| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/24/2003 | WO2003034472A2 Precision bond head for mounting semiconductor chips |
| 04/24/2003 | WO2003034470A2 Semiconductor structure with improved smaller forward voltage loss and higher blocking capability |
| 04/24/2003 | WO2003034469A2 Method of fabricating a device having a desired non-planar surface or profile and device produced thereby |
| 04/24/2003 | WO2003034463A2 Tunable multi-zone gas injection system |
| 04/24/2003 | WO2003034419A1 Substrate-holder |
| 04/24/2003 | WO2003034379A2 Active matrix display device |
| 04/24/2003 | WO2003034331A1 Smart card having a memory using a ultra-thin dielectric |
| 04/24/2003 | WO2003034154A1 A method of photoresist removal in the presence of a dielectric layer having a low k-value |
| 04/24/2003 | WO2003034153A2 Lithographic apparatus and device manufacturing method |
| 04/24/2003 | WO2003034152A1 Composition for forming antireflection film for lithography |
| 04/24/2003 | WO2003034151A1 Photoresist composition having a high heat resistance |
| 04/24/2003 | WO2003034149A1 Process and materials for formation of patterned films of functional materials |
| 04/24/2003 | WO2003034130A2 Methods of fabricating patterned layers on a substrate |
| 04/24/2003 | WO2003034078A1 Probe pin, probe card, test apparatus, and method of manufacturing probe pin |
| 04/24/2003 | WO2003033973A1 Heating medium circulating device and thermal treatment equipment using the device |
| 04/24/2003 | WO2003033781A1 Low temperature epitaxial growth of quaternary wide bandgap semiconductors |
| 04/24/2003 | WO2003033765A1 Plating apparatus |
| 04/24/2003 | WO2003033763A1 Method and device for monitoring a cvd process |
| 04/24/2003 | WO2003033762A1 Atomic layer deposition apparatus and process |
| 04/24/2003 | WO2003033687A2 Lift-off process for a hard etch mask for magnetic memory cells in mram devices |
| 04/24/2003 | WO2003033428A1 Recycle for supercritical carbon dioxide |
| 04/24/2003 | WO2003033377A1 Gaskets for substrate containers and substrate containers equipped with the same |
| 04/24/2003 | WO2003033353A1 System for embossing carrier tape and method for producing carrier tape |
| 04/24/2003 | WO2003033208A1 Assembly system for stationing semiconductor wafer and process f or manufacturing semiconductor wafer |
| 04/24/2003 | WO2003033199A1 Method for improved wafer alignment |
| 04/24/2003 | WO2003033169A1 Method of titanium and titanium nitride layer deposition |
| 04/24/2003 | WO2003033114A1 Central carbon dioxide purifier |
| 04/24/2003 | WO2003012851A3 Method of etching ferroelectric layers |
| 04/24/2003 | WO2003009375A3 Semiconductor back side processing |
| 04/24/2003 | WO2003009369A3 Sol solution for producing glass coatings for electrically conductive materials that can be used in anodic bonding |
| 04/24/2003 | WO2003007361A3 Method for producing a bipolar transistor comprising a polysilicon emitter |
| 04/24/2003 | WO2003005437A3 Interconnect system and method of fabrication |
| 04/24/2003 | WO2002085570A3 Conductive polishing article for electrochemical mechanical polishing |
| 04/24/2003 | WO2002073668A3 Method of deep trench formation with improved profile control and surface area |
| 04/24/2003 | WO2002065109A3 Automated control of metal thickness during film deposition |
| 04/24/2003 | WO2002050889A3 Contact hump construction for the production of a connector construction for substrate connecting surfaces |
| 04/24/2003 | WO2002047161A3 Barrier against overflow for fixing adhesive of a semiconductor chip |
| 04/24/2003 | WO2002039490A3 A power distribution printed circuit board for a semiconductor processing system |
| 04/24/2003 | WO2002005313A3 Automated processing system |
| 04/24/2003 | US20030079194 Method of automatic layout design for LSI, mask set and semiconductor integrated circuit manufactured by automatic layout design method, and recording medium storing automatic layout design program |
| 04/24/2003 | US20030079162 Test executive system with progress window |
| 04/24/2003 | US20030078682 Simulation apparatus and simulation method |
| 04/24/2003 | US20030078680 Semiconductor run-to-run control system with missing and out-of-order measurement handling |
| 04/24/2003 | US20030078443 Preparing a polyalkylene oxide porogen by employing hydrosiylation or nucleophilic substitution or esterification or hydrogenolysis or carbonation |
| 04/24/2003 | US20030078174 Resist and etching by-product removing composition and resist removing method using the same |
| 04/24/2003 | US20030078173 Post chemical mechanical polishing cleaning formulation of an organic amine, a fluoride source and 70-98% water |
| 04/24/2003 | US20030077993 Flat-object holder and method of using the same |
| 04/24/2003 | US20030077989 Polishing system with air exhaust system |
| 04/24/2003 | US20030077988 Activated slurry CMP system and methods for implementing the same |
| 04/24/2003 | US20030077986 Front-reference carrier on orbital solid platen |
