Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2003
04/29/2003US6555425 Method for manufacturing transistor
04/29/2003US6555424 Thin film transistor with sub-gates and schottky source/drain and a manufacturing method of the same
04/29/2003US6555423 Method of manufacturing a thin film transistor and a method of evaluating a polysilicon film
04/29/2003US6555422 Thin film transistor and method of manufacturing the same
04/29/2003US6555421 Method and apparatus for manufacturing semiconductor device
04/29/2003US6555420 Semiconductor device and process for producing semiconductor device
04/29/2003US6555419 Thin film transistor and manufacturing method of thin film transistor
04/29/2003US6555418 Method for separating a semiconductor element in a semiconductor element pushing-up device
04/29/2003US6555417 Method and device for protecting micro electromechanical system structures during dicing of a wafer
04/29/2003US6555416 Chip size package semiconductor device and method of forming the same
04/29/2003US6555415 Electronic configuration with flexible bonding pads
04/29/2003US6555414 Flip-chip assembly of semiconductor devices using adhesives
04/29/2003US6555411 Thin film transistors
04/29/2003US6555409 Method for fabricating a thin film transistor array substrate for liquid crystal display
04/29/2003US6555408 Methods for transferring elements from a template to a substrate
04/29/2003US6555407 Method for the controlled oxidiation of materials
04/29/2003US6555405 Method for forming a semiconductor device having a metal substrate
04/29/2003US6555401 Method of controlling bond process quality by measuring wire bond features
04/29/2003US6555398 Software programmable multiple function integrated circuit module
04/29/2003US6555397 Dry isotropic removal of inorganic anti-reflective coating after poly gate etching
04/29/2003US6555396 Method and apparatus for enhancing endpoint detection of a via etch
04/29/2003US6555394 Methods of fabricating capacitors including Ta2O5 layers in a chamber including changing a Ta2O5 layer to heater separation or chamber pressure
04/29/2003US6555298 Method and apparatus for uniformly baking substrates such as photomasks
04/29/2003US6555296 Providing wafer that has contact pads exposed by a passivation layer formed on surface of wafer; forming a first mask film having a openings; filling solder material in openings; reflowing solder material into solder posts
04/29/2003US6555289 Positive photoresist composition
04/29/2003US6555276 Substrate coating and semiconductor processing method of improving uniformity of liquid deposition
04/29/2003US6555275 Using two stage exposure; resolution
04/29/2003US6555260 Fuel cell system having a fuel cell stack with integrated polarity reversal protection diode
04/29/2003US6555221 Method for forming an ultra microparticle-structure
04/29/2003US6555204 Method of preventing bridging between polycrystalline micro-scale features
04/29/2003US6555194 Process for producing low defect density, ideal oxygen precipitating silicon
04/29/2003US6555183 Plasma treatment of a titanium nitride film formed by chemical vapor deposition
04/29/2003US6555171 Contact displacement technique is used to form a seed layer of copper, tin and palladium (Cu/Sn/Pd) on the diffusion barrier layer, copper is electrolessly deposited autocatalytically on the activated barrier layer; void-free copper deposition
04/29/2003US6555164 Shadow ring and guide for supporting the shadow ring in a chamber
04/29/2003US6555158 Removing organic material from a plating region, surface hydrophilizing the plating region, bonding a coupling agent to the surface, bonding catalytic metal with the coupling agent, exposing said metal and electrolessly plating
04/29/2003US6555052 Electron device and semiconductor device
04/29/2003US6555022 Oxygen-containing, such as metal oxides, silicates, borates or titanates, small particle size, narrow particle size distribution; displays
04/29/2003US6555017 Surface contouring by controlled application of processing fluid using Marangoni effect
04/29/2003US6554954 Conductive collar surrounding semiconductor workpiece in plasma chamber
04/29/2003US6554953 Thin film electrostatic shield for inductive plasma processing
04/29/2003US6554952 Method and apparatus for etching a gold metal layer using a titanium hardmask
04/29/2003US6554950 Method and apparatus for removal of surface contaminants from substrates in vacuum applications
04/29/2003US6554949 Wafer demount receptable for separation of thinned wafer from mounting carrier
04/29/2003US6554912 A cleaning formulation for the removal of polymeric material from a substrate comprising one or more polyol compounds selected from alkanediols, triols and substituted alkentriols, glycol ethers; water and a fluoride salt
04/29/2003US6554907 Susceptor with internal support
