Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2003
02/20/2003US20030034520 Semiconductor device having gate electrode in which depletion layer can be generated
02/20/2003US20030034519 Dual epitaxial layer for high voltage vertical conduction power MOSFET devices
02/20/2003US20030034518 Method for manufacturing semiconductor memory
02/20/2003US20030034517 Structure of split-gate eeprom memory cell
02/20/2003US20030034516 Structure of a non-volatile memory
02/20/2003US20030034515 Capacitor Structures
02/20/2003US20030034514 Methods of utilizing a sacrificial layer during formation of a capacitor
02/20/2003US20030034513 Methods of forming a capacitor structure
02/20/2003US20030034512 Integrated circuit configuration and method of fabricating a dram structure with buried bit lines or trench capacitors
02/20/2003US20030034511 FLASH memory circuitry
02/20/2003US20030034509 Integrated circuit device including a layered superlattice material with an interface buffer layer
02/20/2003US20030034508 Microprocessor in MOS with integrated cordic in compound semiconductor on a common substrate
02/20/2003US20030034506 Structure and method for fabricating semiconductor structures having a scheduling engine utilizing the formation of a compliant substrate for materials used to form the same
02/20/2003US20030034505 Structure and method for fabricating semiconductor structures and devices utilizing the formation of a compliant substrate including an isotopically enriched material
02/20/2003US20030034504 Semiconductor device, semiconductor integrated circuit, and method for manufacturing semiconductor device
02/20/2003US20030034503 Structure and method for fabricating semiconductor structures having instruction decoders and dispatchers formed of monocrystaline compound semiconductor material
02/20/2003US20030034502 Structure and method for fabricating semiconductor structures having memory systems with pre-computation units, utilizing the formation of a compliant substrate
02/20/2003US20030034501 Image sensor with high degree of functional integration
02/20/2003US20030034500 Semiconductor structure including a zintl material buffer layer, device including the structure, and method of forming the structure and device
02/20/2003US20030034499 Method of manufacture for 80 nanometer diameter resonant tunneling diode with improved peak-to- valley ratio and resonant tunneling diode therefrom
02/20/2003US20030034495 Self-aligned transistor and diode topologies in silicon carbide through the use of selective epitaxy or selective implantation
02/20/2003US20030034493 Semiconductor integrated circuit apparatus and its manufacturing method
02/20/2003US20030034492 Semiconductor device and liquid crystal display device
02/20/2003US20030034491 Structure and method for fabricating semiconductor structures and devices for detecting an object
02/20/2003US20030034490 Technique for attaching die to leads
02/20/2003US20030034488 Structure and method for fabricating and facilitating dataflow processor
02/20/2003US20030034487 Transmission line interconnect
02/20/2003US20030034486 Applications of light-emitting nanoparticles
02/20/2003US20030034485 Semiconductor device
02/20/2003US20030034460 Mask pattern transfer method, mask pattern transfer apparatus using the method, and device manufacturing method
02/20/2003US20030034457 Electron-optical corrector for eliminating third-order aberations
02/20/2003US20030034380 Method for removing solder bumps from LSI
02/20/2003US20030034341 Ceramic heater and process for temperature control thereof
02/20/2003US20030034326 Method for producing liquid discharge head
02/20/2003US20030034280 Semiconductor device loading apparatus for test handlers
02/20/2003US20030034251 Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing
02/20/2003US20030034250 Reverse voltage bias for electro-chemical plating system and method
02/20/2003US20030034244 Sealing substrate within an enclosure; applying voltage; process control
02/20/2003US20030034228 Apparatus for levitating objects, apparatus for transporting objects, and apparatus for loading objects
02/20/2003US20030034226 Transporting apparatus
02/20/2003US20030034131 Chemical mechanical polishing pad having wave shaped grooves
02/20/2003US20030034130 Plasma-resistant member for semiconductor manufacturing apparatus and method for manufacturing the same
02/20/2003US20030034128 Process for producing semiconductor wafer with adhesive film
02/20/2003US20030034122 Unfired-ceramic-body procesing method
02/20/2003US20030034120 Device transferring method, device arraying method, and image display fabrication method using the same