| 04/24/2003 | US20030077985 Boron-containing polishing system and method |
| 04/24/2003 | US20030077983 Cleaning polish etch composition and process for a superfinished surface of a substrate |
| 04/24/2003 | US20030077981 Composition and a method for defect reduction |
| 04/24/2003 | US20030077921 Carbon doped oxide deposition |
| 04/24/2003 | US20030077920 Method for fabricating a semiconductor device and a substrate processing apparatus |
| 04/24/2003 | US20030077919 Substrate processing apparatus and substrate processing method |
| 04/24/2003 | US20030077918 Simplified method to produce nanoporous silicon-based films |
| 04/24/2003 | US20030077917 Method of fabricating a void-free barrier layer |
| 04/24/2003 | US20030077916 Method of eliminating photoresist poisoning in damascene applications |
| 04/24/2003 | US20030077915 Method for forming an oxynitride layer |
| 04/24/2003 | US20030077913 Method of alloying a semiconductor device |
| 04/24/2003 | US20030077912 Semiconductor manufacturing apparatus and method |
| 04/24/2003 | US20030077911 Rom code mask with assistant features |
| 04/24/2003 | US20030077910 Etching of thin damage sensitive layers using high frequency pulsed plasma |
| 04/24/2003 | US20030077909 Etching method |
| 04/24/2003 | US20030077907 Method for forming an etch mask during the manufacture of a semiconductor device |
| 04/24/2003 | US20030077906 Manufacturing method of semiconductor device and apparatus thereof |
| 04/24/2003 | US20030077905 Novel post etching treatment process for high density oxide etcher |
| 04/24/2003 | US20030077904 Polishing method and polishing apparatus permitting control of polishing time at a high accuracy |
| 04/24/2003 | US20030077903 Copper post-etch cleaning process |
| 04/24/2003 | US20030077902 Copper post-etch cleaning process |
| 04/24/2003 | US20030077901 Method for forming a refractory-metal-silicide layer in a semiconductor device |
| 04/24/2003 | US20030077900 Low leakage and low resistance plugs for memory and the manufacturing method for the plugs |
| 04/24/2003 | US20030077899 Method for creating an intergrated circuit stage wherein fine and large patterns coexist |
| 04/24/2003 | US20030077898 Self-aligned fabrication method for a semiconductor device |
| 04/24/2003 | US20030077897 Method to solve via poisoning for porous low-k dielectric |
| 04/24/2003 | US20030077896 Method of manufacturing semiconductor integrated circuit device having insulating film formed from liquid substance containning polymer of silicon, oxygen, and hydrogen |
| 04/24/2003 | US20030077895 Diffusion barrier layer for semiconductor wafer fabrication |
| 04/24/2003 | US20030077894 Method for forming conductive wires of semiconductor device |
| 04/24/2003 | US20030077893 Interconnection structure with insulation comprising cavities |
| 04/24/2003 | US20030077892 Method for forming aerial metallic wiring on semiconductor substrate |
| 04/24/2003 | US20030077891 Interconnect line selectively isolated from an underlying contact plug |
| 04/24/2003 | US20030077890 Methods of forming conductive contacts |
| 04/24/2003 | US20030077889 Method for manufacturing a semiconductor device |
| 04/24/2003 | US20030077888 Reduced thickness variation in a material layer deposited in norrow and wide integrated circuit trenches |
| 04/24/2003 | US20030077887 Nonwoven fabrics formed of hollow filaments and/or hollow staple fibers and processes for producing the same. The hollow spunbonded filaments and hollow staple fibers are formed of a polypropylene composition. The resultant fabrics |
| 04/24/2003 | US20030077886 Semiconductor layer doping method, thin-film semiconductor device manufacturing method, and thin-film semiconductor device |
| 04/24/2003 | US20030077885 Embrittled substrate and method for making same |
| 04/24/2003 | US20030077884 Semiconductor device having a doped lattice matching layer and a method of manufacture therefor |
| 04/24/2003 | US20030077883 Deposition method, deposition apparatus, and semiconductor device |
| 04/24/2003 | US20030077882 Method of forming strained-silicon wafer for mobility-enhanced MOSFET device |
| 04/24/2003 | US20030077880 Method of making semiconductor device that has improved structural strength |
| 04/24/2003 | US20030077879 Method of manufacturing semiconductor device using heated conveyance member |
| 04/24/2003 | US20030077878 Method for dicing a semiconductor wafer |
| 04/24/2003 | US20030077877 Systems and methods for electrically isolating portions of wafers |
| 04/24/2003 | US20030077876 Method of anodically bonding a multilayer device with a free mass |
| 04/24/2003 | US20030077875 Method for multi-depth trench isolation |
| 04/24/2003 | US20030077874 Versatile system for chromium based diffusion barriers in electrode structures |
| 04/24/2003 | US20030077873 Memory cell, wafer, semiconductor component with memory cell and a method for fabricating an insulating collar for a memory |
| 04/24/2003 | US20030077872 Process flow for sacrificial collar with polysilicon void |