Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2003
02/20/2003US20030036254 Semiconductor processing methods, and semiconductor assemblies
02/20/2003US20030036253 Method of forming an oxide film on a gate side wall of a gate structure
02/20/2003US20030036252 Manufacturing method of schottky barrier diode
02/20/2003US20030036251 Laser annealing method and apparatus for determining laser annealing conditions
02/20/2003US20030036249 Chip alignment and placement apparatus for integrated circuit, MEMS, photonic or other devices
02/20/2003US20030036248 Systems and methods for forming data storage devices
02/20/2003US20030036247 Method of preparing a semiconductor using ion implantation in a sic layer
02/20/2003US20030036246 Manufacturing method of semiconductor device having trench type element isolation
02/20/2003US20030036245 Wafer and production thereof
02/20/2003US20030036244 Interdigitated capacitor and method of manufacturing thereof
02/20/2003US20030036243 Dielectric capacitor manufacturing method and semiconductor storage device manufacturing method
02/20/2003US20030036242 Methods of forming metal-comprising materials and capacitor electrodes; and capacitor constructions
02/20/2003US20030036241 Process flow for sacrificial collar scheme with vertical nitride mask
02/20/2003US20030036240 Method of simultaneous formation of local interconnect and gate electrode
02/20/2003US20030036239 Method for manufacturing capacitor of semiconductor device having improved leakage current characteristics
02/20/2003US20030036238 Process for direct integration of a thin-film silicon p-n junction diode with a magnetic tunnel junction
02/20/2003US20030036237 Transistor structure and method for making same
02/20/2003US20030036236 Method for radiation hardening N-channel MOS transistors
02/20/2003US20030036235 Semiconductor processing methods of forming integrated circuitry
02/20/2003US20030036234 Method for fabricating nonvolatile semiconductor memory device
02/20/2003US20030036233 Method of forming a word line in an embedded dynamic random access memory
02/20/2003US20030036230 Combination of bpteos oxide film with cmp and rta to achieve good data retention
02/20/2003US20030036229 Chip package and method for manufacturing the same
02/20/2003US20030036228 Buried PIP capacitor for mixed-mode process
02/20/2003US20030036227 Process for producing contact holes on a metallization structure
02/20/2003US20030036225 Method of forming a semiconductor device with gettering a group xv element by means of infrared light
02/20/2003US20030036224 Method for manufacturing a substantially integral monolithic apparatus including a plurality of semiconductor materials
02/20/2003US20030036223 Capacitor/antifuse structure having a barrier-layer electrode and improved barrier layer
02/20/2003US20030036222 Semiconductor device and method of fabricating the same
02/20/2003US20030036221 Thin film transistor array panel for liquid crystal display and method for manufacturing the same
02/20/2003US20030036220 Printed circuit board having plating conductive layer with bumps and its manufacturing method
02/20/2003US20030036219 Semiconductor device manufacturing method
02/20/2003US20030036213 Optical switch with multiplexed data and control signals separated by group velocity dispersion
02/20/2003US20030036210 Methods of forming capacitor constructions
02/20/2003US20030036209 Contamination control for embedded ferroelectric device fabrication processes
02/20/2003US20030035967 Process for coating surfaces
02/20/2003US20030035904 Method of a surface treatment in impromoving adhesion of an organic polymeric low-k dielectric layer
02/20/2003US20030035730 Method and a pump apparatus for the generation of an adjustable, substantially constant volume flow of a fluid and a use of this method
02/20/2003US20030035713 Moisture-controlled wafer storage container and method of using
02/20/2003US20030035711 Centering double side edge grip end effector with integrated mapping sensor
02/20/2003US20030035709 Robot for handling semiconductor wafers
02/20/2003US20030035705 Chuck transport method and system
02/20/2003US20030035636 Structure and method for fabricating a semiconductor structure comprising one or more logic gates
02/20/2003US20030035607 Apparatus for effecting conversion between communication signals in a first signal-form and communication signals in a second signal-form and method of manufacture therefor
02/20/2003US20030035508 Exposure apparatus and exposing method
02/20/2003US20030035359 Optical pickup device
02/20/2003US20030035338 Memory circuit
02/20/2003US20030035333 Integrated circuit capable of being burn-in tested using an alternating current stress and a testing method using the same
