Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2003
03/04/2003US6528367 Self-aligned active array along the length direction to form un-biased buried strap formation for sub-150 NM BEST DRAM devices
03/04/2003US6528366 Fabrication methods of vertical metal-insulator-metal (MIM) capacitor for advanced embedded DRAM applications
03/04/2003US6528365 Semiconductor memory device and method for manufacturing the same
03/04/2003US6528364 Methods to form electronic devices and methods to form a material over a semiconductive substrate
03/04/2003US6528363 Fabrication of notched gates by passivating partially etched gate sidewalls and then using an isotropic etch
03/04/2003US6528362 Metal gate with CVD amorphous silicon layer for CMOS devices and method of making with a replacement gate process
03/04/2003US6528361 Process for preparing a polycrystalline silicon thin film
03/04/2003US6528360 Semiconductor device and process for manufacturing the same, and electronic device
03/04/2003US6528359 Laser annealing method and laser annealing device
03/04/2003US6528358 Semiconductor device and method for fabricating the same
03/04/2003US6528357 Method of manufacturing array substrate
03/04/2003US6528356 Manufacture of semiconductor capacitively-coupled NDR device for applications such as high-density high-speed memories and power switches
03/04/2003US6528355 Method for fabricating a trench MOS power transistor
03/04/2003US6528354 Method of manufacturing a semiconductor device
03/04/2003US6528351 Integrated package and methods for making same
03/04/2003US6528350 Method for fabricating a metal plated spring structure
03/04/2003US6528349 Monolithically-fabricated compliant wafer-level package with wafer level reliability and functionality testability
03/04/2003US6528348 Semiconductor device having protruding electrodes higher than a sealed portion
03/04/2003US6528347 Manufacturing method for making a microwave semiconductor device with improved heat discharge and electric properties
03/04/2003US6528346 Bump-forming method using two plates and electronic device
03/04/2003US6528345 Process line for underfilling a controlled collapse
03/04/2003US6528344 Chip scale surface-mountable packaging method for electronic and MEMS devices
03/04/2003US6528343 Semiconductor device its manufacturing method and electronic device
03/04/2003US6528341 Method of forming a sion antireflection film which is noncontaminating with respect to deep-uv photoresists
03/04/2003US6528335 Electrical method for assessing yield-limiting asperities in silicon-on-insulator wafers
03/04/2003US6528334 Semiconductor inspection system, and method of manufacturing a semiconductor device
03/04/2003US6528333 Method of and device for detecting micro-scratches
03/04/2003US6528332 Method and system for reducing polymer build up during plasma etch of an intermetal dielectric
03/04/2003US6528331 Method for identifying and controlling impact of ambient conditions on photolithography processes
03/04/2003US6528330 Semiconductor device manufacturing method
03/04/2003US6528328 Methods of preventing reduction of irox during PZT formation by metalorganic chemical vapor deposition or other processing
03/04/2003US6528327 Method for fabricating semiconductor memory device having a capacitor
03/04/2003US6528233 Chemical amplification type negative-working resist composition for electron beams or X-rays
03/04/2003US6528229 Mixture of polymer and acid generators
03/04/2003US6528216 Phase shift mask and fabrication method thereof
03/04/2003US6528180 Liner materials
03/04/2003US6528172 Coating solutions for use in forming bismuth-based ferroelectric thin films, and ferroelectric thin films, ferroelectric capacitors and ferroelectric memories formed with said coating solutions, as well as processes for production thereof
03/04/2003US6528169 No-flow flux adhesive compositions
03/04/2003US6528153 Low dielectric constant porous materials having improved mechanical strength
03/04/2003US6528145 Polymer and ceramic composite electronic substrates
03/04/2003US6528130 Liquefaction and cooling of oil smoke using vacuum and diffusion pumps; vapor deposition
03/04/2003US6528128 Method of treating a substrate
03/04/2003US6528124 Disk carrier
03/04/2003US6528116 Apparatus generally comprises a process chamber having one or more walls and a lid and two heat exchangers. A first heat exchanger is coupled to the walls and a second heat exchanger is coupled to the lid. The two heat exchangers are configured
03/04/2003US6528108 A reactant gas is introduced into a process chamber under a temperature which is lower than reactive temperature of the reactant gas so that voids in a porous amorphous insulation film on a sample is filled with the introduced reactant gas.
