Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2003
03/06/2003US20030044742 A positive pressure gradient is maintained across an open access port of an interface chamber such as a load lock chamber which provides an interface between a low pressure chamber and a high pressure area; processing a semiconductor
03/06/2003US20030044731 Solution of a low concentration is supplied first onto a wafer and left to stand to permit a developing reaction to proceed, followed by further supplying a developing solution of a higher concentration, letting it stand and rinsing
03/06/2003US20030044730 Substrate having character/symbol section and processing method of character/symbol section
03/06/2003US20030044729 Method of manufacturing phase grating image sensor
03/06/2003US20030044726 Conformally forming an antireflectance coating layer over an inter-metal dielectric layer including at least one via opening extending perpendicular to a thickness therethrough
03/06/2003US20030044725 Dual damascene process using metal hard mask
03/06/2003US20030044723 Carrying out a sequence of structuring steps in a self-adjusting manner; steps may be etching, implantation or CVD
03/06/2003US20030044722 Process for improving critical dimension uniformity
03/06/2003US20030044721 Fabrication method of semiconductor integrated circuit device
03/06/2003US20030044717 Positive photosensitive composition
03/06/2003US20030044716 Comprising a resin, a photoacid generator compound, and an acid; improved storage stability; preferably contains an ester solvent such as ethyl lactate or propylene glycol monomethyl ether acetate
03/06/2003US20030044715 Positive photoresist composition
03/06/2003US20030044703 The simulation is based on calculations of resist development rate; resist is estimated by focusing on the separation of resist molecules that occurs during resist development
03/06/2003US20030044697 Methods and apparatus for correcting the proximity effect in a charged-particle-beam microlithography system and devices manufactured from the same
03/06/2003US20030044694 Improved the accuracy of critical dimensions of the mask pattern.
03/06/2003US20030044653 Aluminum nitride sintered compact, ceramic substrate, ceramic heater and electrostatic chuck
03/06/2003US20030044622 Having controlled distribution of defects, in which denuded zones having a sufficient depth inward from the surface of the wafer are combined with a high gettering effect in a bulk region of the wafer.
03/06/2003US20030044621 Process for controlling thin film uniformity and products produced thereby
03/06/2003US20030044616 Semiconductor wafer and vapor phase growth apparatus
03/06/2003US20030044589 Ceramic board for apparatuses for semiconductor manufacture and inspection
03/06/2003US20030044542 Method for forming a liquid film on a substrate
03/06/2003US20030044534 Multi-pin epoxy writing apparatus
03/06/2003US20030044533 From bis(trimethylsilyl)methane and oxygen retaining gas and hydrogen
03/06/2003US20030044532 Critical point drying technique; by changing the pressure and temperature, a liquid component is released from a specific wet film composition.
03/06/2003US20030044531 Film forming apparatus and film forming method
03/06/2003US20030044529 Method of depositing thin film
03/06/2003US20030044340 Separation mixture containing slvent and etching impurities
03/06/2003US20030044335 Using oxidizer
03/06/2003US20030044328 Generation high temperature flames; decomposing wastes; air pollution control
03/06/2003US20030044268 Unified frame for semiconductor material handling system
03/06/2003US20030044262 Load handling system
03/06/2003US20030044261 Semiconductor material handling system
03/06/2003US20030044057 Method of checking overlap accuracy of patterns on four stacked semiconductor layers
03/06/2003US20030043949 Radio frequency data communications device
03/06/2003US20030043645 Device and method for using complementary bits in a memory array
03/06/2003US20030043637 Flash memory with low tunnel barrier interpoly insulators
03/06/2003US20030043633 Programmable array logic or memory with p-channel devices and asymmetrical tunnel barriers
03/06/2003US20030043630 Low tunnel barrier intergate insulator includes insulator comprising oxide of nickel, aluminum, tantalum, titantium, zirconium, niobium, yttrium, gadolinium; strontium orlead titanate; lead zirconate; or strontium-bismuth tantalate
03/06/2003US20030043620 Thin-film magnetic memory device with memory cells having magnetic tunnel junction
03/06/2003US20030043618 Semiconductor memory device including shadow ram
03/06/2003US20030043614 Magnetic memory array architecture
03/06/2003US20030043530 Electrostatic chuck for preventing an arc
03/06/2003US20030043517 Electro-static discharge protecting circuit
03/06/2003US20030043462 Optical unit having plural optical elements
03/06/2003US20030043456 Multilayer extreme ultraviolet mirrors with enhanced reflectivity
