| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 02/20/2003 | WO2003015138A2 Optimized buried-channel fets based on sige heterostructures |
| 02/20/2003 | WO2003015137A2 Pedestal with integral shield |
| 02/20/2003 | WO2003015136A2 Method and apparatus for vacuum pumping a susceptor shaft |
| 02/20/2003 | WO2003015133A2 Showerhead electrode design for semiconductor processing reactor |
| 02/20/2003 | WO2003015132A2 Dual layer hard mask for edram gate etch process |
| 02/20/2003 | WO2003015130A2 Integrated system for oxide etching and metal liner deposition |
| 02/20/2003 | WO2003015129A2 Low-k dielectric thin films and chemical vapor deposition method of making same |
| 02/20/2003 | WO2003015121A2 Slit lens arrangement for particle beams |
| 02/20/2003 | WO2003015117A1 Field emission backplate |
| 02/20/2003 | WO2003014979A2 Method for selection of parameters for implant anneal of patterned semiconductor substrates and specification of a laser system |
| 02/20/2003 | WO2003014856A1 Semiconductor integrated circuit device and cellular terminal using the same |
| 02/20/2003 | WO2003014830A1 Resist pattern swelling material, and method for patterning using same |
| 02/20/2003 | WO2003014827A1 An interferometer system for a semiconductor exposure system |
| 02/20/2003 | WO2003014812A2 Semiconductor structures and polarization modulator devices |
| 02/20/2003 | WO2003014809A2 Electrostatic discharge protection for pixellated electronic device |
| 02/20/2003 | WO2003014756A1 Delay fault test circuitry and related method |
| 02/20/2003 | WO2003014755A1 Device for measuring characteristics of probe cards and probing method |
| 02/20/2003 | WO2003014750A2 Application-specific testing methods for programmable logic devices |
| 02/20/2003 | WO2003014645A2 Improved lamphead for a rapid thermal processing chamber |
| 02/20/2003 | WO2003014416A2 Plating device and method |
| 02/20/2003 | WO2003014411A1 Rapid cycle chamber having a top vent with nitrogen purge |
| 02/20/2003 | WO2003014242A1 Pressure sensitive adhesive double coated tape and method for producing ic chip using it |
| 02/20/2003 | WO2003014210A1 Flame retardant molding compositions |
| 02/20/2003 | WO2003014000A2 Edge gripping pre-aligner |
| 02/20/2003 | WO2003013993A1 Reticle protection and transport |
| 02/20/2003 | WO2003013815A1 Device for detaching substrates and the associated method |
| 02/20/2003 | WO2003001590A3 System and method to form a composite film stack utilizing sequential deposition techniques |
| 02/20/2003 | WO2002101926A3 Integrated circuit and method for testing the integrated circuit |
| 02/20/2003 | WO2002101419A3 Optical element with full complex modulation |
| 02/20/2003 | WO2002100594A8 Improved method and apparatus for bi-directionally polishing a workpiece |
| 02/20/2003 | WO2002099853A3 Temperature-controlled chuck and method for controlling the temperature of a substantially flat object |
| 02/20/2003 | WO2002098175A3 Device for heating substrates with side screens and/or secondary reflectors |
| 02/20/2003 | WO2002095762A3 Flash memory device with increase of efficiency during an apde (automatic program disturb after erase) process |
| 02/20/2003 | WO2002093619A3 Semiconductor structures and devices utilizing a compliant substrate |
| 02/20/2003 | WO2002093618A3 Semiconductor structure including low-leakage, high crystalline dielectric |
| 02/20/2003 | WO2002091472A3 Transistor and integrated circuit |
| 02/20/2003 | WO2002089202A3 Method for the production of an integrated circuit |
| 02/20/2003 | WO2002089199A3 A method of filling a via or recess in a semiconductor substrate |
| 02/20/2003 | WO2002082511A3 Pedestal assembly with enhanced thermal conductivity |
| 02/20/2003 | WO2002082188A3 Substrate alignment |
| 02/20/2003 | WO2002079085A3 Surface modification of porous silicon |
| 02/20/2003 | WO2002077710A3 Photoresist compositions for short wavelength imaging |
| 02/20/2003 | WO2002071154A3 Method of uniformly coating a substrate |
| 02/20/2003 | WO2002069372A8 Self-coplanarity bumping shape for flip chip |
| 02/20/2003 | WO2002067332A3 Semiconductor devices having field shaping regions |
| 02/20/2003 | WO2002063686A3 High performance silicon contact for flip chip |
| 02/20/2003 | WO2002061837A3 Modular display device and organic thin-film transistor |
| 02/20/2003 | WO2002059946A3 Method of producing soi materials |
| 02/20/2003 | WO2002055458A3 Process for purifying octafluorocyclobutane, process for preparing the same, and use thereof |
| 02/20/2003 | WO2002041370A3 Apparatuses and methods for resistively heating a thermal processing system |
| 02/20/2003 | WO2002041355A3 Plasma processing comprising three rotational motions of an article being processed |
| 02/20/2003 | WO2002035897A9 Use of metallic treatment on copper foil to produce fine lines and replace oxide process in printed circuit board production |