03/04/2003US6528000 Molding apparatus for use in manufacture of resin shielding semiconductor device
03/04/2003US6527969 Method and apparatus for rejuvenating polishing slurry
03/04/2003US6527968 Two-stage self-cleaning silicon etch process
03/04/2003US6527966 Forming a pattern composed of an etchable layer by conducting dry etching of an etchable layer formed on a substrate for semiconductor through a mask of patterned radiation sensitive material coating formed on the etchable layer
03/04/2003US6527964 Methods and apparatuses for improved flow in performing fluidic self assembly
03/04/2003US6527935 Process for electroplating pins of an integrated circuit package
03/04/2003US6527926 Electroplating reactor including back-side electrical contact apparatus
03/04/2003US6527925 Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
03/04/2003US6527918 Method and apparatus for low voltage plasma doping using dual pulses
03/04/2003US6527912 Stacked RF excitation coil for inductive plasma processor
03/04/2003US6527911 Configurable plasma volume etch chamber
03/04/2003US6527910 Staggered in-situ deposition and etching of a dielectric layer for HDP-CVD
03/04/2003US6527908 Plasma process apparatus
03/04/2003US6527905 Method for mounting electronic components and apparatus and dispenser used in the method
03/04/2003US6527884 Hydrogen annealing process and apparatus therefor
03/04/2003US6527870 Wafer cleaning module and method for cleaning the surface of a substrate
03/04/2003US6527867 Method for enhancing anti-reflective coatings used in photolithography of electronic devices
03/04/2003US6527865 Temperature controlled gas feedthrough
03/04/2003US6527862 Flow controller
03/04/2003US6527861 Developing apparatus with a porous film nozzle
03/04/2003US6527860 Substrate processing apparatus
03/04/2003US6527858 Comprising a single crystal of zinc oxide (ZnO) that contains a p-type dopant composed of nitrogen (N), and an n-type dopant composed of any one or more elements selected from boron, aluminum, gallium, and hydrogen
03/04/2003US6527856 Flat in order to promote perfect two-dimensional epitaxial growth, and also provides A-site surface termination
03/04/2003US6527853 Method for producing nitride monocrystals
03/04/2003US6527847 Coating composition
03/04/2003US6527819 Polishing slurries for copper and associated materials
03/04/2003US6527817 Composition and method for planarizing surfaces
03/04/2003US6527627 Semiconductor wafer grinding method
03/04/2003US6527624 Carrier head for providing a polishing slurry
03/04/2003US6527622 CMP method for noble metals
03/04/2003US6527163 Methods of making bondable contacts and a tool for making such contacts
03/04/2003US6527159 Surface mounting to an irregular surface
03/04/2003US6527158 Method and apparatus for forming solder bumps
03/04/2003US6527101 Attitude changing device for electronic chips
03/04/2003US6527031 Sample separating apparatus and method, and substrate manufacturing method
03/04/2003US6527027 Single-point bonding apparatus
03/04/2003US6526997 Dry cleaning method for the manufacture of integrated circuits
03/04/2003US6526996 Dry clean method instead of traditional wet clean after metal etch
03/04/2003US6526995 Brushless multipass silicon wafer cleaning process for post chemical mechanical polishing using immersion
03/04/2003US6526910 Apparatus and method for forming a deposited film by means of plasma CVD
03/04/2003US6526655 Angled flying lead wire bonding process
03/04/2003US6526654 Method of producing double-sided circuit board
02/2003
02/27/2003WO2003017724A2 Power and/or energy monitor, method of using, and display device
02/27/2003WO2003017557A2 Method of high pass filtering a data set
02/27/2003WO2003017479A2 Electronic device and method of testing and of manufacturing
02/27/2003WO2003017374A2 Memory cell
02/27/2003WO2003017373A2 Piezoelectric coupled component integrated devices
02/27/2003WO2003017367A1 Microelectronic packages including thin film decal and dielectric adhesive layer having conductive vias therein, and methods of fabricating the same
02/27/2003WO2003017366A1 Method for forming a flip chip on leadframe semiconductor package
02/27/2003WO2003017363A1 Adhesive tape
02/27/2003WO2003017362A1 Integrated circuit with dram memory cell
02/27/2003WO2003017361A1 Integrated circuit comprising dram memory cells and the production method therefor
02/27/2003WO2003017360A1 Integrated circuit with dram memory cell and the production method thereof
02/27/2003WO2003017359A1 Semiconductor device and production method therefor, and plating solution
02/27/2003WO2003017358A1 Method of manufacturing a semiconductor structure comprising sic on an oxide layer
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