Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2003
03/11/2003US6531359 Method for fabricating a memory cell array
03/11/2003US6531358 Method of fabricating capacitor-under-bit line (CUB) DRAM
03/11/2003US6531357 Method of manufacturing a semiconductor device
03/11/2003US6531356 Semiconductor devices and methods of manufacturing the same
03/11/2003US6531355 LDMOS device with self-aligned RESURF region and method of fabrication
03/11/2003US6531354 Lanthanum oxide-based gate dielectrics for integrated circuit field effect transistors
03/11/2003US6531353 Method for fabricating semiconductor device
03/11/2003US6531352 Methods of forming conductive interconnects
03/11/2003US6531351 Method for forming a CMOS circuit of GaAS/Ge on Si substrate
03/11/2003US6531350 Twin MONOS cell fabrication method and array organization
03/11/2003US6531349 Method of etching polycrystalline silicon film by using two consecutive dry-etching processes
03/11/2003US6531348 Method for crystallizing amorphous silicon and fabricating thin film transistor using crystallized silicon
03/11/2003US6531347 Method of making recessed source drains to reduce fringing capacitance
03/11/2003US6531346 Fabrication method of thin film transistor substrate for X-ray detector
03/11/2003US6531345 Method and apparatus for fabricating electronic device
03/11/2003US6531343 Method of encapsulating a circuit assembly
03/11/2003US6531341 Method of fabricating a microelectronic device package with an integral window
03/11/2003US6531340 Low temperature die attaching material for BOC packages
03/11/2003US6531338 Method of manufacturing a semiconductor structure having stacked semiconductor devices
03/11/2003US6531337 Method of manufacturing a semiconductor structure having stacked semiconductor devices
03/11/2003US6531336 Semiconductor apparatus, method of fabricating thereof, fabricating apparatus, circuit board, and electronic device
03/11/2003US6531334 Method for fabricating hollow package with a solid-state image device
03/11/2003US6531333 Chip photoelectric sensor assembly and method for making same
03/11/2003US6531330 Method of fabricating thin film transistor flat panel display
03/11/2003US6531327 Method for manufacturing semiconductor device utilizing semiconductor testing equipment
03/11/2003US6531325 Memory transistor and method of fabricating same
03/11/2003US6531324 MFOS memory transistor & method of fabricating same
03/11/2003US6531267 Process for producing acid sensitive liquid composition containing a carbonate
03/11/2003US6531265 Using a Fence Creation and Elimination (FCE) planarization process; for VLSI (Very Large Scale Integration) technology; replaces chemical mechanical polishing to eliminate it associated defects
03/11/2003US6531251 Calculating exposure dose at specified regions of the sensitive substrate to determine expected proximity effects at the specified regions; mathematical equations; making microelectronics
03/11/2003US6531250 Half-tone phase shift mask having a stepped aperture
03/11/2003US6531249 Reticle blanks for charged-particle-beam microlithography and methods for making same
03/11/2003US6531235 Silicon, a buffer layer, template layer comprises a perovskite oxide
03/11/2003US6531232 System for assembling substrates to bonding zones provided with cavities
03/11/2003US6531226 Brazeable metallizations for diamond components
03/11/2003US6531193 Low temperature, high quality silicon dioxide thin films deposited using tetramethylsilane (TMS) for stress control and coverage applications
03/11/2003US6531191 Method of manufacturing a sintered structure on a substrate
03/11/2003US6531083 Sproutless pre-packaged molding for component encapsulation
03/11/2003US6531071 Iminocarboxylic acid etch retardant
03/11/2003US6531068 Method of anisotropic etching of silicon
03/11/2003US6531067 Method for forming contact hole
03/11/2003US6531046 Contacting metal seed layer on substrate with acidic electrolyte bath containing acids, copper compounds, suppressors and water, then subjecting to current
03/11/2003US6531031 Plasma etching installation
03/11/2003US6531029 Vacuum plasma processor apparatus and method
03/11/2003US6531026 Method for mounting electronic elements
03/11/2003US6531022 Mounting method of semiconductor element
03/11/2003US6530995 Tetraorganoammonium beta -diketonate-containing compounds used in processing (e.g., planarizing, polishing, cleaning) the surface of semiconductor substrate
