Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2003
02/27/2003US20030040189 Shallow trench isolation fabrication
02/27/2003US20030040188 Method for dishing reduction and feature passivation in polishing processes
02/27/2003US20030040187 Method for fabricating semiconductor device
02/27/2003US20030040186 Methods of forming materials over uneven surface topologies, and methods of forming insulative materials over and between conductive lines
02/27/2003US20030040185 Process for device using partial SOI
02/27/2003US20030040184 Method for fabricating a self-aligning mask
02/27/2003US20030040183 Method for manufacturing semiconductor integrated circuit device
02/27/2003US20030040182 Methods and compositions for chemical mechanical polishing
02/27/2003US20030040181 Method of manufacturing semiconductor device
02/27/2003US20030040179 Polysilicon processing using an anti-reflective dual layer hardmask for 193 nm lithography
02/27/2003US20030040178 Method and apparatus for micromachining using a magnetic field and plasma etching
02/27/2003US20030040177 Method for forming metal interconnections using electroless plating
02/27/2003US20030040176 Plurality of storage devices individually coupled with the plurality of tied and floating body devices; data processing; insulator on semiconductors
02/27/2003US20030040174 Method for preventing photoresist poisoning in semiconductor fabrication
02/27/2003US20030040172 Aluminum hardmask for dielectric etch
02/27/2003US20030040171 Method of composite gate formation
02/27/2003US20030040170 Method of reducing the conductivity of a semiconductor and devices made thereby
02/27/2003US20030040169 Source/drain extension fabrication process with direct implantation
02/27/2003US20030040167 Compound crystal and method of manufacturing same
02/27/2003US20030040165 Method for rounding bottom corner in LOCOS process by using high density plasma poly etcher
02/27/2003US20030040164 Thin film device transfer method, thin film device, thin film integrated circuit device, active matrix board, liquid crystal display, and electronic apparatus
02/27/2003US20030040163 Method for manufacturing bonded wafer
02/27/2003US20030040162 Method for fabricating a capacitor
02/27/2003US20030040161 Method of producing an integrated component with a metal-insulator-metal capacitor
02/27/2003US20030040159 Method of manufacturing lateral double-diffused metal oxide semiconductor device
02/27/2003US20030040158 Semiconductor device and method of fabricating the same
02/27/2003US20030040156 Nano-meter memory device and method of making the same
02/27/2003US20030040155 Methods of electrically contacting to conductive plugs, methods of forming contact openings, and methods of forming dynamic random access memory circuitry
02/27/2003US20030040154 Novel DRAM access transistor
02/27/2003US20030040153 Semiconductor device incorporated therein high K capacitor dielectric and method for the manufacture thereof
02/27/2003US20030040152 Method of fabricating a NROM cell to prevent charging
02/27/2003US20030040150 Thin film semiconductor device and method of manufacturing the same
02/27/2003US20030040148 Fabricating dual voltage CMOSFETs using additional implant into core at high voltage mask
02/27/2003US20030040147 Ldmos device with double n-layering and process for its manufacture
02/27/2003US20030040146 Mask for forming polysilicon and a method for fabricating thin film transistor using the same
02/27/2003US20030040145 Method for transferring and stacking of semiconductor devices
02/27/2003US20030040144 Trench DMOS transistor with embedded trench schottky rectifier
02/27/2003US20030040143 Method of fabricating a substrate-based semiconductor package without mold flash
02/27/2003US20030040140 Semiconductor memory device and method of manufacturing semiconductor device with chip on chip structure
02/27/2003US20030040138 Method of manufacturing circuit device
02/27/2003US20030040136 Method of manufacture of a semiconductor structure
02/27/2003US20030040132 Evaluation method for evaluating insulating film, evaluation device therefor and method for manufacturing evaluation device
02/27/2003US20030040131 Semiconductor chip, semiconductor integrated circuit device using the same, and method of selecting semiconductor chip
02/27/2003US20030040130 Method for selection of parameters for implant anneal of patterned semiconductor substrates and specification of a laser system
02/27/2003US20030039951 Apparatus and process for controlling the temperature of a substrate in a plasma reactor
02/27/2003US20030039923 Method of forming a pattern on a semiconductor wafer using an attenuated phase shifting reflective mask
02/27/2003US20030039922 Method of making an integrated circuit using a reflective mask
02/27/2003US20030039905 Method for controlling the quality of a lithographic structuring step
