Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2003
02/18/2003US6521513 Silicon wafer configuration and method for forming same
02/18/2003US6521512 Method for fabricating a thin, free-standing semiconductor device layer and for making a three-dimensionally integrated circuit
02/18/2003US6521511 Thin film device transfer method, thin film device, thin film integrated circuit device, active matrix board, liquid crystal display, and electronic apparatus
02/18/2003US6521510 Method for shallow trench isolation with removal of strained island edges
02/18/2003US6521509 Semiconductor device and method of manufacturing the same
02/18/2003US6521508 Method of manufacturing a contact plug in a semiconductor device using selective epitaxial growth of silicon process
02/18/2003US6521507 Selective deposition of undoped silicon film seeded in chlorine and hydride gas for a stacked capacitor
02/18/2003US6521506 Varactors for CMOS and BiCMOS technologies
02/18/2003US6521505 Radio frequency plasma etching
02/18/2003US6521504 Semiconductor device and method of fabricating the same
02/18/2003US6521503 Pretreatment to prevent substrate thermal shock, reduce wafer warping, breaking
02/18/2003US6521502 Solid phase epitaxy activation process for source/drain junction extensions and halo regions
02/18/2003US6521501 Method of forming a CMOS transistor having ultra shallow source and drain regions
02/18/2003US6521500 Semiconductor device and method of manufacturing the same
02/18/2003US6521499 Method for forming non-volatile memory with self-aligned contact
02/18/2003US6521498 Manufacture or trench-gate semiconductor devices
02/18/2003US6521497 Method of manufacturing a field effect transistor
02/18/2003US6521496 Non-volatile memory semiconductor device including a graded, grown, high quality control gate oxide layer and associated methods
02/18/2003US6521495 Method of fabricating a non-volatile memory device
02/18/2003US6521494 Method of manufacturing semiconductor devices utilizing underlayer-dependency of deposition of capacitor electrode film, and semiconductor device
02/18/2003US6521493 Semiconductor device with STI sidewall implant
02/18/2003US6521492 Thin-film semiconductor device fabrication method
02/18/2003US6521489 Preferred methods for producing electrical circuit elements used to control an electronic display
02/18/2003US6521487 Method for making a thyristor
02/18/2003US6521486 Method and system to reduce switching signal noise on a device and a device as result thereof
02/18/2003US6521484 Mold injection method for semiconductor device
02/18/2003US6521481 Method for controlling adhesive distribution in a flip-chip semiconductor product
02/18/2003US6521480 Method for making a semiconductor chip package
02/18/2003US6521478 Method for manufacturing a low-profile semiconductor device
02/18/2003US6521475 Method of fabricating a liquid crystal-on-silicon backplane
02/18/2003US6521474 Manufacturing method for reflection type liquid crystal display
02/18/2003US6521473 Method of fabricating a liquid crystal display
02/18/2003US6521470 Method of measuring thickness of epitaxial layer
02/18/2003US6521469 Line monitoring of negative bias temperature instabilities by hole injection methods
02/18/2003US6521466 Apparatus and method for semiconductor wafer test yield enhancement
02/18/2003US6521393 Pattern formation method
02/18/2003US6521392 Methods for measuring and adjusting illumination uniformity obtained from a charged-particle illumination-optical system
02/18/2003US6521385 Using computers
02/18/2003US6521355 Fluorescent dye, electronic component
02/18/2003US6521324 Thermal transfer of microstructured layers
02/18/2003US6521316 single crystalline silicon wafer, ingot, and producing method thereof
02/18/2003US6521302 Method of reducing plasma-induced damage
02/18/2003US6521300 Depositing a protective layer of silicon nitride (SiN) or silicon carbide (SiC), oxygen-containing plasma treating the surface at low radio frequency power, forming an adhesion promoter coating, and spin coating the dielectric layer
02/18/2003US6521292 JMF type wafers
02/18/2003US6521192 Mixtures of scavangers and transition metals, alloys and/or oxides in enclosures having inlets and outlets, used for purification of gases; reuse
02/18/2003US6521118 Semiconductor etching process and apparatus
02/18/2003US6521109 Device for detecting an analyte in a sample based on organic materials
