Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2003
02/27/2003US20030038375 Bonded anisotropic conductive film
02/27/2003US20030038371 Method of forming a metallic interconnect structure with a metallic spacer
02/27/2003US20030038370 Process for forming a nitride film
02/27/2003US20030038369 Forming a tungsten nucleation layer by plasma vapor deposition, and covering with an intermediate layer titanium nitride; micro-miniaturization of semiconductor devices
02/27/2003US20030038368 Production apparatus of planer type semiconductor device and fabrication method of planer type semiconductor device
02/27/2003US20030038367 Semiconductor device and method for manufacturing the same
02/27/2003US20030038366 Three-dimensional semiconductor device having plural active semiconductor components
02/27/2003US20030038364 Internal hydrogen sources for heat conductive packaging of low dielectric constant semiconductor chips, and method of providing hydrogen therefor
02/27/2003US20030038363 Semiconductor device and apparatus for manufacturing same
02/27/2003US20030038361 Semiconductor apparatus and method for fabricating the same
02/27/2003US20030038360 Semiconductor device and a method of manufacturing the same
02/27/2003US20030038359 Forming a thin semiconductor device of high packaging density type, resin-encapsulated type, and smaller in size
02/27/2003US20030038351 Chip carrier, semiconductor package and fabricating method thereof
02/27/2003US20030038350 Semiconductor device
02/27/2003US20030038349 Glycogen phosphorylase inhibitor
02/27/2003US20030038344 Through-via vertical interconnects, through-via heat sinks and associated fabrication methods
02/27/2003US20030038343 Semiconductor device and method for manufacturing the same
02/27/2003US20030038342 Wafer level underfill and interconnect process
02/27/2003US20030038341 Low stress thermal and electrical interconnects for heterojunction bipolar transistors
02/27/2003US20030038340 Low-voltage punch-through bi-directional transient-voltage suppression devices and methods of making the same
02/27/2003US20030038339 Semiconductor devices
02/27/2003US20030038337 Semiconductor integrated circuit device and a method of manufacturing the same
02/27/2003US20030038336 Semiconductor device for isolating a photodiode to reduce junction leakage and method of formation
02/27/2003US20030038334 Forming a stress-relief layer on the recess-inhibiting protective layer, and the masking layer, selectively etching the masking layer and the first stress-relief layer at faster rates; integrated circuit devices, semiconductors
02/27/2003US20030038333 Semiconductor device
02/27/2003US20030038331 Semiconductor device having a barrier layer
02/27/2003US20030038330 Semiconductor Device
02/27/2003US20030038326 Forming a color filter array on the bottom antireflection protective coatings; preserves the intrinsic transmission characteristics, reduces degradation of metal bonding pads
02/27/2003US20030038325 Semiconductor device and method of fabricating the same
02/27/2003US20030038323 Semiconductor device and method for fabricating the same
02/27/2003US20030038322 Semiconductor memory device
02/27/2003US20030038321 Semiconductor device, display device, and method of manufacturing the same
02/27/2003US20030038320 Semicondutor device and manufacturing method thereof
02/27/2003US20030038317 Semiconductor device
02/27/2003US20030038315 Read-only memories includes a floating gate extending in a substrate between source and drain regions, a tunnel between the second layer and the initial substrate formed by selective etching
02/27/2003US20030038314 Semiconductor device and method of manufacturing the same
02/27/2003US20030038313 Semiconductor devices having a non-volatile memory transistor and methods for manufacturing the same
02/27/2003US20030038311 Chemical vapor depositing dielectric material over the first capacitor electrode with different amount of crystallinity at the edge region and other portion
02/27/2003US20030038310 Mask ROM, and fabrication method thereof
02/27/2003US20030038309 Method of forming a film having enhanced reflow characteristics at low thermal budget
02/27/2003US20030038308 A metal sidewall is formed at sides of a gate poly-silicon layer to reduce a resistance; improving performances of a semiconductor device
02/27/2003US20030038306 A signal line capacitance value is only slightly increased by increasing an auxiliary capacitance value; X-ray image sensor
02/27/2003US20030038305 Method for manufacturing and structure of transistor with low-k spacer
02/27/2003US20030038304 Semiconductor devices
02/27/2003US20030038303 Method of manufacturing semiconductor integrated circuit device having capacitor element
02/27/2003US20030038302 Nitride semiconductor growing process
02/27/2003US20030038300 Heterojunction bipolar transistor, manufacturing method therefor, and communication device therewith
02/27/2003US20030038299 Semiconductor structure including a compliant substrate having a decoupling layer, device including the compliant substrate, and method to form the structure and device
02/27/2003US20030038293 Bottom antireflection coating color filter process for fabricating solid state image sensors
