Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2003
04/23/2003EP1303874A2 Feedback control of strip time to reduce post strip critical dimension variation in a transistor gate electrode
04/23/2003EP1303873A1 Thin film transistors and their manufacture
04/23/2003EP1303872A1 High frequency transistor device with antimony implantation and fabrication method thereof
04/23/2003EP1303871A2 Method for etching trenches for the fabrication of semiconductor devices
04/23/2003EP1303870A2 High pressure processing chamber for semiconductor substrate
04/23/2003EP1303869A2 Heated substrate support assembly and method
04/23/2003EP1303866A2 System and method for improving thin films by gas cluster ion be am processing
04/23/2003EP1303794A2 Method for an improved developing process in wafer photolithography
04/23/2003EP1303793A2 Method and system of automatic fluid dispensing for imprint lithography processes
04/23/2003EP1303792A2 High-resolution overlay alignement methods and systems for imprint lithography
04/23/2003EP1303789A1 T-butyl cinnamate polymers and their use in photoresist compositions
04/23/2003EP1303764A2 Hierarchical design and test method and system, program product embodying the method and integrated circuit produced thereby
04/23/2003EP1303736A2 Systems and methods for quantifying nonlinearities in interferometry systems
04/23/2003EP1303729A2 Reticle storage and retrieval system
04/23/2003EP1303575A1 Liquid crystal polymers for flexible circuits
04/23/2003EP1303449A1 Dual degas/cool loadlock cluster tool
04/23/2003EP1303381A2 Grooved polishing pads and methods of use
04/23/2003EP1303379A2 Multi-chamber carrier head with a flexible membrane
04/23/2003EP1303377A1 Laser cutting of semiconductor materials
04/23/2003EP1192592B1 Device and method for making devices comprising at least a chip fixed on a support
04/23/2003EP1144712A4 Multiple-thickness gate oxide formed by oxygen implantation
04/23/2003EP1138070B1 Low alpha emissive solder bumps
04/23/2003EP1103051B1 Ferroelectric storage assembly
04/23/2003EP1076500A4 Tiltable z-axis platform based on uni-directional tilt platform
04/23/2003EP1044471B1 Polygon representation in an integrated circuit layout
04/23/2003EP1044113A4 Plasma discharge device and method with dynamic tuning
04/23/2003EP1044055A4 Throughflow gas storage and dispensing system
04/23/2003EP1042528B1 Method for deposition of ferroelectric thin films
04/23/2003EP1019958B1 Method for making a groove structure in a silicon substrate
04/23/2003EP0971397B1 Method and device for activating semiconductor impurities
04/23/2003EP0950082B1 Reducing void formation in curable adhesive formulations
04/23/2003EP0931355B1 Semiconductor device with a protected barrier for a stack cell
04/23/2003EP0895652B1 Method and apparatus for run-time correction of proximity effects in pattern generation
04/23/2003EP0883891B1 Method of operating a particle-optical apparatus
04/23/2003EP0864184B1 Device with circuit element and transmission line
04/23/2003EP0792518B1 Method for fabricating a self-limiting silicon based interconnect for testing bare semiconductor dice
04/23/2003EP0789935B1 Heterojunction energy gradient structure
04/23/2003EP0768532B1 Acceleration sensor and method for producing the same, and shock detecting device using the same
04/23/2003EP0740854B1 A self-aligned dual-bit split gate (dsg) flash eeprom cell
04/23/2003CN2547007Y Non-volatile random storage with carbon nano-tube structure
04/23/2003CN2547001Y Turnover patric type encapsulation press
04/23/2003CN1413362A Vertical geometry InGaN light-emitting diode
04/23/2003CN1413361A Device and method for tempering at least one process good
04/23/2003CN1413359A Method and apparatus for detecting endpoint of photoresist stripping
04/23/2003CN1413358A Method for producing group III nitride compound semiconductor and group III nitride compound semiconductor device
04/23/2003CN1413357A Method for producing group III nitride compound semiconductor and group III nitride compound semiconductor device
04/23/2003CN1413352A Method for production of regular multi-layer construction, in particular for electrical double layer capacitors and corresponding device
04/23/2003CN1413317A Thinner for rinsing photoresist and method of treating photoresist layer
