Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2003
04/17/2003US20030073272 Hetero-integration of dissimilar semiconductor materials
04/17/2003US20030073271 Method of forming a vertical field-effect transistor device
04/17/2003US20030073270 Method of fabricating SiC semiconductor device
04/17/2003US20030073269 Low voltage high performance semiconductor devices and methods
04/17/2003US20030073268 Semiconductor processing methods of forming integrated circuitry, forming conductive lines, forming a conductive grid, forming a conductive network, forming an electrical interconnection to a node location, forming an electrical interconnection with a transistor source/drain region, and integrated circuitry
04/17/2003US20030073267 Method for manufacturing a thin film transistor array panel for a liquid crystal display
04/17/2003US20030073266 Semiconductor device and a method of manufacturing the same
04/17/2003US20030073265 Semiconductor package with singulation crease
04/17/2003US20030073264 Method of manufacturing semiconductor device from semiconductor wafer having thick peripheral portion
04/17/2003US20030073263 Method of fabricating semiconductor device
04/17/2003US20030073260 Fabrication of a microchip-based electrospray device
04/17/2003US20030073259 Process of and apparatus for heat-treating II-VI compound semiconductors and semiconductor heat-treated by the process
04/17/2003US20030073258 Semiconductor device and method of manufacturing the same
04/17/2003US20030073257 Semiconductor device manufacturing method capable of reliable inspection for hole opening and semiconductor devices manufactured by the method
04/17/2003US20030073256 Semiconductor device, method of manufacturing semiconductor device, and system for evaluating electrical characteristics of semiconductor device
04/17/2003US20030073255 Novel self monitoring process for ultra thin gate oxidation
04/17/2003US20030073253 Magnetic memory and method of its manufacture
04/17/2003US20030073252 Method of forming ferroelectric random access memory device
04/17/2003US20030073251 Plate-through hard mask for MRAM devices
04/17/2003US20030073247 Method for monitoring dynamic particle pollution in an etching chamber
04/17/2003US20030073122 Detection of single nucleic acid polymorphisms; obtain target nucleotide sequences, code sequence electronically in presence of oligonucleotides, incubate and hybridize to probe, detect signal from probe
04/17/2003US20030073104 Nanoscaling ordering of hybrid materials using genetically engineered mesoscale virus
04/17/2003US20030073045 Exposure apparatus and method
04/17/2003US20030073042 Process and materials for formation of patterned films of functional materials
04/17/2003US20030073041 Partial photoresist etching
04/17/2003US20030073038 Fabrication method of semiconductor integrated circuit device and mask
04/17/2003US20030073036 Depositing an under bump metallurgy over semiconductor device onto contact pad; depositing and patterning a photoresist layer; depositing electrically conductive materials; removing photoresist; applying flux agent; heating, electroless plating
04/17/2003US20030073030 Polymers containing oxygen and sulfur alicyclic units and photoresist compositions comprising same
04/17/2003US20030073013 Generating diffraction pattern corresponding to lithographic pattern; determining which of spatial frequency components need to be captured by lens; illuminating high transmission attenuated phase-shift mask
04/17/2003US20030073010 Photomask inspecting method
04/17/2003US20030073009 Photomask for focus monitoring, method of focus monitoring, unit for focus monitoring and manufacturing method for a unit
04/17/2003US20030072975 Incorporation of nitrogen into high k dielectric film
04/17/2003US20030072953 Aceto acetonate and related compounds as adhesion promoters
04/17/2003US20030072947 Uniform pore distribution thus retain high rigidity thus are suitable for manufacturing of integrated circuits
04/17/2003US20030072928 Self-aligned corrosion stop for copper C4 and wirebond
04/17/2003US20030072913 Substrate strip with sides having flanges and recesses
04/17/2003US20030072888 Forming a wiring and a first insulating layer filled between the wirings on a substratum, immersing in fluid which can dissolve the first insulating layer, substituting, for the fluid, a raw material solution; filling insulating layer
04/17/2003US20030072886 Forming a liquid film on the substrate by dropping a liquid on a substrate from a dropping unit while rotating the substrate, moving the dropping unit in the radial direction from the inner periphery, adjusting the feed speed of the liquid
04/17/2003US20030072885 Fabrication method of metallic nanowires
04/17/2003US20030072884 Method of titanium and titanium nitride layer deposition
04/17/2003US20030072883 Enhancing the deposition of titanium containing materials on a substrate from a titanium containing precursor by the addition of organic amines to the titanium containing precursor
04/17/2003US20030072882 Method of depositing rare earth oxide thin films
04/17/2003US20030072880 Method of controlling the initial growth of CVD copper films by surface treatment of barrier metals films
04/17/2003US20030072703 Method for removing the harmful effects of organic halogen compound gas, apparatus for removing the harmful effects of organic halogen compound gas, system for fabricating semiconductor devices, and method for fabricating semiconductor devices
