/2003US20030027412 Method for fabricating a low temperature polysilicon thin film transistor incorporating channel passivation step
02/06/2003US20030027411 Semiconductor device
02/06/2003US20030027410 Thin film semiconductor device having arrayed configuration of semiconductor crystals and a method for producing it
02/06/2003US20030027409 Germanium semiconductor structure, integrated circuit, and process for fabricating the same
02/06/2003US20030027408 Method and apparatus for controlling anti-phase domains in semiconductor structures and devices
02/06/2003US20030027407 Method for producing group III nitride compound semiconductor
02/06/2003US20030027406 Gettering of SOI wafers without regions of heavy doping
02/06/2003US20030027405 Thin film semiconductor device and manufacturing method thereof
02/06/2003US20030027404 Formation method of shallow trench isolation
02/06/2003US20030027403 Method for forming sacrificial oxide layer
02/06/2003US20030027402 Method for reducing stress of sidewall oxide layer of shallow trench isolation
02/06/2003US20030027401 Method for trench isolation by selective deposition of low temperature oxide films
02/06/2003US20030027400 SOI structure and method of producing same
02/06/2003US20030027397 Method for monitoring bipolar junction transistor emitter window etching process
02/06/2003US20030027395 Method of fabricating a DRAM semiconductor device
02/06/2003US20030027394 Semiconductor device and process for production thereof
02/06/2003US20030027393 Semiconductor device and method of manufacturing the same
02/06/2003US20030027392 Method for forming heavy nitrogen-doped ultra thin oxynitride gate dielectrics
02/06/2003US20030027391 Thermal compensation method for forming semiconductor integrated circuit microelectronic fabrication
02/06/2003US20030027390 Methods of forming FLASH memories
02/06/2003US20030027389 Semiconductor memory device and fabrication method thereof
02/06/2003US20030027388 Method for forming tunnel oxide film of flash memory
02/06/2003US20030027387 Semiconductor processing methods of forming integrated circuitry and semiconductor processing methods of forming dynamic random access memory (DRAM) circuitry
02/06/2003US20030027386 Method for manufacturing semiconductor device having capacitor and via contact
02/06/2003US20030027385 Method for manufacturing a semiconductor device having a metal-insulator-metal capacitor and a damascene wiring layer structure
02/06/2003US20030027384 Method of manufacturing a semiconductor device, having first and second semiconductor regions with field shield isolation structures and a field oxide film covering a junction between semiconductor regions
02/06/2003US20030027383 Method for manufacturing a bipolar transistor in a CMOS integrated circuit
02/06/2003US20030027382 Manufacturing method of semiconductor device
02/06/2003US20030027381 XE preamorphizing implantation
02/06/2003US20030027380 Semiconductor device and method of manufacturing the same
02/06/2003US20030027377 Multi-strand substrate for ball-grid array assemblies and method
02/06/2003US20030027376 Method for mounting a thin semiconductor device
02/06/2003US20030027375 Semiconductor device, method of making the same, circuit board, and flexible substrate
02/06/2003US20030027374 Methods of making microelectronic assemblies including compliant interfaces
02/06/2003US20030027373 Methods for providing void-free layers for semiconductor assemblies
02/06/2003US20030027372 Semiconductor device having leads provided with interrupter for molten resin
02/06/2003US20030027371 Method for fabricating semiconductor-mounting body and apparatus for fabricating semiconductor-mounting body
02/06/2003US20030027367 Confocal 3D inspection system and process
02/06/2003US20030027365 Semiconductor device manufacturing method
02/06/2003US20030027364 Substrate processing apparatus and semiconductor device producing method
02/06/2003US20030027363 Circuit-substrate working system and electronic-circuit fabricating process
02/06/2003US20030027362 Method for determining deficient processes and deficient processing stations
02/06/2003US20030027361 Including two or more processing units for processing wafers and a transferring unit for carrying the wafers
02/06/2003US20030027360 Single transistor ferroelectric transistor structure with high-K insulator and method of fabricating same
02/06/2003US20030027094 Method and device for heat treating substrates
02/06/2003US20030027087 Process for structuring a photoresist layer on a semiconductor substrate
02/06/2003US20030027086 Thick film photoresists and methods for use thereof
02/06/2003US20030027085 Placing semiconductor substrate with photoresist within pressuer chamber; pressurization; introducing supercritical carbon dioxide and stripper into chamber; mixing until photoresist is removed from semiconductor substrate; flushing
02/06/2003US20030027083 Method of preparing optically imaged high performance photomasks
02/06/2003US20030027081 Photolithographically-patterned out-of-plane coil structures and method of making
02/06/2003US20030027077 Photoresist compositions for short wavelength imaging
02/06/2003US20030027076 For forming relief images
02/06/2003US20030027075 Novel polymers, processes for polymer synthesis and photoresist compositions
02/06/2003US20030027065 Mask for measuring optical aberration and method of measuring optical aberration
02/06/2003US20030027064 Exposure method for correcting dimension variation in electron beam lithography, and recording medium for recording the same
02/06/2003US20030027061 Can be imaged with short wavelength radiation
02/06/2003US20030027060 Photoresist and process for structuring such a photoresist
02/06/2003US20030027059 Method for producing a mask and method for fabricating a semiconductor device
02/06/2003US20030027058 For producing integrated circuit
02/06/2003US20030027055 Method and feedstock for making photomask material
02/06/2003US20030027054 Method for making photomask material by plasma induction
02/06/2003US20030026920 Generating plasma in vacuum; controlling distribution
02/06/2003US20030026917 Process chamber components having textured internal surfaces and method of manufacture
02/06/2003US20030026904 Smooth support plate; depressurization; vapor deposition
02/06/2003US20030026898 Prespinning; hydrogen bonding
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