02/18/2003US6521105 Discharge is stable and film deposition speed and film thickness distribution are uniform even when a plurality of dielectric films are formed consecutively by using an opposing electrode, held at earth potential
02/18/2003US6521102 Perforated anode for uniform deposition of a metal layer
02/18/2003US6521081 Deposition shield for a plasma reactor
02/18/2003US6521080 Method and apparatus for monitoring a process by employing principal component analysis
02/18/2003US6521078 Sample separating apparatus and method, and substrate manufacturing method
02/18/2003US6521069 Green sheet and manufacturing method thereof, manufacturing method of multi-layer wiring board, and manufacturing method of double-sided wiring board
02/18/2003US6521050 Methods for evaluating advanced wafer drying techniques
02/18/2003US6521049 Method for reducing gaseous species of contamination in wet processes
02/18/2003US6521047 Process and apparatus for liquid delivery into a chemical vapor deposition chamber
02/18/2003US6521042 Semiconductor growth method
02/18/2003US6521041 Comprising a graded layer of silicon-germanium and a uniform etch-stop layer of silicon-germanium; for use on a monocrystalline silicon substrate
02/18/2003US6521010 Filter, filtering frame, and semiconductor device manufacturing method and apparatus
02/18/2003US6521007 Clean box
02/18/2003US6520847 Polishing pad having a grooved pattern for use in chemical mechanical polishing
02/18/2003US6520844 Method of thinning semiconductor wafer capable of preventing its front from being contaminated and back grinding device for semiconductor wafers
02/18/2003US6520840 CMP slurry for planarizing metals
02/18/2003US6520839 Load and unload station for semiconductor wafers
02/18/2003US6520833 Oscillating fixed abrasive CMP system and methods for implementing the same
02/18/2003US6520778 Microelectronic contact structures, and methods of making same
02/18/2003US6520733 Substrate transport and apparatus
02/18/2003US6520727 Modular sorter
02/18/2003US6520726 Apparatus and method for using a robot to remove a substrate carrier door
02/18/2003US6520348 Multiple inclined wafer holder for improved vapor transport and reflux for sealed ampoule diffusion process
02/18/2003US6520338 Wafer carrier having a low tolerance build-up
02/18/2003US6520315 Gripper assembly
02/18/2003US6520248 Heat sink having bonded cooling fins
02/18/2003US6520191 Carrier for cleaning silicon wafers
02/18/2003US6520189 CVD apparatus
02/18/2003US6520015 Tuning fork gyroscope
02/18/2003US6519869 Method and apparatus for drying semiconductor wafers
02/18/2003US6519846 Chip size package and method of fabricating the same
02/18/2003US6519845 Wire bonding to dual metal covered pad surfaces
02/18/2003US6519843 Method of forming a chip carrier by joining a laminate layer and stiffener
02/18/2003US6519842 Method for mounting semiconductor device
02/18/2003US6519840 Apparatus and method for mounting semiconductor chips on a substrate
02/18/2003CA2229975C Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method
02/13/2003WO2003013198A1 Antenna structure for inductively coupled plasma generator
02/13/2003WO2003012951A2 Esd protection devices for a differential pair of transistors
02/13/2003WO2003012944A1 Semiconductor structures and devices utilizing optical waveguides
02/13/2003WO2003012882A2 Effecting intersignal treatment with a plurality of signals
02/13/2003WO2003012879A1 Semiconductor device with inductive component and method of making
02/13/2003WO2003012878A1 Semiconductor device
02/13/2003WO2003012876A1 Gate electrodes and the formation thereof
02/13/2003WO2003012873A1 Soi wafer producing method, and wafer separating jig
02/13/2003WO2003012872A1 Semiconductor integrated circuit device
02/13/2003WO2003012871A1 Compound semiconductor devices and silicon devices
02/13/2003WO2003012870A1 Semiconductor device
02/13/2003WO2003012868A1 Semiconductor device and its manufacturing method
02/13/2003WO2003012864A1 Electronic assembly including a die having an integrated circu it and a layer of diamond and methods of producing the same
02/13/2003WO2003012863A1 Semiconductor device and its manufacturing method
02/13/2003WO2003012862A1 Integrating compound semiconductor structures and devices
02/13/2003WO2003012861A1 Semiconductor apparatus
02/13/2003WO2003012860A2 Boron-doped titanium nitride layer for high aspect ratio semiconductor devices