04/17/2003US20030072695 Method of removing oxidized portions at an interface of a metal surface and capping layer in a semiconductor metallization layer
04/17/2003US20030072645 Edge gripping pre-aligner
04/17/2003US20030072639 Substrate support
04/17/2003US20030072481 Method for evaluating anomalies in a semiconductor manufacturing process
04/17/2003US20030072274 Transmission power setting method, a mobile communications system, and a base station
04/17/2003US20030072201 Semiconductor memory device having bit line kicker
04/17/2003US20030072198 Storage cell field and method of producing the same
04/17/2003US20030072196 Method for manufacturing an integrated memory circuit and an integrated memory circuit
04/17/2003US20030072195 Semiconductor memory device and fabrication method
04/17/2003US20030072192 Programming of nonvolatile memory cells
04/17/2003US20030072191 Non-volatile semiconductor memory device
04/17/2003US20030072189 Semiconductor device preventing signal delay among wirings
04/17/2003US20030072185 Programmable logic device with redundant circuitry
04/17/2003US20030072173 Pattern layout of transfer transistors employed in row decoder
04/17/2003US20030072126 Decoupling capacitor for high frequency noise immunity
04/17/2003US20030072122 Method and apparatus for holding a substrate
04/17/2003US20030072081 Apparatus for substrate cleaning of liquid crystal display and method for substrate cleaning using it
04/17/2003US20030071986 Method for optimizing the image properties of at least two optical elements as well as methods for optimizing the image properties of at least three optical elements
04/17/2003US20030071980 Apparatus control system, apparatus control method, semiconductor exposure apparatus, semiconductor exposure apparatus control method and semiconductor device manufacturing method
04/17/2003US20030071979 Lithographic apparatus and device manufacturing method
04/17/2003US20030071953 Display device and method of fabricating the same
04/17/2003US20030071930 Active matrix type display
04/17/2003US20030071878 Method for manufacturing ferroelectric thin film device, ink jet recording head, and ink jet printer
04/17/2003US20030071803 Thin-film transistor circuit and a semiconductor display using the same
04/17/2003US20030071771 Current driving type emissive display apparatus, method for driving the same and method for producing the same
04/17/2003US20030071681 IC device having a transistor switch for a power supply
04/17/2003US20030071672 Clamp circuit for a semiconductor integrated circuit device
04/17/2003US20030071670 Semiconductor integrated circuit device
04/17/2003US20030071647 Method and arrangement for determining the high-frequency behavior of active circuit elements
04/17/2003US20030071646 Inspection method of semiconductor device and inspection system
04/17/2003US20030071631 A sample chuck for wafers
04/17/2003US20030071459 Siphon tube of connector adapted to be mounted on reservoir
04/17/2003US20030071395 Conformal-coated pick and place compatible devices
04/17/2003US20030071365 Electronic device fabrication method comprising twofold cutting of conductor member
04/17/2003US20030071364 Wiring pattern of semiconductor device
04/17/2003US20030071363 Semiconductor device
04/17/2003US20030071362 Assemblies including stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween, packages including the assemblies, and methods
04/17/2003US20030071360 Lossless microstrip line in CMOS process
04/17/2003US20030071359 Etch stop for copper damascene process
04/17/2003US20030071358 Low temperature nitride used as cu barrier layer
04/17/2003US20030071357 Integrated circuitry
04/17/2003US20030071356 First trench isolation material is deposited over the semiconductor substrate and to within the isolation trench, first trench isolation material is removed to form a line trench into a desired local interconnect configuration
04/17/2003US20030071355 Interconnect structures and a method of electroless introduction of interconnect structures
04/17/2003US20030071354 Wafer level chip scale package and method of fabricating the same
04/17/2003US20030071353 Semiconductor device
04/17/2003US20030071352 Method of fabricating resin-encapsulated semiconductor device
04/17/2003US20030071348 Semiconductor module and mounting method for same
04/17/2003US20030071347 Semiconductor chip packaging device and method of manufacturing the same
04/17/2003US20030071345 Die paddle clamping method for wire bond enhancement
04/17/2003US20030071344 Leadframe and method of manufacturing a semiconductor device using the same
04/17/2003US20030071343 Integrated circuit bus grid having wires with pre-selected variable widths
04/17/2003US20030071341 Apparatus and method for leadless packaging of semiconductor devices
04/17/2003US20030071340 Assemblies including stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween, packages including the assemblies, and methods
04/17/2003US20030071339 Semiconductor device with integrated circuit elements of group iii-v comprising means for preventing pollution by hyfrogen.
04/17/2003US20030071338 Apparatus and method for leadless packaging of semiconductor devices
04/17/2003US20030071336 Electronic component with at least one semiconductor chip and method for its manufacture
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