Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2003
02/27/2003WO2003017357A1 Method for obtaining a self-supported semiconductor thin film for electronic circuits
02/27/2003WO2003017356A2 Improved strap resistance using selective oxidation to cap dt poly before sti etch
02/27/2003WO2003017355A1 Robot hand
02/27/2003WO2003017354A1 Semiconductor processing system
02/27/2003WO2003017353A2 Providing photonic control over wafer borne semiconductor devices
02/27/2003WO2003017352A2 Providing current control over wafer borne semiconductor devices using overlayer patterns
02/27/2003WO2003017349A2 Dmos transistor
02/27/2003WO2003017348A1 Chemical mechanical polishing pad having holes and/or grooves
02/27/2003WO2003017347A1 Chemical mechanical polishing pad having wave-shaped grooves
02/27/2003WO2003017346A1 Sheet manufacturing device, sheet manufacturing method, and solar battery
02/27/2003WO2003017345A1 Chemical vapor phase epitaxial device
02/27/2003WO2003017343A1 Dry developing method
02/27/2003WO2003017342A2 Method for the production of a self-adjusted structure on a semiconductor wafer
02/27/2003WO2003017341A2 Methods of forming metal-comprising materials and capacitor electrodes; and capacitor constructions
02/27/2003WO2003017340A2 A method for concurrent fabrication of a double polysilicon bipolar transistor and a base polysilicon resistor
02/27/2003WO2003017339A2 Method and apparatus for positoning a wafer chuck
02/27/2003WO2003017338A2 Wafer chuck with plunger
02/27/2003WO2003017337A1 Shield for capturing fluids displaced from a substrate
02/27/2003WO2003017336A2 Dram trench capacitor and method of making the same
02/27/2003WO2003017335A2 Systems for wafer level burn-in of electronic devices
02/27/2003WO2003017334A2 Dynamic control of wafer processing paths in semiconductor manufacturing processes
02/27/2003WO2003017333A1 Method for producing high carrier concentration p-type transparent conducting oxides
02/27/2003WO2003017332A1 Device for manipulation of a composite
02/27/2003WO2003017331A2 Memory cell with a trench capacitor and vertical selection transistor and annular contacting area formed between them
02/27/2003WO2003017330A2 Forming a semiconductor structure using a combination of planarizing methods and electropolishing
02/27/2003WO2003017328A2 Encapsulated integrated circuit package and method of manufacturing an integrated circuit package
02/27/2003WO2003017326A2 Methods of conducting wafer level burn-in of electronic devices
02/27/2003WO2003017325A2 Providing current control over wafer borne semiconductor devices using trenches
02/27/2003WO2003017322A2 A method and system for measurements in patterned structures
02/27/2003WO2003017318A1 Plasma reactor with adjustable dual frequency voltage division
02/27/2003WO2003017290A1 Production method for conductive paste and production method for printed circuit board
02/27/2003WO2003017285A1 Nonvolatile memory on soi and compound semiconductor substrates and methods of fabrication
02/27/2003WO2003017281A2 Memory circuit
02/27/2003WO2003017014A2 Tool services layer for providing tool service functions in conjunction with tool functions
02/27/2003WO2003017013A2 Experiment management system, method and medium
02/27/2003WO2003017005A1 Stable energy detector for extreme ultraviolet radiation detection
02/27/2003WO2003017001A1 Photosensitive resin composition for photoresist
02/27/2003WO2003016977A2 Objective with pupil obscuration
02/27/2003WO2003016922A2 Electronic circuit and method for testing
02/27/2003WO2003016588A1 Method of forming tungsten film
02/27/2003WO2003016586A1 Chemical vapor deposition system
02/27/2003WO2003016585A1 Sintered tungsten target for sputtering and method for preparation thereof
02/27/2003WO2003016424A1 Polishing slurry comprising silica-coated ceria
02/27/2003WO2003016419A1 Dicing adhesive sheet and dicing method
02/27/2003WO2003016213A1 Catalytic reactor apparatus and method for generating high purity water vapor
02/27/2003WO2003016160A1 Disposable syringe dispenser system
02/27/2003WO2003015982A2 System and method for processing semiconductor wafers using different wafer processes
02/27/2003WO2003015981A2 Improved chemical mechanical polishing compositions for metal and associated materials and method of using same
02/27/2003WO2003015896A2 Apparatus for and method of trapping products in exhaust gas