02/20/2003US20030034110 Method and device for producing an adhesive-bonded connection between a semiconductor wafer and a carrier plate
02/20/2003US20030034093 Cutting using pulsing laser beams
02/20/2003US20030034056 Substrate processing apparatus
02/20/2003US20030034053 Processing and cleaning method
02/20/2003US20030034048 Back-surface cleaning method for cleaning the back surface of a silicon wafer
02/20/2003US20030034046 Programmable physical action during integrated circuit wafer cleanup
02/20/2003US20030033983 Apparatus and method for depositing thin films on a glass substrate
02/20/2003US20030033982 Chemical vapor deposition system
02/20/2003US20030033981 Wafer handling device
02/20/2003US20030033980 CVD apparatuses and methods of forming a layer over a semiconductor substrate
02/20/2003US20030033978 High termperature filter
02/20/2003US20030033974 Layered substrates for epitaxial processing, and device
02/20/2003US20030033728 Non-contacting conveyance equipment
02/20/2003DE10135870C1 Production of an integrated semiconductor circuit comprises depositing layer sequence, anisotropically etching, oxidizing the lowermost layer of the layer sequence, depositing further layer sequence on substrate, and isotropically etching
02/20/2003CA2456142A1 A method to gaas based lasers and a gaas based laser
02/20/2003CA2449052A1 Flame retardant molding compositions
02/19/2003EP1284507A2 MOS type semiconductor device
02/19/2003EP1284502A1 Device having resin package and method of producing the same
02/19/2003EP1284501A1 Device having resin package and method of producing the same
02/19/2003EP1284500A2 Semiconductor device and method of manufacturing the same
02/19/2003EP1284499A2 Apparatus and method for a production testline to monitor cmos srams
02/19/2003EP1284498A2 System and method to screen defect related reliability failures in CMOS SRAMS
02/19/2003EP1284497A1 Die bonding device
02/19/2003EP1284496A1 Junction field-effect transistor and method of manufacture thereof
02/19/2003EP1284443A1 Photoresist compositions
02/19/2003EP1284433A2 Transflective liquid crystal display and method for manufacturing the same
02/19/2003EP1284370A1 Method for delivering variable amounts of flow, and dosing pump using this method
02/19/2003EP1284369A1 Method for delivering variable amounts of flow, and dosing pumping using this method
02/19/2003EP1284311A2 Silicon semiconductor substrate and process for producing the same
02/19/2003EP1284305A2 Copper film vapor phase deposition method and apparatus
02/19/2003EP1284304A2 Apparatus for implanting an ion on a target and method for the same
02/19/2003EP1284189A1 Thermal inkjet printhead processing with silicon etching
02/19/2003EP1284024A1 Optoelectronic component and a method for producing the same
02/19/2003EP1284023A2 Etching process for making electrodes
02/19/2003EP1284021A1 Fabrication of low leakage-current backside illuminated photodiodes
02/19/2003EP1284020A2 Semiconductor structures for hemt
02/19/2003EP1284019A2 Semiconductor power component
02/19/2003EP1284018A2 Trench capacitor with insulation collar stack, and method of forming thereof
02/19/2003EP1284017A2 Three-dimensional memory array and method of fabrication
02/19/2003EP1284016A2 System and method of forming a vertically oriented device in an integrated circuit
02/19/2003EP1284015A1 Semiconductor device having a low dielectric film and fabrication process thereof
02/19/2003EP1284014A1 Technique for suppression of edge current in semiconductor devices
02/19/2003EP1284013A2 Method for forming high quality multiple thickness oxide layers by reducing descum induced defects
02/19/2003EP1284012A1 Method for substrate noise distribution
02/19/2003EP1284011A1 Device and method for treating, storing and loading supports for disk-shaped articles
02/19/2003EP1284010A2 Method of fabricating flux concentrating layer for use with magnetoresistive random access memories
02/19/2003EP1208245B1 Plasma activated cvd method and device for producing a microcristalline si:h layer
02/19/2003EP1159755B1 Method and device for rotating a wafer
02/19/2003EP1046190B1 Method and device for drying substrates
02/19/2003EP1009588B1 Polishing pad and method for making polishing pad with elongated microcolumns
02/19/2003EP1005095B1 Method of manufacturing a photovoltaic element
02/19/2003EP0992059B1 Toroidal low-field reactive gas source
02/19/2003EP0826229B1 Electrode clamping assembly and method for assembly and use thereof
02/19/2003EP0752121B1 Methods of fabricating active matrix pixel electrodes
02/19/2003EP0678213B1 Magnetoresistive structure with alloy layer
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