Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2003
04/17/2003US20030071335 Apparatus and method for leadless packaging of semiconductor devices
04/17/2003US20030071333 Leadframe, method of manufacturing the same, and method of manufacturing a semiconductor device using the same
04/17/2003US20030071331 Semiconductor device and structure for mounting the same
04/17/2003US20030071330 Strength and durability of a spring structure is increased by providing a stress-balancing pad formed on the unlifted anchor portion of the spring metal finger
04/17/2003US20030071329 Wafer integrated rigid support ring
04/17/2003US20030071327 Method and apparatus utilizing monocrystalline insulator
04/17/2003US20030071326 High performance system-on-chip using post passivation process
04/17/2003US20030071325 Method of making an integrated circuit inductor
04/17/2003US20030071322 Apparatus for controlling a high voltage circuit using a low voltage circuit
04/17/2003US20030071321 Semiconductor device having trench isolation structure and method of forming same
04/17/2003US20030071320 Lateral device with improved conductivity and blocking control
04/17/2003US20030071317 Semiconductor device and manufactruing method therefor
04/17/2003US20030071316 Method to chemically remove metal impurities from polycide gate sidewalls
04/17/2003US20030071315 Reprogrammable non-volatile memory using a breakdown phenomena in an ultra-thin dielectric
04/17/2003US20030071314 MOS transistor and fabrication method thereof
04/17/2003US20030071313 Metal layers embedded into the contact holes of various kinds in shape are used as the lines for controlling the substrate bias
04/17/2003US20030071312 Thin film semiconductor device having a gate electrode insulator formed through high-heat oxidization
04/17/2003US20030071311 Semiconductor integrated circuit device
04/17/2003US20030071310 Shallow buried region of higher resistivity than the first resistivity, extending between the isolation trenches and created by a compensated doping; electrostatic discharging (esd) and metal oxide semiconductor (mos)
04/17/2003US20030071309 Electro-optical apparatus, driving substrate for an electro-optical apparatus and method of manufacturing them
04/17/2003US20030071308 Semiconductor device and method of fabricating the same
04/17/2003US20030071307 High performance poly-SiGe thin film transistor and a method of fabricating such a thin film transistor
04/17/2003US20030071306 Field oxide is grown across the integrated circuit patterned and etched to form an opening with vertical sidewalls exposing a portion of an upper surface of a substrate underlying the field oxide
04/17/2003US20030071304 Method of forming flash memory having pre-interpoly dielectric treatment layer
04/17/2003US20030071303 Designing method for a semiconductor display device, manufacturing method for the semiconductor display device, semiconductor display device, and order receiving system for the semiconductor display device using the designing method
04/17/2003US20030071302 Multi-level type nonvolatile semiconductor memory device
04/17/2003US20030071300 Tunable thin film capacitor
04/17/2003US20030071299 Semiconductor memory device and method of producing same
04/17/2003US20030071298 Non-volatile semiconductor memory device
04/17/2003US20030071297 Nonvolatile semiconductor memory device having a capacitive element for use in a charge pump
04/17/2003US20030071296 Reprogrammable non-volatile memory using a breakdown phenomena in an ultra-thin dielectric
04/17/2003US20030071294 Bottom electrode layer with a dielectric layer disposed on the bottom of it, a top electrode layer disposed on the dielectric layer and a conductive hardmask layer disposed on the top electrode layer
04/17/2003US20030071293 Semiconductor memory device and manufacturing process for the same
04/17/2003US20030071292 Method of making a self-aligned ferroelectric memory transistor
04/17/2003US20030071291 Integrated circuit with a MOS structure having reduced parasitic bipolar transistor action
04/17/2003US20030071290 Liner composed of a high dielectric (high-K) material having a relative permittivity of > 10 is formed adjacent the sidewalls of a gate
04/17/2003US20030071288 Two-bit split-gate non-volatile memory transistor
04/17/2003US20030071287 Scratch resistance improvement by filling metal gaps
04/17/2003US20030071283 Semiconductor structure with one or more through-holes
04/17/2003US20030071282 Contact resistances in integrated circuits
04/17/2003US20030071281 Silicon-germanium hetero bipolar transistor withT-shaped implantation layer between emitter and emitter contact area
04/17/2003US20030071280 Method of fabricating seal-ring structure with ESD protection
04/17/2003US20030071279 Semiconductor device including a plurality of kinds of MOS transistors and method of manufacturing the same
04/17/2003US20030071278 Silicon germanium hetero bipolar transistor
04/17/2003US20030071277 Silicon germanium hetero bipolar transistor having a germanium concentration profile in the base layer
04/17/2003US20030071276 Epitaxial growth of nitride semiconductor device
04/17/2003US20030071274 Light-emitting thyristor matrix array and driver circuit
04/17/2003US20030071272 Topside active optical device apparatus and method