02/27/2003WO2003006183A3 Method and apparatus for cleaning semiconductor wafers and other flat media
02/27/2003WO2002101819A3 Leaky, thermally conductive insulator material (ltcim) in a semiconductor-on-insulator (soi) structure
02/27/2003WO2002101799A3 Stackable process chambers
02/27/2003WO2002101798A3 Method of applying liquid to a megasonic apparatus for improved cleaning control
02/27/2003WO2002101797A3 Megasonic cleaner and dryer system
02/27/2003WO2002101796A3 Megasonic cleaner and dryer system
02/27/2003WO2002099874A3 Minimizing resistance and electromigration of interconnect by adjusting anneal temperature and amount of seed layer dopant
02/27/2003WO2002093617A3 Device for loading and unloading silicon wafers in an oven from a multiple-cassette station
02/27/2003WO2002091461A3 Ionized pvd with sequential deposition and etching
02/27/2003WO2002088077A3 Resist compositions with polymers having pendant groups containing plural acid labile moieties
02/27/2003WO2002086949A3 Transport box for optical masks
02/27/2003WO2002080228A3 Structure including cubic boron nitride films
02/27/2003WO2002080225A3 Method and apparatus for growing submicron group iii nitride structures utilizing hvpe techniques
02/27/2003WO2002078082A3 Electronic structure
02/27/2003WO2002077709A3 Photoresist composition
02/27/2003WO2002077327A3 Mask plate design
02/27/2003WO2002073665A3 Workpiece distribution and processing in a high throughput stacked frame
02/27/2003WO2002069044A3 Polymers and photoresist compositions
02/27/2003WO2002068127A8 Manifolded fluid delivery system
02/27/2003WO2002065509A8 Measurement arrangement
02/27/2003WO2002059950A3 Reduction of damage in semiconductor container capacitors
02/27/2003WO2002058116A3 Integrated system for processing semiconductor wafers
02/27/2003WO2002056468A3 Method and system for efficient and accurate filtering and interpolation
02/27/2003WO2002054468A3 Iii-v nitride devices having a compliant substrate
02/27/2003WO2002052636A3 Method and apparatus for measuring reflectivity of deposited films
02/27/2003WO2002045145A3 Uv-free curing of organic dielectrica
02/27/2003WO2002044687A3 Method and device utilizing plasma source for real-time gas sampling
02/27/2003WO2002027770A3 Highly efficient capacitor structures with enhanced matching properties
02/27/2003WO2002019419A3 Substractive metallization structure and method of making
02/27/2003WO2002013239A3 Heater for jmf type wafers
02/27/2003WO2002012948A3 Pneumatic control system and method for shaping deformable mirrors in lithographic projection systems
02/27/2003WO2001097280A3 Quality control using profile library
02/27/2003WO2001028739A8 Device for polishing outer peripheral edge of semiconductor wafer
02/27/2003US20030041275 Semiconductor integrated circuit device
02/27/2003US20030040841 Robotic storage buffer system for substrate carrier pods
02/27/2003US20030040837 Article holders with sensors detecting a type of article held by the holder
02/27/2003US20030040831 Moving mechanism and stage system in exposure apparatus
02/27/2003US20030040830 Method and apparatus for providing intra-tool monitoring and control
02/27/2003US20030040447 In aqueous solution containing amine
02/27/2003US20030040269 Fan filter unit control system and clean room provided with same
02/27/2003US20030040261 Polishing apparatus and a method of polishing and cleaning and drying a wafer
02/27/2003US20030040199 Photo-assisted remote plasma apparatus and method
02/27/2003US20030040198 Temperature control method and semiconductor device manufacturing method
02/27/2003US20030040197 Vapor deposition of mixture
02/27/2003US20030040196 Method of forming insulation layer in semiconductor devices for controlling the composition and the doping concentration
02/27/2003US20030040195 Reducing current leakage; applying high energy beam
02/27/2003US20030040194 Spin-on glass composition and method of forming silicon oxide layer in semiconductor manufacturing process using the same
02/27/2003US20030040193 Method for enhancing substrate processing
02/27/2003US20030040192 Method for fabricating semiconductor device
02/27/2003US20030040191 Process for producing semiconductor device
02/27/2003US20030040190 Method for manufacturing a semiconductor device
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