02/27/2003US20030038289 Semiconductor device/integrated circuit that uses a high reliability thin film transistor for liquid crystal display of computers
02/27/2003US20030038288 Thin film transistor and method of making same
02/27/2003US20030038250 Process conditions change monitoring systems that use electron beams, and related monitoring methods
02/27/2003US20030038246 Helium ion generation method and apparatus
02/27/2003US20030038244 Electrostatically focused addressable field emission array chips (AFEA's) for high-speed massively parallel maskless digital e-beam direct write lithography and scanning electron microscopy
02/27/2003US20030038243 Charged-particle-beam (CPB) optical systems, and CPB Microlithography systems comprising same, that cancel external magnetic fields
02/27/2003US20030038241 X-ray detector and method of fabricating the same
02/27/2003US20030038225 Lithographic apparatus, device manufacturing method, device manufactured thereby, control system, computer program, and computer program product
02/27/2003US20030038162 Method for forming a flip chip on leadframe semiconductor package
02/27/2003US20030038158 Bonding apparatus and bonding tool for component
02/27/2003US20030038157 Electronic component with a semiconductor chip and method for producing the electronic component
02/27/2003US20030038129 Hot plate for semiconductor manufacture and testing
02/27/2003US20030038128 Heating device of the light irradiation type
02/27/2003US20030038127 Annealing, diffusion, oxidation, doping,and vapor deposition; semiconductors
02/27/2003US20030038122 Laser annealing apparatus and semiconductor device manufacturing method
02/27/2003US20030038115 Method for wet etching and wet etching apparatus
02/27/2003US20030038114 System and method for dechucking a workpiece from an electrostatic chuck
02/27/2003US20030038113 Process for charged particle beam micro-machining of copper
02/27/2003US20030038112 Optical monitoring and control system and method for plasma reactors
02/27/2003US20030038111 Dielectric etch chamber with expanded process window
02/27/2003US20030038110 Method and apparatus for chemical-mechanical jet etching of semiconductor structures
02/27/2003US20030038109 Method of making thermally stable planarizing films
02/27/2003US20030038107 Method and apparatus for removal of unwanted electroplating deposits
02/27/2003US20030038056 Modular carrier for semiconductor wafer disks and similar inventory
02/27/2003US20030038038 Using a no-contact process with electrochemical deposition, followed by a contact process with electrochemical mechanical deposition
02/27/2003US20030038037 Electroplating apparatus and four mask TFT array process with electroplated metal
02/27/2003US20030038036 Method of direct electroplating on a low conductivity material, and electroplated metal deposited therewith
02/27/2003US20030038026 Made using a focal vacuum arc vapor deposition device comprising a chamber, a nozzle and a nozzle seal
02/27/2003US20030038025 Method and apparatus for improving sidewall coverage during sputtering in a chamber having an inductively coupled plasma
02/27/2003US20030037960 Layered circuit boards and methods of production thereof
02/27/2003US20030037959 Bismaleimide- triazine copolymer and epoxy resin laminate having a plurality of solder pads on the surface and the solder pads contain no more than 20 weight % tin and has a reflow temperature of not greater than about 270 degree C.
02/27/2003US20030037948 Semiconductor device
02/27/2003US20030037882 Plasma treating apparatus and plasma treating method
02/27/2003US20030037881 Adjustable dual frequency voltage dividing plasma reactor
02/27/2003US20030037880 Dielectric etch chamber with expanded process window
02/27/2003US20030037879 Top gas feed lid for semiconductor processing chamber
02/27/2003US20030037878 Exposure apparatus and semiconductor device manufacturing method
02/27/2003US20030037874 Semiconductor substrate bonding by mass transport growth fusion
02/27/2003US20030037870 Electrical connector
02/27/2003US20030037843 Method for producing indium tin oxide film
02/27/2003US20030037836 Automatic refill system for ultra pure or contamination sensitive chemicals
02/27/2003US20030037803 Via imparting broadband impulse; vacuum chucking; for semiconductors and integrated circuits
02/27/2003US20030037802 Semiconductor treating apparatus and cleaning method of the same
02/27/2003US20030037801 Via imparting broadband impulse and determining if particles are in the exhaust line; semiconductors
02/27/2003US20030037800 Method for removing contamination particles from substrate processing chambers
02/27/2003US20030037731 Apparatus of manufacturing a semiconductor device
02/27/2003US20030037730 Processing system, evacuating system for processing system, low-pressure CVD system, and evacuating system and trapping device for low-pressure CVD system
02/27/2003US20030037729 Modular injector and exhaust assembly
02/27/2003US20030037724 Axial gradient transport appatatus and process for producing large size, single crystals of silicon carbide
02/27/2003US20030037722 Nitride semiconductor growth method, nitride semiconductor substrate, and nitride semiconductor device
02/27/2003US20030037697 Second step polishing by CMP