04/17/2003US20030071265 Quantum well intermixing in InGaAsP structures induced by low temperature grown InP
04/17/2003US20030071264 Method and apparatus for bonding substrates
04/17/2003US20030071263 Semiconductor device having dummy patterns for metal CMP
04/17/2003US20030071260 Susceptor with built-in electrode and manufacturing method therefor
04/17/2003US20030071236 Method of deforming a pattern and semiconductor device formed by utilizing deformed pattern
04/17/2003US20030071231 Electron beam exposing method and exposure apparatus
04/17/2003US20030071230 Electron beam apparatus and electron beam adjusting method
04/17/2003US20030071214 Method and scanning electron microscope for measuring width of material on sample
04/17/2003US20030071213 Fine pattern inspection apparatus, managing apparatus of CD-SEM device, fine pattern inspection method, managing method of CD-SEM device and program
04/17/2003US20030071198 Method and apparatus for preventing transfer of an object having wrong dimensions or orientation
04/17/2003US20030071129 Module card and a method for manufacturing the same
04/17/2003US20030071109 Mounting apparatus of electronic components and method of mounting electronic components
04/17/2003US20030071106 Precision bond head for mounting semiconductor chips
04/17/2003US20030071032 Heating system
04/17/2003US20030071029 Vacuum oven, sysem incorporating the same and method of using the same
04/17/2003US20030071018 Method for correcting characteristics of attenuated phase-shift mask
04/17/2003US20030071017 Alarm apparatus for exchanging lamps of wafer etching equipment and method therefor
04/17/2003US20030071016 Patterned structure reproduction using nonsticking mold
04/17/2003US20030071010 Inhibiting adsorption of sodium to integrated circuit surfaces during photoresist removal or post-metal etch cleanup with a solvent mixture of 1,2-diaminocyclohexanetetra carboxylic acid, a nucleophilic amine, and a weak acid
04/17/2003US20030071009 Wafer thinning techniques
04/17/2003US20030070960 Wafer cassette equipped with piezoelectric sensors
04/17/2003US20030070930 Device providing electrical contact to the surface of a semiconductor workpiece during metal plating and method of providing such contact
04/17/2003US20030070915 Self-centering a wafer on a wafer pedestal in a sputtering chamber by using a modified wafer lifter equipped with atleast four support fingers
04/17/2003US20030070761 RF plasma reactor
04/17/2003US20030070759 Plasma processing method and apparatus
04/17/2003US20030070758 High temperature drop-off of a substrate
04/17/2003US20030070756 Wafer carrier used for chemical mechanic polishing
04/17/2003US20030070755 Capillary ring
04/17/2003US20030070695 Shield used in an edge bead removal process that prevents an edge bead removal solution from splashing onto the production surface
04/17/2003US20030070690 Method for treating an object using ultra-violet light
04/17/2003US20030070620 Tunable multi-zone gas injection system
04/17/2003US20030070619 In situ wafer heat for reduced backside contamination
04/17/2003US20030070616 Comprising tetraalkylammonium F(HF)x salts and a nitrile solvent, wherein alkyl groups are of 1-4 carbon atoms; useful in short term, high energy applications such as electric vehicles or cellular communication
04/17/2003US20030070610 Method and device for producing group III-N, group III-V-N and metal-nitrogen component structures on Si substrates
04/17/2003US20030070607 Method for producing group III nitride compound semiconductor
04/17/2003US20030070520 Cutting machine
04/17/2003US20030070517 Method and apparatus for peeling protective sheet
04/17/2003US20030070479 Wind tunnel and collector configuration therefor
04/17/2003US20030070316 Wafer pedestal tilt mechanism and cooling system
04/17/2003US20030070290 Methods of bonding solder balls to bond pads on a substrate, and bonding frames
04/17/2003US20030070247 Chamber cleaning mechanism
04/17/2003US20030070242 Scrubbing assembly for wafer-cleaning device
04/17/2003DE20300336U1 Plastic film for integrated circuit boards comprises vertical metal wires which connect an integrated circuit to a conductor plate via soldered joints
04/17/2003DE10149736C1 Etching of metal layer systems used in the production of strip conductors comprises switching between etching of an upper aluminum-containing layer and etching of a lower as soon as an intermediate layer has been reached
04/17/2003DE10147929C1 Verfahren zum Herstellen einer Halbleiterstruktur und Verwendung des Verfahrens A method of fabricating a semiconductor structure and use of the method
04/17/2003DE10122213C1 Electrode and/or conductor track used for components of OFETs and OLEDs is produced by treating an organic functional polymer with a chemical compound
04/17/2003CA2463528A1 Plasma production device and method and rf driver circuit
04/17/2003CA2462590A1 A process for large-scale production of cdte/cds thin film solar cells
04/17/2003CA2462347A1 Patterned structure reproduction using nonsticking mold
04/17/2003CA2454269A1 Insulating gate algan/gan hemt
04/16/2003EP1303167A1 Ceramic substrate and its production method
04/16/2003EP1303045A2 Programmable logic device with redundant circuitry
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