04/29/2003US6554906 Wafer holder for semiconductor manufacturing apparatus and semiconductor manufacturing apparatus using the same
04/29/2003US6554905 Rotating semiconductor processing apparatus
04/29/2003US6554896 Epitaxial growth substrate and a method for producing the same
04/29/2003US6554879 Trap apparatus
04/29/2003US6554687 Precise crystallographic-orientation alignment mark for a semiconductor wafer
04/29/2003US6554686 Sawing wire and method for the cutting and lapping of hard brittle workpieces
04/29/2003US6554598 Mold assembly for encapsulating semiconductor device
04/29/2003US6554560 Method for aligning wafers in a cassette
04/29/2003US6554507 Pattern formation method and apparatus
04/29/2003US6554467 Process and apparatus for blending and distributing a slurry solution
04/29/2003US6554205 Gas polishing method, gas polishing nozzle and polishing apparatus
04/29/2003US6554128 Die shuttle conveyor and nest therefor
04/29/2003US6554046 Substrate cleaving tool and method
04/29/2003US6554010 Substrate cleaning tool, having permeable cleaning head
04/29/2003US6554004 Method for removing etch residue resulting from a process for forming a via
04/29/2003US6554003 Method and apparatus for cleaning a thin disc
04/29/2003US6554002 Dual damascene with a copper conductor with a cap layer formed on it, and a low dielectric constant layer formed by spin-on polymer method is cleaned after etching by plasma sputtering or baking
04/29/2003US6553932 Reduction of plasma edge effect on plasma enhanced CVD processes
04/29/2003US6553850 Method and arrangement for transporting and inspecting semiconductor substrates
04/29/2003US6553811 Trap apparatus
04/29/2003US6553792 Resist stripping method and apparatus
04/29/2003US6553660 Electronic device and a method of manufacturing the same
04/29/2003US6553658 Assembling a stacked die package
04/29/2003US6553657 Joining electronic chips to electrodes by forming solder paste layers and screen printing or melting in furnaces, then encapsulating in seals to supress defects
04/29/2003US6553644 Fixture, carrier ring, and method for processing delicate workpieces
04/29/2003CA2228571C Wafer processing apparatus, wafer processing method, and soi wafer fabrication method
04/24/2003WO2003034590A1 Semiconductor circuit, especially for ignition purposes, and the use of the same
04/24/2003WO2003034560A1 Method for fabricating semiconductor light emitting element, semiconductor light emitting element, method for fabricating semiconductor element, semiconductor element, method for fabricating element and element
04/24/2003WO2003034508A1 Light emitting device and method for manufacture thereof
04/24/2003WO2003034504A1 Combined etching and doping substances
04/24/2003WO2003034503A1 A thin film transistor using polysilicon and a method for manufacturing the same
04/24/2003WO2003034502A1 Thin film transistor device and method of manufacturing same
04/24/2003WO2003034501A2 Mos devices and corresponding manufacturing methods and circuits
04/24/2003WO2003034500A2 Trench-gate semiconductor devices and their manufacture
04/24/2003WO2003034499A2 Semiconductor structure having compensated resistance in the ldd region, and method for producing the same
04/24/2003WO2003034498A1 Stacked switchable element and diode combination
04/24/2003WO2003034497A1 Integrated circuit bus grid having wires with pre-selected variable widths
04/24/2003WO2003034496A1 Information recorder and electronic apparatus with mounted information recorder
04/24/2003WO2003034495A2 Method for packing electronic modules and multiple chip packaging
04/24/2003WO2003034494A1 Module component
04/24/2003WO2003034492A2 Apparatus and methods for semiconductor ic failure detection
04/24/2003WO2003034491A2 Semiconductor component
04/24/2003WO2003034490A2 Semiconductor structure with one or more through-holes
04/24/2003WO2003034487A1 Semiconductor device and printed substrate used for the semiconductor device
04/24/2003WO2003034485A2 Multilevel poly-si tiling for semiconductor circuit manufacture
04/24/2003WO2003034484A2 A method for forming a layered semiconductor structure and corresponding structure
04/24/2003WO2003034483A1 Treatment subject elevating mechanism, and treating device using the same
04/24/2003WO2003034481A1 Selective tungsten stud as copper diffusion barrier to silicon contact
04/24/2003WO2003034480A1 Low energy ion implantation into sige
04/24/2003WO2003034479A1 Substrate processing apparatus
04/24/2003WO2003034478A2 Apparatus and method for electro chemical plating using backside electrical contacts
04/24/2003WO2003034477A1 Method and apparatus for chemical vapor ddeposition capable of preventing contamination and enhancing film growth rate
04/24/2003WO2003034476A1 Pattern drawing method, mask, and mask manufacturing method
04/24/2003WO2003034474A1 Semiconductor manufacturing apparatus and method for manufacturing semiconductor device
04/24/2003WO2003034473A2 Substrate support