02/27/2003US20030039903 Semiconductor structure, capacitor, mask and methods of manufacture thereof
02/27/2003US20030039897 Semiconductor device manufacturing mask substrate and semiconductor device manufacturing method
02/27/2003US20030039895 Photomask, method for manufacturing the same and method for detecting/repairing defects in photomask
02/27/2003US20030039866 Sputtering
02/27/2003US20030039845 Overcoating of semiconductor with dielectric; sputtering with copper
02/27/2003US20030039841 Enhanced ceramic layers for laminated ceramic devices and method
02/27/2003US20030039796 Ceramic substrate for semiconductor production and inspection devices
02/27/2003US20030039766 Mutlistage pressurized vapor deposition; for semiconductors
02/27/2003US20030039743 Controlling concentration of bath; analyzing, calibration, adjustment
02/27/2003US20030039571 Enclosure for a semiconductor device
02/27/2003US20030039388 Machine vision and semiconductor handling
02/27/2003US20030039387 Method and apparatus for inspecting defects on polishing pads to be used with chemical mechanical polishing apparatus
02/27/2003US20030039286 Comprises peeling of electroconductive type cladding layers; for forming a resonance mirror via irradiation
02/27/2003US20030039282 Integrated arrays of modulators and lasers on electronics
02/27/2003US20030039161 Semiconductor device, semiconductor device design method, semiconductor device design method recording medium, and semiconductor device design support system
02/27/2003US20030039158 Semiconductor device, such as a synchronous dram, including a control circuit for reducing power consumption
02/27/2003US20030039153 EEPROM array and method for operation thereof
02/27/2003US20030039146 Non-volatile semiconductor memory and method of operating the same
02/27/2003US20030039106 Double-sided wiring board and its manufacture method
02/27/2003US20030039102 Semiconductor chip mounting substrate and semiconductor device using it
02/27/2003US20030039091 Capacitor in semiconductor device
02/27/2003US20030039087 Substrate support apparatus to facilitate particle removal
02/27/2003US20030039062 Magnetic field sensor and magnetic reading head
02/27/2003US20030039042 Multilayer-coated reflective mirrors for X-ray optical systems, and methods for producing same
02/27/2003US20030039029 Reflection type demagnification optical system, exposure apparatus, and device fabricating method
02/27/2003US20030039028 High numerical aperture projection for microlithography
02/27/2003US20030038947 Tilted interferometer
02/27/2003US20030038937 Projection exposure apparatus and device manufacturing method using the same
02/27/2003US20030038932 Arrangement and method for inspecting unpatterned wafers
02/27/2003US20030038931 Illumination optical apparatus, exposure apparatus and method of exposure
02/27/2003US20030038929 Exposure system, exposure apparatus and coating and developing exposure apparatus
02/27/2003US20030038903 Substrate having buried structure, display device including the substrate, method of making the substrate and method for fabricating the display device
02/27/2003US20030038901 Method for manufacturing a thin film transistor array panel
02/27/2003US20030038899 Thin film transistor liquid crystal display and method for manufacturing the same
02/27/2003US20030038771 Semiconductor integrated circuit and liquid crystal display device
02/27/2003US20030038735 Speed typing apparatus and method
02/27/2003US20030038697 Spiral inductor having parallel-branch structure
02/27/2003US20030038688 Device and method for coupling two circuit components which have different impedances
02/27/2003US20030038673 Semiconductor device
02/27/2003US20030038667 Potential detector and semiconductor integrated circuit
02/27/2003US20030038664 Semiconductor integrated circuit
02/27/2003US20030038647 Probe card for probing wafers with raised contact elements
02/27/2003US20030038645 Electron beam test system and electron beam test method
02/27/2003US20030038642 Methods to prevent metal deposited wafers from contaminating the front-end cleaning sinks or front end furnaces
02/27/2003US20030038622 Probe station having multiple enclosures
02/27/2003US20030038383 Semiconductor substrate and process for its production
02/27/2003US20030038381 Interposer utilizing a perimeter wall to underfill the area between a flip chip and the interposer
02/27/2003US20030038380 Apparatus for packing semiconductor die
02/27/2003US20030038379 Laminate film for mounting electronic devices and film carrier tape for mounting electronic devices
02/27/2003US20030038378 Microelectronic packages including thin film decal and dielectric adhesive layer having conductive vias therein
02/27/2003US20030038377 Flip chip semiconductor integrated circuit
02/27/2003US20030038376 Semiconductor die packages with standard ball grid array footprint and method for assembling the same
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