Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2003
04/22/2003US6551764 Exposing a resist layer of a polymer material that has at least one saturated alicycle substitited with fluorine atoms to vacuum ultraviolet rays for patterning into a predetermined shape
04/22/2003US6551758 For use in microfabrication of integrated circuits
04/22/2003US6551755 Positive photoresist composition
04/22/2003US6551749 Developer and method for forming resist pattern and photomask produced by use thereof
04/22/2003US6551717 Process for fabricating organic circuits
04/22/2003US6551676 Silicone-based adhesive sheet method for manufacturing same and semiconductor device
04/22/2003US6551665 Flowing a mixture of a diamagnetic ozone or hydrogen peroxide and diatomic oxygen over the silicate glass; tetraethoxysilane (teos)
04/22/2003US6551650 Dip formation of flip-chip solder bumps
04/22/2003US6551488 Segmenting of processing system into wet and dry areas
04/22/2003US6551487 Wafer is loaded and/or unloaded from an electroplating apparatus in a horizontal orientation relative to the surface of the plating bath
04/22/2003US6551484 Connecting an electric source between an anode immersed in an electrolyte solution and a seed layer formed on the substrate
04/22/2003US6551483 Mitigate corrosion of a metal seed layer on recessed features by contacting the seed layer with an electrolyte solution
04/22/2003US6551471 Ionization film-forming method and apparatus
04/22/2003US6551448 Heat processing apparatus of substrate
04/22/2003US6551447 Inductive plasma reactor
04/22/2003US6551445 Plasma processing system and method for manufacturing a semiconductor device by using the same
04/22/2003US6551444 Plasma processing apparatus and method of processing
04/22/2003US6551442 Method of producing semiconductor device and system for producing the same
04/22/2003US6551427 Method for manufacturing ceramic substrate and non-fired ceramic substrate
04/22/2003US6551412 Wet bench tanks in semiconductor industry are utilized in photoresist stripping, silicon nitride, silicon dioxide removal and wet etching; no recycle tubes are utilized for recycling the fluid/chemical solvent, wide area filters used
04/22/2003US6551409 Holding the substrate containing organic contaminants in a tank, filling the tank with water vapors and ozone gas mixture, contacting the side of the substrate with contaminants with above gas mixture to remove the organic
04/22/2003US6551408 Removal deposits with air vibration
04/22/2003US6551404 Apparatus for treating a wafer
04/22/2003US6551403 Solvent pre-wet system for wafers
04/22/2003US6551399 Fully integrated process for MIM capacitors using atomic layer deposition
04/22/2003US6551398 Heat treatment method for a silicon monocrystal wafer and a silicon monocrystal wafer
04/22/2003US6551387 Gas separation apparatus
04/22/2003US6551176 Pad conditioning disk
04/22/2003US6551175 Polishing composition
04/22/2003US6551049 Device for controlling the drive of mechanisms operating separately from one another
04/22/2003US6551048 Off-load system for semiconductor devices
04/22/2003US6551045 Wafer stage chamber
04/22/2003US6551044 Bellows isolation for index platforms
04/22/2003US6550990 Holder for keeping the substrate horizontal, and a chemical solution discharge/suction mechanism that simultaneously supplies fresh solution to the mechanism as it suctions the chemical solution; developing exposed photoresist coatings
04/22/2003US6550988 Substrate processing apparatus
04/22/2003US6550893 Semiconductor chip for an ink jet printhead and method for making same
04/22/2003US6550666 Method for forming a flip chip on leadframe semiconductor package
04/22/2003US6550665 Method for electrically interconnecting large contact arrays using eutectic alloy bumping
04/22/2003US6550619 Shock resistant variable load tolerant wafer shipper
04/22/2003US6550484 Apparatus for maintaining wafer back side and edge exclusion during supercritical fluid processing
04/22/2003US6550364 Wire sawing device
04/22/2003US6550277 Quartz glass body for optical component and process for manufacture thereof
04/22/2003US6550158 Substrate handling chamber
04/22/2003US6550136 Method of fabricating printed wiring board
04/22/2003US6550126 Method for mounting electrode assembly
04/22/2003US6550091 Double-sided wafer edge scrubbing apparatus and method for using the same
04/17/2003WO2003032700A1 Method for manufacturing wiring board
04/17/2003WO2003032695A1 Electrical circuit and method of formation
04/17/2003WO2003032492A2 A reconfigurable integrated circuit with a scalable architecture