04/23/2003CN1413042A Transmitting power installing method, mobile communication system and base station
04/23/2003CN1412900A Laser diode of semiconductor and mfg. method thereof
04/23/2003CN1412863A Method for modifying magnetic tunnel junction conversion characteristics
04/23/2003CN1412859A Semiconductor film, semiconductor device and mfg. method
04/23/2003CN1412853A Non-volatile semiconductor storage
04/23/2003CN1412851A Flash memory body with channel source wire and its making method
04/23/2003CN1412850A Three-D integrated memory
04/23/2003CN1412849A Semiconductor
04/23/2003CN1412848A Semiconductor device and its mfg. method
04/23/2003CN1412847A Single transistor type magnetic random access memory and its operating and mfg. method
04/23/2003CN1412845A Semiconductor device and its mfg. method
04/23/2003CN1412844A Semiconductor integrated circuit device and its manufacturing method
04/23/2003CN1412843A Lead frame, its manufacturing method and manufacturing method of semiconductor device using lead frame
04/23/2003CN1412842A Lead frame and method for manufacturing semiconductor device using said lead frame
04/23/2003CN1412841A Lead frame and method for manufacturing said lead frame
04/23/2003CN1412837A 电子元件 Electronic component
04/23/2003CN1412835A Method for mfg. semiconductor device
04/23/2003CN1412834A Method for manufacturing semiconductor and semiconductor device
04/23/2003CN1412833A Method for manufacturing semiconductor
04/23/2003CN1412832A Method for making DNA logic integrated circuit
04/23/2003CN1412831A Board supporting parts and using method
04/23/2003CN1412830A Semiconductor substrate jig and method for manufacturing semiconductor device
04/23/2003CN1412828A Bare chip mounting method and mounting system
04/23/2003CN1412827A Semiconductor heat treatment process and equipment, and semiconductor by said process heat treatment
04/23/2003CN1412826A Technological process for making double diffusion drain high-voltage device
04/23/2003CN1412825A Method for forming metal silicide
04/23/2003CN1412824A Methd for mfg. semiconductor integrated circuit device
04/23/2003CN1412823A Polishing method and device capable of high precision controlling polishing time
04/23/2003CN1412822A Method for mfg. semiconductor with improved structure intensity
04/23/2003CN1412821A Method for forming through-hole or depression on silicon chip
04/23/2003CN1412820A Method for recovering ion injection doping dose monitoring sheet
04/23/2003CN1412819A Application of metal cover in IC preparation process
04/23/2003CN1412818A Application of ceramic cover in IC preparation process
04/23/2003CN1412786A Method for making semiconductor packaging conductor and its product
04/23/2003CN1412735A Film transistor array panel with visual checking device and its checking method
04/23/2003CN1412622A Equipment management system and method, semiconductor exposure apparatus and management method, method for mfg. semiconductor
04/23/2003CN1412621A Optical recorder and recording method thereof
04/23/2003CN1412620A Optical mask for focus monitor, monitoring method and device, and its manufacturing method
04/23/2003CN1412619A Chemical enlarging positive photoetching glue composition
04/23/2003CN1412607A Semiconductor display equipment and design method mfg. method and order form receiving system
04/23/2003CN1411963A Cutter
04/23/2003CN1411926A High property bender capable of reducing energy diffusion
04/23/2003CN1411920A Negative pressure plasma device and cleaning method
04/23/2003CN1411918A 针清洗系统 Needle cleaning system
04/23/2003CN1106696C Semiconductor device provided with organic semiconductor material
04/23/2003CN1106695C Semiconductor device and its production technology
04/23/2003CN1106694C 半导体器件 Semiconductor devices
04/23/2003CN1106693C Circuit and method for adjusting circuit element value in semiconductor integrated circuit
04/23/2003CN1106689C Semiconductor package lead deflash method
04/23/2003CN1106688C Interconnection structure for integrated circuit and forming method thereof
04/23/2003CN1106687C Charged particle beam exposure method and method for making patterns on wafer
04/23/2003CN1106686C Semiconductor device and manufacturing process thereof