02/20/2003US20030035331 High density memory cell
02/20/2003US20030035313 Ferroelectric memory device and method of forming the same
02/20/2003US20030035276 Self-adhering chip
02/20/2003US20030035259 Protection configuration for schottky diode
02/20/2003US20030035222 Pellicle
02/20/2003US20030035096 Method of transporting a reticle
02/20/2003US20030035095 Reversed, double-helical bellows seal
02/20/2003US20030035091 Illumination apparatus, projection exposure apparatus, and device fabricating method
02/20/2003US20030035088 Positioning apparatus
02/20/2003US20030034940 Active matrix display device and method of manufacturing same
02/20/2003US20030034823 Data processing system
02/20/2003US20030034822 Local supply generator for a digital cmos integrated circuit having an analog signal processing circuitry
02/20/2003US20030034821 Integrated circuit including active components and at least one passive component and associated fabrication method
02/20/2003US20030034789 Probe holder for testing of a test device
02/20/2003US20030034782 Electric connection-inspection device
02/20/2003US20030034741 System in which a rotating body is connected to a rotary shaft in an ion implanter
02/20/2003US20030034695 Wafer stage with magnetic bearings
02/20/2003US20030034617 Wafer chuck with plunger
02/20/2003US20030034572 Semiconductor memory device
02/20/2003US20030034571 Semiconductor memory device
02/20/2003US20030034568 Semiconductor package with flash preventing mechanism and fabrication method thereof
02/20/2003US20030034567 Semiconductor device
02/20/2003US20030034565 Flip chip substrate with metal columns
02/20/2003US20030034562 Semiconductor device, and method and program for designing the same
02/20/2003US20030034561 Semiconductor device and fabricating method thereof
02/20/2003US20030034560 Wiring structure of semiconductor device, electrode, and method for forming them
02/20/2003US20030034558 Inspection pattern, inspection method, and inspection system for detection of latent defect of multi-layer wiring structure
02/20/2003US20030034556 Integrated semiconductor circuit, method of cooling a microwave circuit area and method of producing an integrated semiconductor circuit
02/20/2003US20030034555 Mold
02/20/2003US20030034553 Low profile ball-grid array package for high power
02/20/2003US20030034551 Fabrication of devices for a mesh network within a semiconductor structure
02/20/2003US20030034550 Semiconductor device and method of manufacturing the same
02/20/2003US20030034549 Semiconductor integrated circuit device
02/20/2003US20030034548 Ferroelectric device with capping layer and method of making same
02/20/2003US20030034547 Semiconductor structures and devices utilizing the formation of a compliant substrate for materials used to form the same including dynamic logic with local storage elements and a method of operating same
02/20/2003US20030034546 Multilayer microstructure macrocapacitor
02/20/2003US20030034545 Structure and method for fabricating semiconductor structures with switched capacitor circuits
02/20/2003US20030034543 Semiconductor device with trench isolation structure
02/20/2003US20030034541 Structure and method for fabricating fault tolerant semiconductor structures with fault remediation utilizing the formation of a compliant substrate
02/20/2003US20030034539 Semiconductor integrated circuit device
02/20/2003US20030034538 Tunable laser array in composite integrated circuitry
02/20/2003US20030034535 Mems devices suitable for integration with chip having integrated silicon and compound semiconductor devices, and methods for fabricating such devices
02/20/2003US20030034533 Silicide stop layer in a damascene semiconductor structure
02/20/2003US20030034532 Transistor having high dielectric constant gate insulating layer and source and drain forming schottky contact with substrate
02/20/2003US20030034531 Method of manufacturing semiconductor device and semiconductor device manufactured thereby
02/20/2003US20030034529 CMOS inverter and integrated circuits utilizing strained silicon surface channel MOSFETs
02/20/2003US20030034528 Semiconductor device, and method for manufacturing the same
02/20/2003US20030034526 Method for making an integrated circuit device with dielectrically isolated tubs and related circuit
02/20/2003US20030034525 Method of increasing the conductivity of a transparent conductive layer
02/20/2003US20030034524 Semiconductor device and method of producing the same
02/20/2003US20030034523 Semiconductor thin-film manufacturing method, semiconductor device manufacturing method, semiconductor device, integrated circuit, electro-optical device, and electronic appliance
02/20/2003US20030034521 Fabrication method for punch-through defect resistant semiconductor memory device