03/11/2003US6530994 Platform for supporting a semiconductor substrate and method of supporting a substrate during rapid high temperature processing
03/11/2003US6530993 Cluster tool for fabricating semiconductor device
03/11/2003US6530992 Method of forming a film in a chamber and positioning a substitute in a chamber
03/11/2003US6530991 Method for the formation of semiconductor layer
03/11/2003US6530990 Susceptor designs for silicon carbide thin films
03/11/2003US6530977 Abatement of semiconductor processing gases
03/11/2003US6530968 Chemical mechanical polishing slurry
03/11/2003US6530967 Stabilized slurry compositions
03/11/2003US6530827 Apparatus for polishing wafer and method of doing the same
03/11/2003US6530826 Removing haze following epitaxially coating
03/11/2003US6530824 Method and composition for polishing by CMP
03/11/2003US6530823 Methods for cleaning surfaces substantially free of contaminants
03/11/2003US6530764 Mold for resin-sealing of semiconductor devices
03/11/2003US6530736 SMIF load port interface including smart port door
03/11/2003US6530735 Gripper assembly
03/11/2003US6530734 Methods and apparatus for positive wafer process status identification during semiconductor wafer processing
03/11/2003US6530733 Substrate processing pallet and related substrate processing method and machine
03/11/2003US6530732 Transporting from external to vacuum environment and back without damaging; no thermal shock; uniformity; low cost; simple
03/11/2003US6530512 Wire bonding apparatus and wire bonding method
03/11/2003US6530466 Overhead conveyance device and overhead conveyance vehicle
03/11/2003US6530397 Multi-channel rotary joint
03/11/2003US6530388 Volume efficient cleaning systems
03/11/2003US6530385 Apparatus and method for wet cleaning or etching a flat substrate
03/11/2003US6530381 Process for the wet-chemical surface treatment of a semiconductor wafer
03/11/2003US6530380 Method for selective oxide etching in pre-metal deposition
03/11/2003US6530342 Large area plasma source
03/11/2003US6530341 Deposition apparatus for manufacturing thin film
03/11/2003US6530340 Apparatus for manufacturing planar spin-on films
03/11/2003US6530157 Precise positioning device for workpieces
03/11/2003US6530146 Apparatus for mounting a flipchip on a work piece
03/11/2003US6530136 Method for transporting and installing a semiconductor manufacturing apparatus
03/11/2003US6530113 Apparatus for selective removal of material from wafer alignment marks
03/11/2003CA2402089A1 Workpiece holder for processing apparatus, and processing apparatus using the same
03/06/2003WO2003020004A1 Layered circuit boards and methods of production thereof
03/06/2003WO2003019695A1 Molecular memory and method for making same
03/06/2003WO2003019693A2 Solutions of organic semiconductors
03/06/2003WO2003019691A2 Manufacturing of non-volatile resistance variable devices and programmable memory cells
03/06/2003WO2003019675A1 Improved semiconductor device for isolating a photodiode to reduce junction leakage and method of formation
03/06/2003WO2003019672A1 Complete depletion soi transistor manufacturing method
03/06/2003WO2003019671A2 Vertical dual gate field effect transistor
03/06/2003WO2003019664A2 Non-volatile semiconductor memory
03/06/2003WO2003019663A1 Semiconductor storage and its manufacturing method
03/06/2003WO2003019662A1 Spiral inductor having parallel-branch structure
03/06/2003WO2003019657A2 Integrated circuit device with bump bridges and method for making the same
03/06/2003WO2003019656A2 Interconnect module with reduced power distribution impedance
03/06/2003WO2003019654A1 Stacked chip assembly with stiffening layer
03/06/2003WO2003019653A2 Method for producing contacts and printed circuit packages
03/06/2003WO2003019652A2 Method for fixing an electrical element and a module with an electrical element fixed thus
03/06/2003WO2003019651A2 Through-via vertical interconnects, through-via heat sinks and associated fabrication methods
03/06/2003WO2003019650A1 Semiconductor device and production method therefor
03/06/2003WO2003019649A2 Strip conductor arrangement and method for producing a strip conductor arrangement
03/06/2003WO2003019648A1 Semiconductor processing system
03/06/2003WO2003019647A1 Epitaxial wafer and production method therefor