| 02/20/2003 | WO2002025292B1 Manipulator for a test head with active compliance |
| 02/20/2003 | WO2002005325A3 Chuck with heat exchanger and temperature control fluid |
| 02/20/2003 | WO2001091451B1 Amorphous aluminum nitride emitter |
| 02/20/2003 | WO2001073883A3 Low-temperature fabrication of thin-film energy-storage devices |
| 02/20/2003 | US20030037309 Management system and management method of semiconductor exposure apparatuses |
| 02/20/2003 | US20030037308 Layout verification method, program thereof, and layout verification apparatus |
| 02/20/2003 | US20030037090 Tool services layer for providing tool service functions in conjunction with tool functions |
| 02/20/2003 | US20030036971 System and method for manufacturing semiconductor devices controlled by customer |
| 02/20/2003 | US20030036815 Experiment management system, method and medium |
| 02/20/2003 | US20030036618 Exposing polymer and photoacid generator with a light of 180 nm or less wavelength, and conducting baking and development. |
| 02/20/2003 | US20030036603 E.g., spiro(7-oxa-5-norbornene-2,3'- succinic anhydride, -tetrahydrofuran-2'-one, and -(2',2'-dimethyl)tetrahydrofuran)) |
| 02/20/2003 | US20030036570 Water for storing silicon wafers and storing method |
| 02/20/2003 | US20030036569 Do not readily protonate (even in aqueous solutions of low pH), commonly encountered in many extreme applications due to the very low basicity of the perfluorinated anion. |
| 02/20/2003 | US20030036343 Machining strain removal apparatus |
| 02/20/2003 | US20030036339 Methods and compositions for chemical mechanical polishing shallow trench isolation substrates |
| 02/20/2003 | US20030036293 Method for manufacturing a semiconductor device |
| 02/20/2003 | US20030036292 Process for producing a semiconductor device |
| 02/20/2003 | US20030036291 Method of forming a silicon oxide layer of a semiconductor device and method of forming a wiring having the same |
| 02/20/2003 | US20030036290 The pre-wetting process being performed on the adhesion promoter layer to enhance the coating capability of the low-k dielectric layer, and thus improve the coating quality |
| 02/20/2003 | US20030036289 Simox substrate and method for production thereof |
| 02/20/2003 | US20030036287 Precision dielectric etch using hexafluorobutadiene |
| 02/20/2003 | US20030036286 Etching methods, methods of removing portions of material, and methods of forming silicon nitride spacers |
| 02/20/2003 | US20030036285 Etching methods, etching apparatus and methods for fabricating semiconductor devices |
| 02/20/2003 | US20030036284 Method for removing the photoresist layer of ion-implanting process |
| 02/20/2003 | US20030036283 Plasma etching methods |
| 02/20/2003 | US20030036282 Etching end point judging device |
| 02/20/2003 | US20030036280 Low dielectric constant etch stop films |
| 02/20/2003 | US20030036279 Thermal inkjet printhead processing with silicon etching |
| 02/20/2003 | US20030036278 Method for fabricating a gate stack in very large scale integrated semiconductor memories |
| 02/20/2003 | US20030036277 Method for manufacturing a thin film transistor array panel |
| 02/20/2003 | US20030036276 Method for forming high resistance resistor with integrated high voltage device process |
| 02/20/2003 | US20030036275 Method for forming integrated circuit having monos device and mixed-signal circuit |
| 02/20/2003 | US20030036274 Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool |
| 02/20/2003 | US20030036273 Shield for capturing fluid displaced from a substrate |
| 02/20/2003 | US20030036271 Utilization of disappearing silicon hard mask for fabrication of semiconductor structures |
| 02/20/2003 | US20030036270 Determining exposure time of wafer photolithography process |
| 02/20/2003 | US20030036269 Method of removing smear from via holes |
| 02/20/2003 | US20030036268 Low temperature load and bake |
| 02/20/2003 | US20030036267 Copper-based metal polishing solution and method for manufacturing semiconductor device |
| 02/20/2003 | US20030036264 Method of etching platinum using a silicon carbide mask |
| 02/20/2003 | US20030036263 Method for selectively depositing diffusion barriers |
| 02/20/2003 | US20030036261 Semiconductor device and fabricating method thereof |
| 02/20/2003 | US20030036260 Method for manufacturing a semiconductor device |
| 02/20/2003 | US20030036259 High speed, low latency bus modulation method and apparatus including a semiconductor structure for implementing same |
| 02/20/2003 | US20030036258 Method of selectively forming local interconnects using design rules |
| 02/20/2003 | US20030036257 Semiconductor device manufacturing method |
| 02/20/2003 | US20030036256 Integrated circuit with bonding layer over active circuitry |
| 02/20/2003 | US20030036255 Method of forming metal bumps |