03/06/2003US20030043455 Collector for an illumination system with a wavelength of less than or equal to 193 nm
03/06/2003US20030043384 Dynamic interferometer controlling direction of input beam
03/06/2003US20030043382 Apparatus and method for determining the active dopant profile in a semiconductor wafer
03/06/2003US20030043357 Vacuum chamber having instrument- mounting bulkhead exhibiting reduced deformation in response to pressure differential, and energy-beam systems comprising same
03/06/2003US20030043354 Lithographic apparatus, device manufacturing method, and device manufactured thereby
03/06/2003US20030043352 Exposure apparatus and a device manufacturing method which keep temperature of a diaphragm of a projection optical system substantially constant
03/06/2003US20030043309 Active matrix substrate and manufacturing method thereof
03/06/2003US20030043061 D/A conversion circuit and semiconductor device
03/06/2003US20030043010 Integrated helix coil inductor on silicon
03/06/2003US20030042965 Semiconductor device
03/06/2003US20030042931 Architecture and interconnect scheme for programmable logic circuits
03/06/2003US20030042928 S-parameter microscopy for semiconductor devices
03/06/2003US20030042921 High resolution analytical probe station
03/06/2003US20030042920 Exposure apparatus, control method for the same, and device fabricating method
03/06/2003US20030042915 Methods to prevent metal deposited wafers from contaminating the front-end cleaning sinks or front end furnaces
03/06/2003US20030042888 Semiconductor integrated circuit allowing proper detection of pin contact failure
03/06/2003US20030042832 Processor and method for processing
03/06/2003US20030042628 Cross-diffusion resistant dual-polycide semiconductor structure and method
03/06/2003US20030042627 Method of alignment for buried structures formed by surface transformation of empty spaces in solid state materials
03/06/2003US20030042625 Molding die set and semiconductor device fabricated using the same
03/06/2003US20030042623 Semiconductor memory chip and semiconductor memory device using the same
03/06/2003US20030042622 Semiconductor device and wire bonding apparatus
03/06/2003US20030042621 Wire stitch bond on an integrated circuit bond pad and method of making the same
03/06/2003US20030042620 Pad- rerouting for integrated circuit chips
03/06/2003US20030042618 Semiconductor device and a method of manufacturing the same
03/06/2003US20030042617 Microelectronic devices and methods of manufacture
03/06/2003US20030042615 Stacked microelectronic devices and methods of fabricating same
03/06/2003US20030042614 Metal silicide adhesion layer for contact structures
03/06/2003US20030042613 Barrier dielectric covering copper wires
03/06/2003US20030042612 Method for producing cavities with submicrometer patterns in a semiconductor device using a freezing process liquid
03/06/2003US20030042611 Semiconductor device and method for manufacturing the same
03/06/2003US20030042610 Semiconductor device and a manufacturing method thereof
03/06/2003US20030042609 Semiconductor device and method of fabricating the same
03/06/2003US20030042608 Silicon nitride adhesive
03/06/2003US20030042607 Diffusion barrier layer for semiconductor wafer fabrication
03/06/2003US20030042606 Semiconductor structure; filling contactor aperture; heating at high temperature; low pressure vapor deposition
03/06/2003US20030042605 Concentration graded carbon doped oxide
03/06/2003US20030042598 Hermetic seal
03/06/2003US20030042595 Spring bias electrical contactors; lamination sheet
03/06/2003US20030042589 Stack chip module
03/06/2003US20030042584 Semiconductor device and method of manufacturing the same
03/06/2003US20030042581 Packaged microelectronic devices and methods of forming same
03/06/2003US20030042578 Crystal growth process, semiconductor device, and its production process
03/06/2003US20030042575 Insulated gate bipolar transistor, semiconductor device, method of manufacturing insulated-gate bipolar transistor, and method of manufacturing semiconductor device
03/06/2003US20030042569 Open pattern inductor
03/06/2003US20030042568 Method of manufacturing MOSEFT and structure thereof
03/06/2003US20030042567 Method and system for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules
03/06/2003US20030042564 Semiconductor device having an interconnecting post formed on an interposer within a sealing resin
03/06/2003US20030042562 Magnetoresistive device and electronic device
03/06/2003US20030042560 Micro-electromechanical switch fabricated by simultaneous formation of a resistor and bottom electrode
03/06/2003US20030042559 Semiconductor device and a method for manufacturing the same
03/06/2003US20030042558 Nonvolatile semiconductor memory device having erasing characteristic improved
03/06/2003US20030042557 Semiconductor device and manufacturing method thereof
03/06/2003US20030042556 Semiconductor devices and their manufacture
03/06/2003US20030042555 Transistor and diode