04/17/2003WO2003032484A1 Method for encapsulating an electrical component and surface wave component thus encapsulated
04/17/2003WO2003032434A1 Plasma production device and method and rf driver circuit
04/17/2003WO2003032431A2 Switch circuit and method of switching radio frequency signals
04/17/2003WO2003032406A2 A process for large-scale production of cdte/cds thin film solar cells
04/17/2003WO2003032401A1 Semiconductor device and its manufacturing method
04/17/2003WO2003032400A1 Semiconductor device formed with disposable spacer and liner using high-k material and method of fabrication
04/17/2003WO2003032399A1 Semiconductor device fabricated on surface of silicon having <110> direction of crystal plane and its production method
04/17/2003WO2003032398A2 Field effect transistor having periodically doped channel
04/17/2003WO2003032397A2 INSULTING GATE AlGaN/GaN HEMT
04/17/2003WO2003032396A1 Stacked nmos device biasing on mos integrated circuits and methods therefor
04/17/2003WO2003032395A1 Solid-state imaging device and method for manufacturing solid-sate imaging device
04/17/2003WO2003032393A2 Double densed core gates in sonos flash memory
04/17/2003WO2003032387A1 Electrical or electronic component and method of producing same
04/17/2003WO2003032384A1 Method for making thin layers containing microcomponents
04/17/2003WO2003032383A2 Method for making a thin layer comprising all or part of component(s) and/or of circuit(s)
04/17/2003WO2003032382A2 Method for evaluating anomalies in a semiconductor manufacturing process
04/17/2003WO2003032380A1 Device and method for processing substrate
04/17/2003WO2003032379A1 Polishing pad for cmp, method for polishing substrate using it and method for producing polishing pad for cmp
04/17/2003WO2003032378A1 Method for production of a gate structure for a mos transistor
04/17/2003WO2003032377A1 Method for joining a silicon plate to another plate
04/17/2003WO2003032376A1 Method for producing an integrated circuit comprising a conductive structure arranged on a dielectric
04/17/2003WO2003032375A2 System and method for process monitoring of polysilicon etch
04/17/2003WO2003032374A2 Workpiece carrier with adjustable pressure zones and barriers
04/17/2003WO2003032373A2 Semiconductor device identification apparatus
04/17/2003WO2003032370A2 Stacked packages
04/17/2003WO2003032369A2 Correction of overlay offset between inspection layers
04/17/2003WO2003032367A2 Fabrication of an electrically conductive silicon carbide article
04/17/2003WO2003032366A2 Metal-insulator-metal (mim) capacitor structure and methods of fabricating same
04/17/2003WO2003032351A2 Method and device for aligning a charged particle beam column
04/17/2003WO2003032338A1 Spin-valve magnetoresistive device with enhanced performance
04/17/2003WO2003032329A1 Optical element and method for its manufacture as well as lightography apparatus and method for manufacturing a semiconductor device
04/17/2003WO2003032323A1 Ferrodielectric non-volatile semiconductor memory
04/17/2003WO2003032092A1 Planarizing recess etch
04/17/2003WO2003032085A2 Determination of center of focus by cross-section analysis
04/17/2003WO2003032084A2 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
04/17/2003WO2003032082A1 Method and apparatus for mechanically masking a workpiece
04/17/2003WO2003031912A2 Tuning fork gyroscope
04/17/2003WO2003031680A1 Methods for the production of components and ultra high vacuum cvd reactor
04/17/2003WO2003031679A2 Method for depositing metal layers employing sequential deposition techniques
04/17/2003WO2003031678A1 Apparatus and method for evenly flowing processing gas onto a semiconductor wafer
04/17/2003WO2003031677A1 Method and device for depositing a plurality of layers on a substrate
04/17/2003WO2003031676A1 Method for making carbon doped oxide film
04/17/2003WO2003031674A1 Method of depositing a material layer
04/17/2003WO2003031673A1 Thin metal oxide film and process for producing the same
04/17/2003WO2003031528A1 Adhesive sheet of cross-linked silicone, method of manufacturing thereof, and device_comprising the sheet
04/17/2003WO2003031527A1 Phospono compound-containing polishing composition and method of using same
04/17/2003WO2003031333A2 Divalent metal oxide doped aluminium oxide, produced by flame hydrolysis and aqueous dispersions thereof
04/17/2003WO2003031322A1 Method for preparing cobalt-protein complex
04/17/2003WO2003031193A1 Method of manufacturing an electronic component and electronic component obtained by means of said method
04/17/2003WO2003031101A1 Highly filled composites of powdered fillers and polymer matrix
04/17/2003WO2003031096A2 Patterned structure reproduction using nonsticking mold